Xiao; Li Hong

Patent Applications and Registrations

Patent applications and USPTO patent grants for Xiao; Li Hong.The latest application filed is for "method for forming channel hole plug of three-dimensional memory device".

Company Profile

65.63.78

Xiao; Li Hong - Hubei CN
Xiao; Li Hong - Wuhan CN
Xiao; Li Hong - Wuhan City CN

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Memory device using comb-like routing structure for reduced metal line loading Grant 11,443,807 - Huo , et al. September 13, 2	2022-09-13
3D NAND memory device with select gate cut Grant 11,430,811 - Song , et al. August 30, 2	2022-08-30
Bonded semiconductor structures having bonding contacts made of indiffusible conductive materials and methods for forming the same Grant 11,430,756 - Huo , et al. August 30, 2	2022-08-30
Memory stacks having silicon oxynitride gate-to-gate dielectric layers and methods for forming the same Grant 11,424,266 - Xiao August 23, 2	2022-08-23
3D NAND memory device and method of forming the same Grant 11,404,441 - Song , et al. August 2, 2	2022-08-02
Method For Forming Channel Hole Plug Of Three-dimensional Memory Device App 20220238556 - Xiao; Li Hong ; et al.	2022-07-28
Memory device and forming method thereof Grant 11,380,701 - Pu , et al. July 5, 2	2022-07-05
Multi-stack three-dimensional memory devices and methods for forming the same Grant 11,367,737 - Xiao June 21, 2	2022-06-21
Method for improving channel hole uniformity of a three-dimensional memory device Grant 11,329,061 - Xiao , et al. May 10, 2	2022-05-10
Method for forming channel hole plug of three-dimensional memory device Grant 11,309,327 - Xiao , et al. April 19, 2	2022-04-19
Three-dimensional memory devices and fabrication methods thereof Grant 11,302,715 - Liu , et al. April 12, 2	2022-04-12
Memory device and forming method thereof Grant 11,271,004 - Pu , et al. March 8, 2	2022-03-08
Structure Of 3d Nand Memory Device And Method Of Forming The Same App 20220013541 - Xiao; Li Hong ; et al.	2022-01-13
Vertical Memory Devices App 20210408026 - SHEN; Miao ; et al.	2021-12-30
Memory device and forming method thereof Grant 11,211,393 - Pu , et al. December 28, 2	2021-12-28
Three-dimensional Memory Devices And Fabricating Methods Thereof App 20210366930 - XIAO; Li Hong ; et al.	2021-11-25
Three-dimensional memory devices with stacked device chips using interposers Grant 11,183,488 - Liu , et al. November 23, 2	2021-11-23
Memory device using comb-like routing structure for reduced metal line loading Grant 11,164,633 - Huo , et al. November 2, 2	2021-11-02
Staircase structure for memory device Grant 11,145,666 - Lu , et al. October 12, 2	2021-10-12
Multi-stack three-dimensional memory devices Grant 11,145,645 - Xiao , et al. October 12, 2	2021-10-12
Three-dimensional memory devices and fabricating methods thereof Grant 11,121,150 - Xiao , et al. September 14, 2	2021-09-14
Memory stacks having silicon oxynitride gate-to-gate dielectric layers and methods for forming the same Grant 11,114,456 - Xiao September 7, 2	2021-09-07
Three-dimensional Memory Device Having A Shielding Layer And Method For Forming The Same App 20210272976 - Huo; Zongliang ; et al.	2021-09-02
Memory Device Using Comb-like Routing Structure For Reduced Metal Line Loading App 20210272632 - HUO; Zongliang ; et al.	2021-09-02
Staircase and contact structures for three-dimensional memory Grant 11,107,834 - Xiao August 31, 2	2021-08-31
Embedded Pad Structures Of Three-dimensional Memory Devices App 20210265377 - CHEN; Jun ; et al.	2021-08-26
