XINTEC INC.
Patent Applications and Registrations
Patent applications and USPTO patent grants for XINTEC INC..The latest application filed is for "chip package and method for forming the same".
Company Profile
27.200.200
- XINTEC INC. - Taoyuan N/A TW
- XINTEC INC. - Taoyuan City TW
- XINTEC INC. - Zhongli, Taoyuan County N/A TW
- XINTEC INC. - Jhongli, Taoyuan County N/A TW
- XINTEC INC. - Taoyan City TW
- XINTEC INC. - Taoyuan County N/A TW
- XINTEC INC. - Zhongli City TW
- XINTEC INC. - Jhongli City TW
- XINTEC INC. - hongli City TW
Patent Activity
| Patent | Date |
|---|---|
| Chip package with substrate having first opening surrounded by second opening and method for forming the same Grant 11,450,697 - Chen , et al. September 20, 2 | 2022-09-20 |
| Chip Package And Method For Forming The Same App 20220285423 - LIU; Tsang-Yu ; et al. | 2022-09-08 |
| Chip Package And Manufacturing Method Thereof App 20220219970 - LIU; Tsang-Yu ; et al. | 2022-07-14 |
| Chip package and manufacturing method thereof Grant 11,387,201 - Lee , et al. July 12, 2 | 2022-07-12 |
| Semiconductor Device Structure And Semiconductor Package Assembly App 20220216131 - LEE; Po-Han ; et al. | 2022-07-07 |
| Chip package and manufacturing method thereof Grant 11,355,659 - Lee , et al. June 7, 2 | 2022-06-07 |
| Chip Structure And Manufacturing Method Thereof App 20220157762 - LAI; Jiun-Yen ; et al. | 2022-05-19 |
| Chip package and manufacturing method thereof Grant 11,319,208 - Liu , et al. May 3, 2 | 2022-05-03 |
| Chip structure and manufacturing method thereof Grant 11,309,271 - Lai , et al. April 19, 2 | 2022-04-19 |
| Chip package and power module Grant 11,310,904 - Liu , et al. April 19, 2 | 2022-04-19 |
| Antenna Device And Manufacturing Method Thereof App 20220069454 - LAI; Jiun-Yen ; et al. | 2022-03-03 |
| Manufacturing Method Of Chip Package And Chip Package App 20210343591 - Lin; Chia-Sheng ; et al. | 2021-11-04 |
| Chip package and manufacturing method thereof Grant 11,164,853 - Cheng , et al. November 2, 2 | 2021-11-02 |
| Optical chip package and method for forming the same Grant 11,137,559 - Lai , et al. October 5, 2 | 2021-10-05 |
| Manufacturing method of chip package and chip package Grant 11,121,031 - Lin , et al. September 14, 2 | 2021-09-14 |
| Chip Package And Manufacturing Method Thereof App 20210269303 - SUEN; Wei-Luen ; et al. | 2021-09-02 |
| Chip package and manufacturing method thereof Grant 11,107,759 - Suen , et al. August 31, 2 | 2021-08-31 |
| Chip Package And Manufacturing Method Thereof App 20210210445 - CHENG; Chia-Ming ; et al. | 2021-07-08 |
| Chip Package App 20210210436 - CHENG; Chia-Ming ; et al. | 2021-07-08 |
| Chip Package And Method For Forming The Same App 20210210538 - LAI; Jiun-Yen ; et al. | 2021-07-08 |
| Chip package Grant 11,056,427 - Chen , et al. July 6, 2 | 2021-07-06 |
| Chip package and manufacturing method thereof Grant 11,038,077 - Ho , et al. June 15, 2 | 2021-06-15 |
| Chip Package And Manufacturing Method Thereof App 20210159350 - LEE; Po-Han ; et al. | 2021-05-27 |
| Chip Package And Manufacturing Method Thereof App 20210104455 - SUEN; Wei-Luen ; et al. | 2021-04-08 |
| Chip Package And Manufacturing Method Thereof App 20210082841 - LEE; Po-Han ; et al. | 2021-03-18 |
| Chip package and method for forming the same Grant 10,950,738 - Chang , et al. March 16, 2 | 2021-03-16 |
| Manufacturing Method Of Chip Package App 20210066379 - HO; Yen-Shih ; et al. | 2021-03-04 |
| Chip Structure And Manufacturing Method Thereof App 20210035940 - LAI; Jiun-Yen ; et al. | 2021-02-04 |
| Chip Package And Manufacturing Method Thereof App 20210032096 - LIU; Tsang-Yu ; et al. | 2021-02-04 |
