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Patent applications and USPTO patent grants for XU; Dingying David.The latest application filed is for "new method to enable 30 microns pitch emib or below".
Patent | Date |
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New Method To Enable 30 Microns Pitch Emib Or Below App 20210327800 - FENG; Hongxia ;   et al. | 2021-10-21 |
Method to enable 30 microns pitch EMIB or below Grant 11,088,062 - Feng , et al. August 10, 2 | 2021-08-10 |
Method To Enable 30 Microns Pitch Emib Or Below App 20190027431 - FENG; Hongxia ;   et al. | 2019-01-24 |
Coated probe tips for plunger pins of an integrated circuit package test system Grant 10,168,357 - Yin , et al. J | 2019-01-01 |
Thermal Head with a Thermal Barrier for Integrated Circuit Die Processing App 20170176516 - Mamodia; Mohit ;   et al. | 2017-06-22 |
Coated Probe Tips for Plunger Pins of an Integrated Circuit Package Test System App 20170176495 - Yin; Wen ;   et al. | 2017-06-22 |
Solder-on-die using water-soluble resist system and method Grant 9,659,889 - Oka , et al. May 23, 2 | 2017-05-23 |
Solder-on-die Using Water-soluble Resist System And Method App 20150179595 - Oka; Mihir ;   et al. | 2015-06-25 |
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