Word line contact structure for three-dimensional memory devices and fabrication methods thereof Grant 11,101,276 - Zhu , et al. August 24, 2	2021-08-24
Three-dimensional memory devices and fabrication methods thereof Grant 11,081,496 - Xiao August 3, 2	2021-08-03
Three-dimensional Memory Devices And Fabrication Methods Thereof App 20210225874 - Xiao; Li Hong	2021-07-22
Three-dimensional memory device having a shielding layer and method for forming the same Grant 11,043,506 - Huo , et al. June 22, 2	2021-06-22
Three-dimensional memory devices and fabricating methods thereof Grant 11,031,413 - Xiao , et al. June 8, 2	2021-06-08
Three-dimensional Memory Devices And Fabricating Methods Thereof App 20210167088 - XIAO; Li Hong ; et al.	2021-06-03
Memory device using comb-like routing structure for reduced metal line loading Grant 11,024,384 - Huo , et al. June 1, 2	2021-06-01
Multi-stack three-dimensional memory devices and methods for forming the same Grant 11,011,539 - Xiao May 18, 2	2021-05-18
Three-dimensional memory devices and fabrication methods thereof Grant 11,011,540 - Xiao May 18, 2	2021-05-18
Novel 3d Nand Memory Device And Method Of Forming The Same App 20210143179 - SONG; Yali ; et al.	2021-05-13
Novel 3d Nand Memory Device And Method Of Forming The Same App 20210143180 - SONG; Yali ; et al.	2021-05-13
Three-dimensional memory devices and fabrication methods thereof Grant 11,004,861 - Xiao May 11, 2	2021-05-11
Embedded Pad Structures of Three-Dimensional Memory Devices and Fabrication Methods Thereof App 20210134824 - CHEN; Jun ; et al.	2021-05-06
Memory Device Using Comb-like Routing Structure For Reduced Metal Line Loading App 20210118511 - HUO; Zongliang ; et al.	2021-04-22
Memory Device And Forming Method Thereof App 20210118896 - PU; Yue Qiang ; et al.	2021-04-22
Multi-deck three-dimensional memory devices and methods for forming the same Grant 10,985,142 - Xiao April 20, 2	2021-04-20
Three-dimensional Memory Devices And Fabrication Methods Thereof App 20210104547 - Xiao; Li Hong	2021-04-08
Memory Stacks Having Silicon Nitride Gate-to-gate Dielectric Layers And Methods For Forming The Same App 20210104545 - Xiao; Li Hong	2021-04-08
Three-dimensional Memory Devices And Fabrication Methods Thereof App 20210104548 - Xiao; Li Hong	2021-04-08
Three-dimensional Memory Device Having A Shielding Layer And Method For Forming The Same App 20210104534 - Huo; Zongliang ; et al.	2021-04-08
Three-dimensional Memory Devices And Fabrication Methods Thereof App 20210104541 - Liu; Jun ; et al.	2021-04-08
Memory Stacks Having Silicon Oxynitride Gate-to-gate Dielectric Layers And Methods For Forming The Same App 20210104544 - Xiao; Li Hong	2021-04-08
Memory Device And Forming Method Thereof App 20210104532 - PU; Yue Qiang ; et al.	2021-04-08
Three-dimensional Memory Devices And Fabrication Methods Thereof App 20210104546 - Xiao; Li Hong	2021-04-08
Multi-stack Three-dimensional Memory Devices And Methods For Forming The Same App 20210104543 - Xiao; Li Hong	2021-04-08
Memory Device And Forming Method Thereof App 20210098481 - PU; Yue Qiang ; et al.	2021-04-01
Three-dimensional memory devices and fabrication methods thereof Grant 10,964,718 - Xiao March 30, 2	2021-03-30
Three-dimensional Memory Devices And Fabrication Methods Thereof App 20210091114 - Liu; Jun ; et al.	2021-03-25
3D NAND memory device and method of forming the same Grant 10,950,623 - Song , et al. March 16, 2	2021-03-16