| Chip package and manufacturing method thereof Grant 10,833,118 - Liu , et al. November 10, 2 | 2020-11-10 |
| Optical Chip Package And Method For Forming The Same App 20200333542 - LAI; Jiun-Yen ; et al. | 2020-10-22 |
| Chip package and manufacturing method thereof Grant 10,714,528 - Kuan , et al. | 2020-07-14 |
| Manufacturing Method Of Chip Package And Chip Package App 20200144116 - LIN; Chia-Sheng ; et al. | 2020-05-07 |
| Chip Package And Power Module App 20200137879 - LIU; Tsang-Yu ; et al. | 2020-04-30 |
| Chip Package App 20200111737 - CHEN; Kuei-Wei ; et al. | 2020-04-09 |
| Chip Package And Method For Forming The Same App 20200098811 - CHEN; Kuei-Wei ; et al. | 2020-03-26 |
| Chip Package And Method For Forming The Same App 20200044099 - CHANG; Shu-Ming ; et al. | 2020-02-06 |
| Semiconductor structure and method for manufacturing semiconductor structure Grant 10,461,117 - Ho , et al. Oc | 2019-10-29 |
| Chip package and method for forming the same Grant 10,446,504 - Cheng , et al. Oc | 2019-10-15 |
| Chip package and method for forming the same Grant 10,424,540 - Ho , et al. Sept | 2019-09-24 |
| Chip Package And Manufacturing Method Thereof App 20190273175 - HO; Yen-Shih ; et al. | 2019-09-05 |
| Wafer coating system and method of manufacturing chip package Grant 10,388,541 - Chen , et al. A | 2019-08-20 |
| Chip package and manufacturing method thereof Grant 10,347,616 - Kuan , et al. July 9, 2 | 2019-07-09 |
| Touch panel-sensing chip package module complex and a manufacturing method thereof Grant 10,318,784 - Chang , et al. | 2019-06-11 |
| Chip Package And Manufacturing Method Thereof App 20190140012 - KUAN; Hsin ; et al. | 2019-05-09 |
| Chip package and method for forming the same Grant 10,157,875 - Yiu , et al. Dec | 2018-12-18 |
| Chip package and method for forming the same Grant 10,157,811 - Liu Dec | 2018-12-18 |
| Chip Package And Manufacturing Method Thereof App 20180358398 - HO; Yen-Shih ; et al. | 2018-12-13 |
| Chip package and method for forming the same Grant 10,153,237 - Ho , et al. Dec | 2018-12-11 |
| Chip scale sensing chip package and a manufacturing method thereof Grant 10,152,180 - Chang , et al. Dec | 2018-12-11 |
| Wafer-level packaging sensing device and method for forming the same Grant 10,140,498 - Liu , et al. Nov | 2018-11-27 |
| Chip Package And Method For Forming The Same App 20180337142 - CHENG; Chia-Ming ; et al. | 2018-11-22 |
| Chip package and method for forming the same Grant 10,109,663 - Huang , et al. October 23, 2 | 2018-10-23 |
| Electronic device package and fabrication method thereof Grant 10,109,559 - Lin , et al. October 23, 2 | 2018-10-23 |
| Semiconductor structure and manufacturing method thereof Grant 10,096,635 - Chien , et al. October 9, 2 | 2018-10-09 |
| Chip package having chip connected to sensing device with redistribution layer in insulator layer Grant 10,056,419 - Yiu , et al. August 21, 2 | 2018-08-21 |
| Chip package and fabrication method thereof Grant 10,049,252 - Ho , et al. August 14, 2 | 2018-08-14 |
| Chip package and method for forming the same Grant 10,050,006 - Shen , et al. August 14, 2 | 2018-08-14 |
| Semiconductor Structure And Method For Manufacturing Semiconductor Structure App 20180175101 - Ho; Yen-Shih ; et al. | 2018-06-21 |
| Chip Package Having Chip Connected To Sensing Device With Redistribution Layer In Insulator Layer App 20180175092 - YIU; Ho-Yin ; et al. | 2018-06-21 |
| Chip package and method for forming the same Grant 9,997,473 - Ho , et al. June 12, 2 | 2018-06-12 |
