loadpatents
name:-0.018607139587402
name:-0.080505847930908
name:-0.010931968688965
Xue; Hongyong Patent Filings

Xue; Hongyong

Patent Applications and Registrations

Patent applications and USPTO patent grants for Xue; Hongyong.The latest application filed is for "dmos fet chip scale package and method of making the same".

Company Profile
10.14.15
  • Xue; Hongyong - Portland OR
  • Xue; Hongyong - Hillsboro CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Dmos Fet Chip Scale Package And Method Of Making The Same
App 20220278009 - Xue; Yan Xun ;   et al.
2022-09-01
Semiconductor Device Incorporating Epitaxial Layer Field Stop Zone
App 20210273046 - Zhang; Lei ;   et al.
2021-09-02
Semiconductor device incorporating epitaxial layer field stop zone
Grant 11,031,465 - Zhang , et al. June 8, 2
2021-06-08
Method for precisely aligning backside pattern to frontside pattern of a semiconductor wafer
Grant 10,833,021 - Zhang , et al. November 10, 2
2020-11-10
Semiconductor device having one or more titanium interlayers and method of making the same
Grant 10,763,125 - He , et al. Sep
2020-09-01
Reverse conducting IGBT incorporating epitaxial layer field stop zone
Grant 10,686,038 - Xue , et al.
2020-06-16
Self-aligned contact for trench power MOSFET
Grant 10,644,118 - Xue , et al.
2020-05-05
Semiconductor Device Having One Or More Titanium Interlayers And Method Of Making The Same
App 20190385863 - He; Wei ;   et al.
2019-12-19
Semiconductor device having one or more titanium interlayers and method of making the same
Grant 10,438,813 - He , et al. O
2019-10-08
Power device with high aspect ratio trench contacts and submicron pitches between trenches
Grant 10,424,654 - Li , et al. Sept
2019-09-24
Semiconductor Device Incorporating Epitaxial Layer Field Stop Zone
App 20190273131 - Zhang; Lei ;   et al.
2019-09-05
Semiconductor Device Having One Or More Titanium Interlayers And Method Of Making The Same
App 20190148165 - He; Wei ;   et al.
2019-05-16
Reverse Conducting Igbt Incorporating Epitaxial Layer Field Stop Zone
App 20190088745 - Xue; Hongyong ;   et al.
2019-03-21
Semiconductor Device Incorporating Epitaxial Layer Field Stop Zone
App 20190006461 - Zhang; Lei ;   et al.
2019-01-03
Reverse Conducting Igbt Incorporating Epitaxial Layer Field Stop Zone And Fabrication Method
App 20190006467 - Xue; Hongyong ;   et al.
2019-01-03
Method For Precisely Aligning Backside Pattern To Frontside Pattern Of A Semiconductor Wafer
App 20190006285 - Zhang; Lei ;   et al.
2019-01-03
Reverse conducting IGBT incorporating epitaxial layer field stop zone and fabrication method
Grant 10,170,559 - Xue , et al. J
2019-01-01
Power Device With High Aspect Ratio Trench Contacts And Submicron Pitches Between Trenches
App 20180323282 - Li; Wenjun ;   et al.
2018-11-08
Power device with high aspect ratio trench contacts and submicron pitches between trenches
Grant 10,020,380 - Li , et al. July 10, 2
2018-07-10
Split-gate trench power mosfet with protected shield oxide
Grant 9,865,694 - Lee , et al. January 9, 2
2018-01-09
Self-aligned Contact For Trench Power Mosfet
App 20170288028 - Xue; Hongyong ;   et al.
2017-10-05
Split-gate trench power MOSFET with protected shield oxide
Grant 9,741,808 - Lee , et al. August 22, 2
2017-08-22
Self-aligned contact for trench power MOSFET
Grant 9,691,863 - Xue , et al. June 27, 2
2017-06-27
Split-gate Trench Power Mosfet With Protected Shield Oxide
App 20170133473 - Lee; Yeeheng ;   et al.
2017-05-11
Self-aligned Contact For Trench Power Mosfet
App 20160300917 - Xue; Hongyong ;   et al.
2016-10-13
Power Device With High Aspect Ratio Trench Contacts And Submicron Pitches Between Trenches
App 20160218008 - Li; Wenjun ;   et al.
2016-07-28
Split-gate Trench Power Mosfet With Protected Shield Oxide
App 20160190265 - Lee; Yeeheng ;   et al.
2016-06-30
Split-gate trench power MOSFET with protected shield oxide
Grant 9,281,368 - Lee , et al. March 8, 2
2016-03-08
Multi-step tungsten etchback process to preserve barrier integrity in an integrated circuit structure
Grant 6,872,668 - Cao , et al. March 29, 2
2005-03-29

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