Through array contact (TAC) for three-dimensional memory devices Grant 10,937,806 - Tao , et al. March 2, 2	2021-03-02
Method for forming staircase structure of three-dimensional memory device Grant 10,930,662 - Zhou , et al. February 23, 2	2021-02-23
Embedded pad structures of three-dimensional memory devices and fabrication methods thereof Grant 10,930,661 - Chen , et al. February 23, 2	2021-02-23
Multiple-stack Three-dimensional Memory Device And Fabrication Method Thereof App 20210043651 - LIU; Jun ; et al.	2021-02-11
Memory device and forming method thereof Grant 10,910,390 - Pu , et al. February 2, 2	2021-02-02
High-.kappa. dielectric layer in three-dimensional memory devices and methods for forming the same Grant 10,892,277 - Xiao January 12, 2	2021-01-12
Three-dimensional memory devices and fabrication methods thereof Grant 10,892,276 - Liu , et al. January 12, 2	2021-01-12
Three-dimensional memory devices and fabrication methods thereof Grant 10,886,294 - Liu , et al. January 5, 2	2021-01-05
Memory device using comb-like routing structure for reduced metal line loading Grant 10,878,911 - Huo , et al. December 29, 2	2020-12-29
Multiple-stack three-dimensional memory device and fabrication method thereof Grant 10,868,031 - Liu , et al. December 15, 2	2020-12-15
Staircase And Contact Structures For Three-dimensional Memory App 20200388635 - XIAO; Li Hong	2020-12-10
Bonded Semiconductor Structures Having Bonding Contacts Made Of Indiffusible Conductive Materials And Methods For Forming The Same App 20200381384 - Huo; Zongliang ; et al.	2020-12-03
Three-dimensional Memory Devices With Stacked Device Chips Using Interposers App 20200381408 - Liu; Jun ; et al.	2020-12-03
Three-dimensional Memory Device Having A Shielding Layer And Method For Forming The Same App 20200357812 - Huo; Zongliang ; et al.	2020-11-12
Memory Device Using Comb-like Routing Structure For Reduced Metal Line Loading App 20200335167 - HUO; Zongliang ; et al.	2020-10-22
Three-dimensional Memory Device With Deposited Semiconductor Plugs And Methods For Forming The Same App 20200328225 - Xiao; Li Hong	2020-10-15
Three-dimensional memory devices with stacked device chips using interposers Grant 10,797,028 - Liu , et al. October 6, 2	2020-10-06
Staircase and contact structures for three-dimensional memory Grant 10,797,075 - Xiao October 6, 2	2020-10-06
Memory Stacks Having Silicon Oxynitride Gate-to-gate Dielectric Layers And Methods For Forming The Same App 20200312867 - Xiao; Li Hong	2020-10-01
Three-dimensional Memory Devices And Fabrication Methods Thereof App 20200312869 - Xiao; Li Hong	2020-10-01
Three-dimensional Memory Devices And Fabrication Methods Thereof App 20200312872 - Xiao; Li Hong	2020-10-01
Three-dimensional Memory Devices And Fabrication Methods Thereof App 20200312870 - Xiao; Li Hong	2020-10-01
Three-dimensional Memory Devices And Fabrication Methods Thereof App 20200312873 - Xiao; Li Hong	2020-10-01
Three-dimensional Memory Devices And Fabrication Methods Thereof App 20200312871 - Xiao; Li Hong	2020-10-01
Memory Stacks Having Silicon Nitride Gate-to-gate Dielectric Layers And Methods For Forming The Same App 20200312868 - Xiao; Li Hong	2020-10-01
High-k Dielectric Layer In Three-dimensional Memory Devices And Methods For Forming The Same App 20200303399 - Xiao; Li Hong	2020-09-24
Bonded semiconductor structures having bonding contacts made of indiffusible conductive materials and methods for forming the same Grant 10,784,225 - Huo , et al. Sept	2020-09-22