| Photosensitive module and method for forming the same Grant 9,978,788 - Ho , et al. May 22, 2 | 2018-05-22 |
| Chip package and manufacturing method thereof Grant 9,972,584 - Shen , et al. May 15, 2 | 2018-05-15 |
| Photosensitive module and method for forming the same Grant 9,966,400 - Liu , et al. May 8, 2 | 2018-05-08 |
| Chip package Grant 9,966,358 - Yiu , et al. May 8, 2 | 2018-05-08 |
| Chip package and manufacturing method thereof Grant 9,947,716 - Ho , et al. April 17, 2 | 2018-04-17 |
| Chip Package And Method For Forming The Same App 20180102321 - HO; Yen-Shih ; et al. | 2018-04-12 |
| Method for forming chip package having chip connected to sensing device with redistribution layer in insulator layer Grant 9,935,148 - Yiu , et al. April 3, 2 | 2018-04-03 |
| Sensing chip package and a manufacturing method thereof Grant 9,887,229 - Ho , et al. February 6, 2 | 2018-02-06 |
| Chip package and method of manufacturing the same Grant 9,881,959 - Lin , et al. January 30, 2 | 2018-01-30 |
| Chip package and method for fabricating the same Grant 9,881,889 - Huang , et al. January 30, 2 | 2018-01-30 |
| Chip package and manufacturing method thereof Grant 9,875,912 - Ho , et al. January 23, 2 | 2018-01-23 |
| Spray coater and ring-shaped structure thereof Grant 9,875,924 - Tsai , et al. January 23, 2 | 2018-01-23 |
| Chip Package And Manufacturing Method Thereof App 20180012853 - LIN; Hsi-Chien ; et al. | 2018-01-11 |
| Chip package and method for forming the same Grant 9,865,526 - Huang January 9, 2 | 2018-01-09 |
| Chip package and manufacturing method thereof Grant 9,859,320 - Long , et al. January 2, 2 | 2018-01-02 |
| Chip scale sensing chip package Grant 9,853,074 - Yiu , et al. December 26, 2 | 2017-12-26 |
| Chip package and fabrication method thereof Grant 9,831,185 - Lee , et al. November 28, 2 | 2017-11-28 |
| Chip Package And Manufacturing Method Thereof App 20170330871 - KUAN; Hsin ; et al. | 2017-11-16 |
| Chip module and method for forming the same Grant 9,812,413 - Yiu , et al. November 7, 2 | 2017-11-07 |
| Chip package having a trench exposed protruding conductive pad Grant 9,799,778 - Kuo , et al. October 24, 2 | 2017-10-24 |
| Chip package and manufacturing method thereof Grant 9,799,588 - Ni , et al. October 24, 2 | 2017-10-24 |
| Chip package and manufacturing method thereof Grant 9,793,234 - Ho , et al. October 17, 2 | 2017-10-17 |
| Method of fabricating chip package with laser Grant 9,780,050 - Wen , et al. October 3, 2 | 2017-10-03 |
| Semiconductor structure and manufacturing method thereof Grant 9,780,251 - Suen , et al. October 3, 2 | 2017-10-03 |
| Chip Package And Method For Forming The Same App 20170278769 - LIU; Chien-Hung | 2017-09-28 |
| Method for fabricating electronic device package Grant 9,771,259 - Liu September 26, 2 | 2017-09-26 |
| Chip Package And Method For Forming The Same App 20170271276 - HO; Yen-Shih ; et al. | 2017-09-21 |
| Inductor Structure And Manufacturing Method Thereof App 20170271432 - LAI; Wei-Ming ; et al. | 2017-09-21 |
| Chip package and manufacturing method thereof Grant 9,768,067 - Liu , et al. September 19, 2 | 2017-09-19 |
| Electronics device package and fabrication method thereof Grant 9,768,223 - Lin , et al. September 19, 2 | 2017-09-19 |
| Passive component structure and manufacturing method thereof Grant 9,761,555 - Lai , et al. September 12, 2 | 2017-09-12 |
| Chip package and method for forming the same Grant 9,761,510 - Liu September 12, 2 | 2017-09-12 |
| Chip Package And Method For Forming The Same App 20170256496 - LIN; Chia-Sheng ; et al. | 2017-09-07 |
| Chip package and manufacturing method thereof Grant 9,721,911 - Yiu , et al. August 1, 2 | 2017-08-01 |
