Xie; Wenxu
Patent Applications and Registrations
Patent applications and USPTO patent grants for Xie; Wenxu.The latest application filed is for "chip and packaging method".
- Xie; Wenxu - Shenzhen CN
- Xie; Wenxu - Hangzhou CN
| Patent | Date |
|---|---|
| Encapsulation of a substrate electrically connected to a plurality of pin arrays Grant 11,276,645 - Zhao , et al. March 15, 2 | 2022-03-15 |
| Chip And Packaging Method App 20200381361 - ZHAO; Nan ; et al. | 2020-12-03 |
| ATV windshield and wiper mounting Grant 10,562,498 - Luo , et al. Feb | 2020-02-18 |
| ATV Windshield And Wiper Mounting App 20190031148 - Luo; Longping ; et al. | 2019-01-31 |
| Packaging Structure, Electronic Device, And Packaging Method App 20180308789 - Zhao; Nan ; et al. | 2018-10-25 |
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