Staircase Structure For Memory Device App 20200295019 - LU; Zhenyu ; et al.	2020-09-17
Methods for forming three-dimensional memory device having bent backside word lines Grant 10,770,478 - Xiao Sep	2020-09-08
Three-dimensional memory device having a shielding layer and method for forming the same Grant 10,763,274 - Huo , et al. Sep	2020-09-01
Memory device using comb-like routing structure for reduced metal line loading Grant 10,762,965 - Huo , et al. Sep	2020-09-01
Through Array Contact (tac) For Three-dimensional Memory Devices App 20200266211 - TAO; Qian ; et al.	2020-08-20
Bonded Semiconductor Structures Having Bonding Contacts Made Of Indiffusible Conductive Materials And Methods For Forming The Sa App 20200258857 - A1	2020-08-13
Word Line Contact Structure For Three-dimensional Memory Devices And Fabrication Methods Thereof App 20200258837 - A1	2020-08-13
Three-dimensional memory device having bent backside word lines Grant 10,714,490 - Xiao	2020-07-14
Method for Forming Staircase Structure of Three-Dimensional Memory Device App 20200219894 - ZHOU; Yu Ting ; et al.	2020-07-09
Method For Forming Dual Damascene Interconnect Structure App 20200211895 - Xu; Jian ; et al.	2020-07-02
Method for forming dual damascene interconnect structure Grant 10,692,756 - Xu , et al.	2020-06-23
Multi-stack Three-dimensional Memory Devices And Methods For Forming The Same App 20200194452 - Xiao; Li Hong	2020-06-18
Multi-deck Three-dimensional Memory Devices And Methods For Forming The Same App 20200194403 - Xiao; Li Hong	2020-06-18
Staircase And Contact Structures For Three-dimensional Memory App 20200185410 - XIAO; Li Hong	2020-06-11
Three-dimensional Memory Devices And Fabricating Methods Thereof App 20200185407 - XIAO; Li Hong ; et al.	2020-06-11
Methods Of Semiconductor Device Fabrication App 20200185270 - Liu; Sha Sha ; et al.	2020-06-11
Novel 3d Nand Memory Device And Method Of Forming The Same App 20200185408 - SONG; Yali ; et al.	2020-06-11
Three-dimensional memory device having semiconductor plug formed using backside substrate thinning Grant 10,679,985 - Liu , et al.	2020-06-09
Staircase structure for memory device Grant 10,680,003 - Lu , et al.	2020-06-09
Memory Device Using Comb-like Routing Structure For Reduced Metal Line Loading App 20200176058 - HUO; Zongliang ; et al.	2020-06-04
Multi-stack Three-dimensional Memory Devices App 20200176443 - Xiao; Li Hong ; et al.	2020-06-04
Word line contact structure for three-dimensional memory devices and fabrication methods thereof Grant 10,672,711 - Zhu , et al.	2020-06-02
Three-dimensional Memory Devices And Fabricating Methods Thereof App 20200168627 - XIAO; Li Hong ; et al.	2020-05-28
Three-dimensional Memory Devices And Fabrication Methods Thereof App 20200168625 - Liu; Jun ; et al.	2020-05-28
Three-dimensional Memory Devices And Fabrication Methods Thereof App 20200168626 - Liu; Jun ; et al.	2020-05-28
Methods of semiconductor device fabrication Grant 10,665,500 - Liu , et al.	2020-05-26
Through array contact (TAC) for three-dimensional memory devices Grant 10,658,378 - Tao , et al.	2020-05-19
Array common source structures of three-dimensional memory devices and fabricating methods thereof Grant 10,658,379 - Xiao , et al.	2020-05-19
Memory device and forming method thereof Grant 10,651,193 - Xiao , et al.	2020-05-12
Structure Of 3d Nand Memory Device And Method Of Forming The Same App 20200135752 - Xiao; Li Hong ; et al.	2020-04-30