| Chip Package And Method For Forming The Same App 20170213805 - SHEN; Chia-Lun ; et al. | 2017-07-27 |
| Chip Scale Sensing Chip Package App 20170213865 - YIU; Ho-Yin ; et al. | 2017-07-27 |
| Semiconductor Structure And Manufacturing Method Thereof App 20170213802 - PAN; Geng-Peng ; et al. | 2017-07-27 |
| Chip Package And Method For Forming The Same App 20170207182 - HO; Yen-Shih ; et al. | 2017-07-20 |
| Chip Package And Method For Forming The Same App 20170207194 - SHEN; Hsing-Lung ; et al. | 2017-07-20 |
| Method for forming chip package Grant 9,711,403 - Chen , et al. July 18, 2 | 2017-07-18 |
| Sensing module and method for forming the same Grant 9,711,425 - Chang , et al. July 18, 2 | 2017-07-18 |
| Semiconductor structure having recess and manufacturing method thereof Grant 9,711,469 - Pan , et al. July 18, 2 | 2017-07-18 |
| Chip package and method for forming the same Grant 9,704,772 - Liu July 11, 2 | 2017-07-11 |
| Inductor structure and manufacturing method thereof Grant 9,704,943 - Lai , et al. July 11, 2 | 2017-07-11 |
| Chip Package And Method For Forming The Same App 20170186712 - SHEN; Chia-Lun ; et al. | 2017-06-29 |
| Chip Package And Manufacturing Method Thereof App 20170186797 - LONG; Shun-Wen ; et al. | 2017-06-29 |
| Semiconductor Structure And Manufacturing Method Thereof App 20170179330 - SUEN; Wei-Luen ; et al. | 2017-06-22 |
| Separation apparatus and a method for separating a cap layer from a chip package by means of the separation apparatus Grant 9,685,354 - Ho , et al. June 20, 2 | 2017-06-20 |
| Chip Package And Manufacturing Method Thereof App 20170148752 - HO; Yen-Shih ; et al. | 2017-05-25 |
| Chip Package And Method For Forming The Same App 20170147857 - LIU; Chien-Hung | 2017-05-25 |
| Chip Package And Manufacturing Method Thereof App 20170148694 - HO; Yen-Shih ; et al. | 2017-05-25 |
| Chip Package And Manufacturing Method Thereof App 20170148844 - HO; Yen-Shih ; et al. | 2017-05-25 |
| Chip package and method for forming the same Grant 9,653,422 - Shen , et al. May 16, 2 | 2017-05-16 |
| Optical cover plate with improved solder mask dam on glass for image sensor package and fabrication method thereof Grant 9,653,500 - Lin May 16, 2 | 2017-05-16 |
| Chip package having a laser stop structure Grant 9,640,405 - Wen , et al. May 2, 2 | 2017-05-02 |
| Chip package and method for forming the same Grant 9,640,488 - Lin , et al. May 2, 2 | 2017-05-02 |
| Electrical contact structure with a redistribution layer connected to a stud Grant 9,640,683 - Suen , et al. May 2, 2 | 2017-05-02 |
| Chip Package And Method For Forming The Same App 20170117242 - HO; Yen-Shih ; et al. | 2017-04-27 |
| Sensing Device And Method For Forming The Same App 20170116458 - LIU; Tsang-Yu ; et al. | 2017-04-27 |
| Stacked chip package including substrate with recess adjoining side edge of substrate and method for forming the same Grant 9,633,935 - Ho , et al. April 25, 2 | 2017-04-25 |
| Semiconductor Package And Manufacturing Method Thereof App 20170110641 - LIU; Chien-Hung | 2017-04-20 |
| Chip Package And Manufacturing Method Thereof App 20170110495 - WU; Jyun-Liang ; et al. | 2017-04-20 |
| Chip package including recess in side edge Grant 9,620,431 - Cheng , et al. April 11, 2 | 2017-04-11 |
| Chip Scale Sensing Chip Package And A Manufacturing Method Thereof App 20170098678 - LAI; Chaung-Lin ; et al. | 2017-04-06 |
| Chip package and method for forming the same Grant 9,613,919 - Liu , et al. April 4, 2 | 2017-04-04 |
| Semiconductor structure and manufacturing method thereof Grant 9,613,904 - Chen , et al. April 4, 2 | 2017-04-04 |
