Xu, Chengzeng

Patent Applications and Registrations

Patent applications and USPTO patent grants for Xu, Chengzeng.The latest application filed is for "lasable bond-ply materials for high density printed wiring boards".

Company Profile

0.7.4

Xu, Chengzeng - Tewksbury MA
Xu; Chengzeng - Succasunna NJ
Xu; Chengzeng - Morris NJ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Lasable bond-ply materials for high density printed wiring boards App 20040170795 - Haas, David R. ; et al.	2004-09-02
Microfiber dielectrics which facilitate laser via drilling App 20040016118 - Haas, David ; et al.	2004-01-29
Lasable bond-ply materials for high density printed wiring boards Grant 6,673,190 - Haas , et al. January 6, 2	2004-01-06
High performance acrylate materials for optical interconnects Grant 6,512,874 - Xu , et al. January 28, 2	2003-01-28
High performance acrylate materials for optical interconnects App 20020034711 - Xu, Chengzeng ; et al.	2002-03-21
Lasable bond-ply materials for high density printed wiring boards App 20020004352 - Haas, David ; et al.	2002-01-10
High performance acrylate materials for optical interconnects Grant 6,335,149 - Xu , et al. January 1, 2	2002-01-01
Fabrication of high density multilayer interconnect printed circuit boards Grant 6,255,039 - Xu , et al. July 3, 2	2001-07-03
Lasable bond-ply materials for high density printed wiring boards Grant 6,245,696 - Haas , et al. June 12, 2	2001-06-12
Microfiber dielectrics which facilitate laser via drilling Grant 6,224,965 - Haas , et al. May 1, 2	2001-05-01
Nitrone compounds as photopolymer polymerization inhibitors and contrast enhancing additives Grant 6,162,579 - Stengel , et al. December 19, 2	2000-12-19

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