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Monomers and polymers for functional polycarbonates and poly(ester-carbonates) and peg-co-polycarbonate hydrogels
Grant 10,752,614 - Song , et al. A | 2020-08-25 |
Massage Sofa
App 20190142687 - Zou; Jianhan ; et al. | 2019-05-16 |
Semiconductor device comprising mold for top side and sidewall protection
Grant 10,141,202 - Alvarado , et al. Nov | 2018-11-27 |
Monomers And Polymers For Functional Polycarbonates And Poly(ester-carbonates) And Peg-co-polycarbonate Hydrogels
App 20180155328 - Song; Jie ; et al. | 2018-06-07 |
Monomers and polymers for functional polycarbonates and poly(ester-carbonates) and PEG-co-polycarbonate hydrogels
Grant 9,908,871 - Song , et al. March 6, 2 | 2018-03-06 |
Degradable Hydrogel With Predictable Tuning Of Properties, And Compositions And Methods Thereof
App 20170182220 - Song; Jie ; et al. | 2017-06-29 |
Monomers And Polymers For Functional Polycarbonates And Poly(ester-carbonates) And Peg-co-polycarbonate Hydrogels
App 20160289219 - Song; Jie ; et al. | 2016-10-06 |
Monomers and polymers for functional polycarbonates and poly(ester-carbonates) and PEG-co-polycarbonate hydrogels
Grant 9,388,276 - Song , et al. July 12, 2 | 2016-07-12 |
Wafer level package without sidewall cracking
Grant 9,318,405 - Xu , et al. April 19, 2 | 2016-04-19 |
Thermal responsive polymer siloxanes, compositions, and method and applications related thereto
Grant 9,259,509 - Song , et al. February 16, 2 | 2016-02-16 |
Wafer Level Package And Fan Out Reconstitution Process For Making The Same
App 20150318229 - XU; Jianwen ; et al. | 2015-11-05 |
Electronic device and method of packaging an electronic device
Grant 9,054,111 - Xu , et al. June 9, 2 | 2015-06-09 |
Apparatus and methods for quad flat no lead packaging
Grant 9,034,697 - Gong , et al. May 19, 2 | 2015-05-19 |
Thermal-responsive Polymer Networks, Compositions, And Methods And Applications Related Thereto
App 20140357806 - Song; Jie ; et al. | 2014-12-04 |
Semiconductor Device Comprising Mold For Top Side And Sidewall Protection
App 20140339712 - Alvarado; Reynante Tamunan ; et al. | 2014-11-20 |
Soldering relief method and semiconductor device employing same
Grant 8,841,168 - Schwarz , et al. September 23, 2 | 2014-09-23 |
Thermal Responsive Polymer Siloxanes, Compositions, And Method And Applications Related Thereto
App 20140255333 - Song; Jie ; et al. | 2014-09-11 |
Thermal responsive polymer siloxanes, compositions, and method and applications related thereto
Grant 8,765,112 - Song , et al. July 1, 2 | 2014-07-01 |
Monomers And Polymers For Functional Polycarbonates And Poly(ester-carbonates) And Peg-co-polycarbonate Hydrogels
App 20140058058 - Song; Jie ; et al. | 2014-02-27 |
Back side alignment structure and manufacturing method for three-dimensional semiconductor device packages
Grant 8,617,935 - Xu , et al. December 31, 2 | 2013-12-31 |
Back side alignment structure and manufacturing method for three-dimensional semiconductor device packages
Grant 08617935 - | 2013-12-31 |
Packaging an integrated circuit die using compression molding
Grant 8,609,471 - Xu December 17, 2 | 2013-12-17 |
Thermal-responsive polymer networks, compositions, and methods and applications related thereto
Grant 8,597,630 - Song , et al. December 3, 2 | 2013-12-03 |
Soldering Relief Method And Semiconductor Device Employing Same
App 20130244384 - Schwarz; Mark Wendell ; et al. | 2013-09-19 |
Soldering relief method and semiconductor device employing same
Grant 8,461,676 - Schwarz , et al. June 11, 2 | 2013-06-11 |
Soldering Relief Method and Semiconductor Device Employing Same
App 20130062746 - Schwarz; Mark Wendell ; et al. | 2013-03-14 |
Back Side Alignment Structure And Manufacturing Method For Three-dimensional Semiconductor Device Packages
App 20130052777 - Xu; Jianwen ; et al. | 2013-02-28 |
Apparatus And Methods For Quad Flat No Lead Packaging
App 20130015566 - GONG; ZHIWEI ; et al. | 2013-01-17 |
Method for releasing a microelectronic assembly from a carrier substrate
Grant 8,327,532 - Xu , et al. December 11, 2 | 2012-12-11 |
Packaging an integrated circuit die with backside metallization
Grant 8,236,609 - Ramanathan , et al. August 7, 2 | 2012-08-07 |
Method of forming a packaged semiconductor device
Grant 8,216,918 - Gong , et al. July 10, 2 | 2012-07-10 |
Method Of Forming A Packaged Semiconductor Device
App 20120021565 - Gong; Zhiwei ; et al. | 2012-01-26 |
Method And System For Releasing A Microelectronic Assembly From A Carrier Substrate
App 20110119910 - Xu; Jianwen ; et al. | 2011-05-26 |
Thermal-Responsive Polymer Networks, Compositions, And Methods And Applications Related Thereto
App 20100280561 - Song; Jie ; et al. | 2010-11-04 |
Electronic Device And Method Of Packaging An Electronic Device
App 20100252919 - Xu; Jianwen ; et al. | 2010-10-07 |
Polymer Compositions For Biomedical And Material Applications
App 20100098761 - Song; Jie ; et al. | 2010-04-22 |
Thermal Responsive Polymer Siloxanes, Compositions, And Method And Applications Related Thereto
App 20100068168 - Song; Jie ; et al. | 2010-03-18 |
Packaging An Integrated Circuit Die With Backside Metallization
App 20100029045 - Ramanathan; Lakshmi N. ; et al. | 2010-02-04 |
Method of packaging an integrated circuit die
Grant 7,595,226 - Lytle , et al. September 29, 2 | 2009-09-29 |
Packaging An Integrated Circuit Die Using Compression Molding
App 20090221114 - Xu; Jianwen | 2009-09-03 |
Method Of Packaging An Integrated Circuit Die
App 20090061564 - Lytle; William H. ; et al. | 2009-03-05 |
High dielectric polymer composites and methods of preparation thereof
Grant 6,864,306 - Rao , et al. March 8, 2 | 2005-03-08 |
High dielectric polymer composites and methods of preparation thereof
App 20030006402 - Rao, Yang ; et al. | 2003-01-09 |
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