| Method for forming chip package Grant 9,611,143 - Ho , et al. April 4, 2 | 2017-04-04 |
| Electronic Device And Manufacturing Method Thereof App 20170088417 - LAI; Yu-Chen ; et al. | 2017-03-30 |
| Chip Package And Method For Forming The Same App 20170092607 - KUAN; Hsin ; et al. | 2017-03-30 |
| Chip package including recess in side edge Grant 9,601,460 - Ho , et al. March 21, 2 | 2017-03-21 |
| Chip Package And Method For Forming The Same App 20170077158 - HUANG; Yu-Lung ; et al. | 2017-03-16 |
| Chip Package And Manufacturing Method Thereof App 20170076981 - LIU; Chien-Hung ; et al. | 2017-03-16 |
| Sensing Module And Method For Forming The Same App 20170053848 - CHANG; Shu-Ming ; et al. | 2017-02-23 |
| Chip Package And Fabrication Method Thereof App 20170047300 - WEN; Ying-Nan ; et al. | 2017-02-16 |
| Sensing Chip Package And A Manufacturing Method Thereof App 20170047455 - YIU; Ho-Yin ; et al. | 2017-02-16 |
| Chip package and method for forming the same Grant 9,570,398 - Chang , et al. February 14, 2 | 2017-02-14 |
| Semiconductor package and manufacturing method thereof Grant 9,570,633 - Liu February 14, 2 | 2017-02-14 |
| Sensing Chip Package And A Manufacturing Method Thereof App 20170040372 - HO; Yen-Shih ; et al. | 2017-02-09 |
| Chip package and method for forming the same Grant 9,559,001 - Yen , et al. January 31, 2 | 2017-01-31 |
| Chip Scale Sensing Chip Package And A Manufacturing Method Thereof App 20170025370 - CHEN; Yin-Chen ; et al. | 2017-01-26 |
| Chip Package And Method For Forming The Same App 20170018590 - YIU; Ho-Yin ; et al. | 2017-01-19 |
| Chip package and manufacturing method thereof Grant 9,548,265 - Ho , et al. January 17, 2 | 2017-01-17 |
| Chip Package And Manufacturing Method Thereof App 20170012081 - SHEN; Chia-Lun ; et al. | 2017-01-12 |
| Chip package having a dual through hole redistribution layer structure Grant 9,543,233 - Liu , et al. January 10, 2 | 2017-01-10 |
| Touch Panel-sensing Chip Package Module Complex And A Manufacturing Method Thereof App 20160379040 - CHANG; Shu-Ming ; et al. | 2016-12-29 |
| Image Sensor Chip Package And Fabricating Method Thereof App 20160380024 - CHEN; Chih-Hao ; et al. | 2016-12-29 |
| Chip Package And Method For Forming The Same App 20160372445 - YIU; Ho-Yin ; et al. | 2016-12-22 |
| Chip Package And Manufacturing Method Thereof App 20160355393 - LIU; Tsang-Yu ; et al. | 2016-12-08 |
| Chip Package And Method Of Manufacturing The Same App 20160351608 - HUANG; Yu-Lung ; et al. | 2016-12-01 |
| Image Sensing Device App 20160351607 - LIU; Tsang-Yu ; et al. | 2016-12-01 |
| Chip Package And Manufacturing Method Thereof App 20160343882 - KUO; Yi-Ying ; et al. | 2016-11-24 |
| Semiconductor Structure And Manufacturing Method Thereof App 20160329283 - CHEN; Yu-Tung ; et al. | 2016-11-10 |
| Chip Package And Manufacturing Method Thereof App 20160322312 - SHEN; Hsing-Lung ; et al. | 2016-11-03 |
| Chip Package And Fabrication Method Thereof App 20160322305 - LEE; Shih-Yi ; et al. | 2016-11-03 |
| Chip Package And Manufacturing Method Thereof App 20160315061 - HO; Yen-Shih ; et al. | 2016-10-27 |
| Semiconductor Electroplating System App 20160315048 - HO; Yen-Shih ; et al. | 2016-10-27 |
| Chip Package And Manufacturing Method Thereof App 20160315043 - HO; Yen-Shih ; et al. | 2016-10-27 |
| Wafer Coating System And Method Of Manufacturing Chip Package App 20160307779 - CHEN; Yu-Tung ; et al. | 2016-10-20 |
| Chip Scale Sensing Chip Package And A Manufacturing Method Thereof App 20160284751 - HO; Yen-Shih ; et al. | 2016-09-29 |
