Xiao; Deming
Patent Applications and Registrations
Patent applications and USPTO patent grants for Xiao; Deming.The latest application filed is for "multi-die package structure and multi-die co-packing method".
- Xiao; Deming - Los Altos Hills CA
- Xiao; Deming - San Jose CA US
| Patent | Date |
|---|---|
| Multi-die Package Structure And Multi-die Co-packing Method App 20220230991 - Jiang; Hunt ; et al. | 2022-07-21 |
| Manufacturing method of self-aligned DMOS body pickup Grant 11,069,777 - Yoo , et al. July 20, 2 | 2021-07-20 |
| Method For Fabricating Ldmos With Self-aligned Body App 20180374949 - McGregor; Joel M. ; et al. | 2018-12-27 |
| Method for fabricating LDMOS with self-aligned body Grant 10,090,409 - McGregor , et al. October 2, 2 | 2018-10-02 |
| Method for fabricating LDMOS using CMP technology Grant 9,935,176 - Yoo , et al. April 3, 2 | 2018-04-03 |
| Method For Fabricating Ldmos With Self-aligned Body App 20180090613 - McGregor; Joel M. ; et al. | 2018-03-29 |
| Super junction device with deep trench and implant Grant 8,525,260 - Li , et al. September 3, 2 | 2013-09-03 |
| Super Junction Device With Deep Trench And Implant App 20110227147 - Li; Tiesheng ; et al. | 2011-09-22 |
| SEC | 0001308647 | Xiao Deming |
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