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Patent applications and USPTO patent grants for Xu; Dongjiang.The latest application filed is for "method for manufacturing 3d circuits from bare die or packaged ic chips by microdispensed interconnections".
Patent | Date |
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Method for manufacturing 3D circuits from bare die or packaged IC chips by microdispensed interconnections Grant 8,790,742 - Church , et al. July 29, 2 | 2014-07-29 |
Method For Manufacturing 3d Circuits From Bare Die Or Packaged Ic Chips By Microdispensed Interconnections App 20110237002 - CHURCH; KENNETH H. ;   et al. | 2011-09-29 |
Method for manufacturing 3D circuits from bare die or packaged IC chips by microdispensed interconnections Grant 7,972,650 - Church , et al. July 5, 2 | 2011-07-05 |
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