| Chip package and method for forming the same Grant 9,449,897 - Lou , et al. September 20, 2 | 2016-09-20 |
| Manufacturing method of semiconductor structure Grant 9,450,015 - Chien , et al. September 20, 2 | 2016-09-20 |
| Chip Scale Sensing Chip Package And A Manufacturing Method Thereof App 20160266680 - CHANG; Shu-Ming ; et al. | 2016-09-15 |
| Chip package and method for forming the same Grant 9,437,478 - Ho , et al. September 6, 2 | 2016-09-06 |
| Spray Coater And Ring-shaped Structure Thereof App 20160250656 - TSAI; Tsou-Tso ; et al. | 2016-09-01 |
| Chip package Grant 9,425,134 - Ho , et al. August 23, 2 | 2016-08-23 |
| Fabrication method of wiring structure for improving crown-like defect Grant 9,426,894 - Chang , et al. August 23, 2 | 2016-08-23 |
| Chip Scale Sensing Chip Package And A Manufacturing Method Thereof App 20160239699 - CHANG; Shu-Ming ; et al. | 2016-08-18 |
| Chip Package And Manufacturing Method Thereof App 20160240520 - Ho; Yen-Shih ; et al. | 2016-08-18 |
| Manufacturing method of semiconductor structure with protein tape Grant 9,419,050 - Ho , et al. August 16, 2 | 2016-08-16 |
| Chip Package And Method For Forming The Same App 20160233260 - YIU; Ho-Yin ; et al. | 2016-08-11 |
| Chip Package And Fabrication Method Thereof App 20160229687 - WEN; Ying-Nan ; et al. | 2016-08-11 |
| Chip package and method of manufacturing the same Grant 9,406,818 - Liu , et al. August 2, 2 | 2016-08-02 |
| Chip package having extended depression for electrical connection and method of manufacturing the same Grant 9,406,578 - Wen , et al. August 2, 2 | 2016-08-02 |
| Chip package and method of manufacturing the same Grant 9,403,672 - Lin August 2, 2 | 2016-08-02 |
| Chip package and manufacturing method thereof Grant 9,406,590 - Lin , et al. August 2, 2 | 2016-08-02 |
| Photosensitive Module And Method For Forming The Same App 20160218129 - LIU; Tsang-Yu ; et al. | 2016-07-28 |
| Manufacturing Method Of Semiconductor Structure App 20160218140 - CHIEN; Wei-Ming ; et al. | 2016-07-28 |
| Photosensitive Module And Method For Forming The Same App 20160218133 - HO; Yen-Shih ; et al. | 2016-07-28 |
| Chip Module And Method For Forming The Same App 20160211233 - YIU; Ho-Yin ; et al. | 2016-07-21 |
| Chip Package And Manufacturing Method Thereof App 20160211297 - LIU; Tsang-Yu ; et al. | 2016-07-21 |
| Manufacturing method of semiconductor structure Grant 9,397,138 - Liu July 19, 2 | 2016-07-19 |
| Chip Package And Fabrication Method Thereof App 20160204061 - YIU; Ho-Yin ; et al. | 2016-07-14 |
| Photosensitive Module And Method For Forming The Same App 20160190353 - LIAO; Chi-Chang ; et al. | 2016-06-30 |
| Chip Package And Fabrication Method Thereof App 20160190063 - WEN; Ying-Nan ; et al. | 2016-06-30 |
| Chip package and method for forming the same Grant 9,379,072 - Liu , et al. June 28, 2 | 2016-06-28 |
| Chip Package And Method For Forming The Same App 20160181212 - LIU; Tsang-Yu ; et al. | 2016-06-23 |
| Chip package and method thereof Grant 9,373,597 - Ho , et al. June 21, 2 | 2016-06-21 |
| Chip Package And Fabrication Method Thereof App 20160171273 - HO; Yen-Shih ; et al. | 2016-06-16 |
| Chip package and fabrication method thereof Grant 9,362,134 - Lin June 7, 2 | 2016-06-07 |
| Chip package and method for forming the same Grant 9,355,970 - Huang , et al. May 31, 2 | 2016-05-31 |
| Chip package and method for forming the same Grant 9,355,975 - Ho , et al. May 31, 2 | 2016-05-31 |
| Chip package and method for forming the same Grant 9,349,710 - Chen , et al. May 24, 2 | 2016-05-24 |
| Chip Package And Method For Forming The Same App 20160141219 - LIU; Chien-Hung | 2016-05-19 |
