Xiu; Yonghao

Patent Applications and Registrations

Patent applications and USPTO patent grants for Xiu; Yonghao.The latest application filed is for "processes and methods for applying underfill to singulated die".

Company Profile

0.11.17

Xiu; Yonghao - Chandler AZ
Xiu; Yonghao - Santa Clara CA
Xiu; Yonghao - Atlanta GA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Methods of promoting adhesion between underfill and conductive bumps and structures formed thereby Grant 10,115,606 - Bai , et al. October 30, 2	2018-10-30
Processes And Methods For Applying Underfill To Singulated Die App 20180286704 - Nofen; Elizabeth M. ; et al.	2018-10-04
Narrow-gap flip chip underfill composition Grant 9,611,372 - Xiu , et al. April 4, 2	2017-04-04
Reduction Of Underfill Filler Settling In Integrated Circuit Packages App 20160343591 - Ramalingam; Suriyakala ; et al.	2016-11-24
Method for reducing underfill filler settling in integrated circuit packages Grant 9,431,274 - Ramalingam , et al. August 30, 2	2016-08-30
Methods Of Promoting Adhesion Between Underfill And Conductive Bumps And Structures Formed Thereby App 20160240395 - Bai; Yiqun ; et al.	2016-08-18
Narrow-gap Flip Chip Underfill Composition App 20160168351 - Xiu; Yonghao ; et al.	2016-06-16
Methods of promoting adhesion between underfill and conductive bumps and structures formed thereby Grant 9,330,993 - Bai , et al. May 3, 2	2016-05-03
Narrow-gap flip chip underfill composition Grant 9,269,596 - Xiu , et al. February 23, 2	2016-02-23
Methods to prevent filler entrapment in microelectronic device to microelectronic substrate interconnection structures Grant 9,230,833 - Dubey , et al. January 5, 2	2016-01-05
Methods To Prevent Filler Entrapment In Microelectronic Device To Microelectronic Substrate Interconnection Structures App 20150179479 - Dubey; Manish ; et al.	2015-06-25
Narrow-gap Flip Chip Underfill Composition App 20150179478 - Xiu; Yonghao ; et al.	2015-06-25
Methods to prevent filler entrapment in microelectronic device to microelectronic substrate interconnection structures Grant 8,999,765 - Dubey , et al. April 7, 2	2015-04-07
Methods To Prevent Filler Entrapment In Microelectronic Device To Microelectronic Substrate Interconnection Structures App 20140377916 - Dubey; Manish ; et al.	2014-12-25
Epoxy-amine underfill materials for semiconductor packages Grant 8,916,981 - Xiu , et al. December 23, 2	2014-12-23
Epoxy-amine Underfill Materials For Semiconductor Packages App 20140332966 - Xiu; Yonghao ; et al.	2014-11-13
Reduction Of Underfill Filler Settling In Integrated Circuit Packages App 20140177149 - Ramalingam; Suriyakala ; et al.	2014-06-26
Methods Of Promoting Adhesion Between Underfill And Conductive Bumps And Structures Formed Thereby App 20140175634 - Bai; Yiqun ; et al.	2014-06-26
Methods and systems for metal-assisted chemical etching of substrates Grant 8,278,191 - Hildreth , et al. October 2, 2	2012-10-02
Metal-Assisted Chemical Etching of Substrates App 20100248449 - Hildreth; Owen ; et al.	2010-09-30
Superhydrophobic Surface And Method For Forming Same App 20090011222 - Xiu; Yonghao ; et al.	2009-01-08

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