Three-dimensional memory devices having transferred interconnect layer and methods for forming the same Grant 10,636,813 - Xiao	2020-04-28
Three-dimensional Memory Device Having Semiconductor Plug Formed Using Backside Substrate Thinning App 20200126974 - Liu; Shasha ; et al.	2020-04-23
Vertical Memory Devices App 20200119031 - Shen; Miao ; et al.	2020-04-16
3D memory device and method for forming 3D memory device Grant 10,608,013 - Xiao	2020-03-31
3d Memory Device And Method For Forming 3d Memory Device App 20200098781 - Xiao; Li Hong	2020-03-26
Multi-stack Three-dimensional Memory Devices App 20200098748 - Xiao; Li Hong ; et al.	2020-03-26
Multi-stack three-dimensional memory devices Grant 10,600,781 - Xiao , et al.	2020-03-24
Multi-deck three-dimensional memory devices and methods for forming the same Grant 10,600,763 - Xiao	2020-03-24
Memory Device Using Comb-like Routing Structure For Reduced Metal Line Loading App 20200082886 - HUO; Zongliang ; et al.	2020-03-12
Embedded Pad Structures of Three-Dimensional Memory Devices and Fabrication Methods Thereof App 20200058669 - CHEN; Jun ; et al.	2020-02-20
Multiple-stack Three-dimensional Memory Device And Fabrication Method Thereof App 20200035699 - LIU; Jun ; et al.	2020-01-30
Method for forming staircase structure of three-dimensional memory device Grant 10,529,732 - Zhou , et al. J	2020-01-07
Three-dimensional Memory Device Having A Shielding Layer And Method For Forming The Same App 20200006371 - Huo; Zongliang ; et al.	2020-01-02
Three-dimensional Memory Device Having A Shielding Layer And Method For Forming The Same App 20200006370 - Huo; Zongliang ; et al.	2020-01-02
Three-dimensional Memory Devices With Stacked Device Chips Using Interposers App 20200006299 - Liu; Jun ; et al.	2020-01-02
Method for forming dual-deck channel hole structure of three-dimensional memory device Grant 10,515,975 - Tao , et al. Dec	2019-12-24
Memory device using comb-like routing structure for reduced metal line loading Grant 10,510,415 - Huo , et al. Dec	2019-12-17
Method For Forming Dual-deck Channel Hole Structure Of Three-dimensional Memory Device App 20190378849 - Tao; Qian ; et al.	2019-12-12
Memory Device and Forming Method Thereof App 20190378853 - XIAO; Li Hong ; et al.	2019-12-12
Method of forming staircase structures for three-dimensional memory device double-sided routing Grant 10,483,280 - Xiao , et al. Nov	2019-11-19
Through Array Contact (tac) For Three-dimensional Memory Devices App 20190341399 - TAO; Qian ; et al.	2019-11-07
Memory Device and Forming Method Thereof App 20190326308 - PU; Yue Qiang ; et al.	2019-10-24
Method for Forming Channel Hole Plug of Three-Dimensional Memory Device App 20190326314 - XIAO; Li Hong ; et al.	2019-10-24
Method for Forming Staircase Structure of Three-Dimensional Memory Device App 20190326312 - ZHOU; Yu Ting ; et al.	2019-10-24
Method of forming staircase structures for three-dimensional memory device double-sided routing Grant 10,453,860 - Xiao Oc	2019-10-22
Array Common Source Structures Of Three-dimensional Memory Devices And Fabricating Methods Thereof App 20190103415 - Xiao; Li Hong ; et al.	2019-04-04
Word Line Contact Structure For Three-dimensional Memory Devices And Fabrication Methods Thereof App 20190096810 - ZHU; Jifeng ; et al.	2019-03-28
Staircase Structure For Memory Device App 20190081070 - LU; Zhenyu ; et al.	2019-03-14
Method To Improve Channel Hole Uniformity Of A Three-dimensional Memory Device App 20190074290 - XIAO; Li Hong ; et al.	2019-03-07