| Chip Package And Method For Forming The Same App 20160141254 - LIN; Yi-Min ; et al. | 2016-05-19 |
| Chip Package And Manufacturing Method Thereof App 20160133588 - YIU; Ho-Yin ; et al. | 2016-05-12 |
| Chip Package And Manufacturing Method Thereof App 20160133544 - LIU; Chien-Hung ; et al. | 2016-05-12 |
| Chip package and method for forming the same Grant 9,337,115 - Liu May 10, 2 | 2016-05-10 |
| Chip package and method thereof Grant 9,334,156 - Lin , et al. May 10, 2 | 2016-05-10 |
| Chip package and method for forming the same Grant 9,337,097 - Huang May 10, 2 | 2016-05-10 |
| Chip package and method for forming the same Grant 9,334,158 - Huang , et al. May 10, 2 | 2016-05-10 |
| Semiconductor Package And Manufacturing Method Thereof App 20160118506 - LIU; Chien-Hung | 2016-04-28 |
| Chip Package And Method Of Manufacturing The Same App 20160111555 - LIU; Tsang-Yu ; et al. | 2016-04-21 |
| Chip Package And Method For Forming The Same App 20160099195 - HUANG; Yu-Lung | 2016-04-07 |
| Chip Package And Method For Forming The Same App 20160086896 - HUANG; Yu-Lung ; et al. | 2016-03-24 |
| Electronic Device Package And Fabrication Method Thereof App 20160052782 - LIU; Chien-Hung | 2016-02-25 |
| Chip Package And Method Of Manufacturing The Same App 20160049436 - LIN; Po-Shen ; et al. | 2016-02-18 |
| Chip Package And Method Of Manufacturing The Same App 20160039663 - LIN; Chien-Min | 2016-02-11 |
| Chip Package And Method Thereof App 20160039662 - LIN; Chien-Min ; et al. | 2016-02-11 |
| Semiconductor Structure And Manufacturing Method Thereof App 20160043123 - CHIEN; Wei-Ming ; et al. | 2016-02-11 |
| Chip Package And Method For Forming The Same App 20160005787 - HO; Yen-Shih ; et al. | 2016-01-07 |
| Manufacturing Method Of Semiconductor Structure App 20150340403 - HO; Yen-Shih ; et al. | 2015-11-26 |
| Semiconductor Structure And Manufacturing Method Thereof App 20150340330 - PAN; Geng-Peng ; et al. | 2015-11-26 |
| Chip Package And Method For Forming The Same App 20150325551 - WEN; Ying-Nan ; et al. | 2015-11-12 |
| Chip Package And Method For Forming The Same App 20150325557 - YIU; Ho-Yin ; et al. | 2015-11-12 |
| Chip Package And Method For Forming The Same App 20150325552 - LIU; Chien-Hung | 2015-11-12 |
| Semiconductor Structure And Manufacturing Method Thereof App 20150318348 - YEN; Yu-Lin ; et al. | 2015-11-05 |
| Stacked Chip Package And Method For Forming The Same App 20150311175 - HO; Yen-Shih ; et al. | 2015-10-29 |
| Chip Package And Method Of Manufacturing The Same App 20150303178 - LIU; Chien-Hung ; et al. | 2015-10-22 |
| Chip Package And Method Of Manufacturing The Same App 20150295097 - LIU; Tsang-Yu ; et al. | 2015-10-15 |
| Method For Forming Chip Package App 20150284244 - HO; Yen-Shih ; et al. | 2015-10-08 |
| Chip Package And Method For Forming The Same App 20150287659 - LIU; Chien-Hung | 2015-10-08 |
| Separation Apparatus And A Method For Separating A Cap Layer From A Chip Package By Means Of The Separation Apparatus App 20150287619 - HO; Yen-Shih ; et al. | 2015-10-08 |
| Manufacturing Method Of Semiconductor Structure App 20150279900 - LIU; Chien-Hung | 2015-10-01 |
| Chip Package And Method For Forming The Same App 20150279808 - SHEN; Chia-Lun ; et al. | 2015-10-01 |
| Chip Package And Method Thereof App 20150270236 - HO; Yen-Shih ; et al. | 2015-09-24 |
| Chip Package And Method Of Manufacturing The Same App 20150255358 - WEN; Ying-Nan ; et al. | 2015-09-10 |
| Chip Package And Method Of Fabricating The Same App 20150255499 - LEE; Po-Han ; et al. | 2015-09-10 |
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