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Probe pins with etched tips for electrical die test
Grant 11,340,258 - Stanford , et al. May 24, 2 | 2022-05-24 |
Selectively Roughened Copper Architectures For Low Insertion Loss Conductive Features
App 20220102259 - Kong; Jieying ; et al. | 2022-03-31 |
Dummy Die Structures Of A Packaged Integrated Circuit Device
App 20220102242 - Modi; Mitul ; et al. | 2022-03-31 |
Composite Dry Film Resist For Photolithography
App 20210318612 - FENG; Hongxia ; et al. | 2021-10-14 |
Patternable Die Attach Materials And Processes For Patterning
App 20200312771 - NIE; Bai ; et al. | 2020-10-01 |
Probe Pins With Etched Tips For Electrical Die Test
App 20200209280 - Stanford; Joseph D. ; et al. | 2020-07-02 |
Probe pins with etched tips for electrical die test
Grant 10,598,696 - Stanford , et al. | 2020-03-24 |
Thermal head with a thermal barrier for integrated circuit die processing
Grant 10,499,461 - Mamodia , et al. De | 2019-12-03 |
Space transformer with perforated metallic plate for electrical die test
Grant 9,941,652 - Raravikar , et al. April 10, 2 | 2018-04-10 |
Stiffener tape for electronic assembly
Grant 9,793,151 - Brun , et al. October 17, 2 | 2017-10-17 |
Probe Pins With Etched Tips For Electrical Die Test
App 20170276700 - Stanford; Joseph D. ; et al. | 2017-09-28 |
Package With Dielectric Or Anisotropic Conductive (acf) Buildup Layer
App 20170179099 - Hu; Chuan ; et al. | 2017-06-22 |
Space Transformer With Perforated Metallic Plate For Electrical Die Test
App 20170176518 - Raravikar; Nachiket R. ; et al. | 2017-06-22 |
Dry-removable Protective Coatings
App 20170033069 - Oka; Mihir A. ; et al. | 2017-02-02 |
Package with dielectric or anisotropic conductive (ACF) buildup layer
Grant 9,543,197 - Hu , et al. January 10, 2 | 2017-01-10 |
Integrated Circuit Die Transport Apparatus And Methods
App 20160375653 - Yin; Wen ; et al. | 2016-12-29 |
Dry-removable protective coatings
Grant 9,472,517 - Oka , et al. October 18, 2 | 2016-10-18 |
Flexible underfill compositions for enhanced reliability
Grant 9,458,283 - Xu , et al. October 4, 2 | 2016-10-04 |
Stiffener Tape For Electronic Assembly
App 20160172229 - Brun; Xavier ; et al. | 2016-06-16 |
Flexible Underfill Compositions For Enhanced Reliability
App 20150284503 - XU; Dingying ; et al. | 2015-10-08 |
Dry-removable Protective Coatings
App 20150270235 - Oka; Mihir A. ; et al. | 2015-09-24 |
Flexible underfill compositions for enhanced reliability
Grant 9,068,067 - Xu , et al. June 30, 2 | 2015-06-30 |
Methods To Improve Laser Mark Contrast On Die Backside Film In Embedded Die Packages
App 20140175657 - Oka; Mihir A. ; et al. | 2014-06-26 |
Package With Dielectric Or Anisotropic Conductive (acf) Buildup Layer
App 20140167217 - Hu; Chuan ; et al. | 2014-06-19 |
Coating for a microelectronic device, treatment comprising same, and method of managing a thermal profile of a microelectronic die
Grant 8,569,108 - Xu , et al. October 29, 2 | 2013-10-29 |
Patterned Adhesive Tape For Backgrinding Processes
App 20130256909 - Xu; Dingying ; et al. | 2013-10-03 |
Forming die backside coating structures with coreless packages
Grant 8,466,559 - Manepalli , et al. June 18, 2 | 2013-06-18 |
Coating For A Microelectronic Device, Treatment Comprising Same,and Method Of Managing A Thermal Profile Of A Microelectronic Die
App 20130017650 - Xu; Dingying ; et al. | 2013-01-17 |
Treatment for a microelectronic device and method of resisting damage to a microelectronic device using same
Grant 8,304,065 - Arana , et al. November 6, 2 | 2012-11-06 |
Coating for a microelectronic device, treatment comprising same, and method of managing a thermal profile of a microelectronic die
Grant 8,287,996 - Xu , et al. October 16, 2 | 2012-10-16 |
Forming Die Backside Coating Structures With Coreless Packages
App 20120153494 - Manepalli; Rahul N. ; et al. | 2012-06-21 |
Flexible Underfill Compositions For Enhanced Reliability
App 20120074597 - Xu; Dingying ; et al. | 2012-03-29 |
Treatment for a microelectronic device and method of resisting damage to a microelectronic device using same
App 20110159256 - Arana; Leonel ; et al. | 2011-06-30 |
Coating for a microelectronic device, treatment comprising same, and method of managing a thermal profile of a microelectronic die
App 20110151624 - Xu; Dingying ; et al. | 2011-06-23 |
In-situ formation of conductive filling material in through-silicon via
Grant 7,851,342 - Xu , et al. December 14, 2 | 2010-12-14 |
Self-healing Thermal Interface Materials For Semiconductor Packages
App 20100264536 - Shankar; Ravi ; et al. | 2010-10-21 |
Self-healing Thermal Interface Materials For Semiconductor Packages
App 20090321922 - Shankar; Ravi ; et al. | 2009-12-31 |
Microelectronic package having solder-filled through-vias
Grant 7,638,867 - Xu , et al. December 29, 2 | 2009-12-29 |
Method, system, and apparatus for filling vias
Grant 7,557,036 - Eitan , et al. July 7, 2 | 2009-07-07 |
High Thermal Conductivity Molding Compound For Flip-chip Packages
App 20090004317 - Hu; Xuejiao ; et al. | 2009-01-01 |
In-situ Formation Of Conductive Filling Material In Through-silicon Via
App 20080242079 - Xu; Dingying ; et al. | 2008-10-02 |
Microelectronic package having solder-filled through-vias
App 20070278635 - Xu; Dingying ; et al. | 2007-12-06 |
Backside via formation prior to die attachment
App 20070275540 - Hackitt; Dale A. ; et al. | 2007-11-29 |
Method, system, and apparatus for filling vias
App 20070235840 - Eitan; Amram ; et al. | 2007-10-11 |
Post chemical-mechanical planarization (CMP) cleaning composition
Grant 6,492,308 - Naghshineh , et al. December 10, 2 | 2002-12-10 |
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