Patent | Date |
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Hybrid Integrated Semiconductor Tri-gate And Split Dual-gate Finfet Devices And Method For Manufacturing App 20180174909 - Xiao; De Yuan ;   et al. | 2018-06-21 |
Hybrid integrated semiconductor tri-gate and split dual-gate FinFET devices and method for manufacturing Grant 9,922,878 - Xiao , et al. March 20, 2 | 2018-03-20 |
FinFET device and fabrication method thereof Grant 9,853,026 - Xiao December 26, 2 | 2017-12-26 |
System and method for integrated circuits with cylindrical gate structures Grant 9,673,060 - Xiao , et al. June 6, 2 | 2017-06-06 |
System And Method For Integrated Circuits With Cylindrical Gate Structures App 20160260621 - XIAO; DE YUAN ;   et al. | 2016-09-08 |
Semiconductor device and fabrication method thereof Grant 9,437,709 - Xiao September 6, 2 | 2016-09-06 |
System and method for integrated circuits with cylindrical gate structures Grant 9,373,694 - Xiao , et al. June 21, 2 | 2016-06-21 |
Semiconductor Device And Fabrication Method Thereof App 20160149014 - XIAO; De Yuan | 2016-05-26 |
Semiconductor device and fabrication method thereof Grant 9,269,772 - Xiao February 23, 2 | 2016-02-23 |
System and method for integrated circuits with cylindrical gate structures Grant 9,224,812 - Xiao , et al. December 29, 2 | 2015-12-29 |
Semiconductor device and fabrication method thereof Grant 9,209,289 - Xiao December 8, 2 | 2015-12-08 |
Transistor device and fabrication method Grant 9,136,183 - Xiao September 15, 2 | 2015-09-15 |
Three-dimensional Quantum Well Transistor App 20150214302 - XIAO; DE YUAN | 2015-07-30 |
Three-dimensional quantum well transistor Grant 9,093,354 - Xiao July 28, 2 | 2015-07-28 |
Semiconductor Device And Manufacturing Method Thereof App 20150129926 - XIAO; De Yuan | 2015-05-14 |
Three-dimensional quantum well transistor and fabrication method Grant 9,029,222 - Xiao May 12, 2 | 2015-05-12 |
Semiconductor Device And Fabrication Method Thereof App 20150034905 - XIAO; De Yuan | 2015-02-05 |
Semiconductor Device And Fabrication Method Thereof App 20150034906 - XIAO; De Yuan | 2015-02-05 |
System And Method For Integrated Circuits With Cylindrical Gate Structures App 20150024559 - XIAO; DE YUAN ;   et al. | 2015-01-22 |
Finfet Device And Fabrication Method Thereof App 20140353715 - XIAO; De Yuan | 2014-12-04 |
Surrounding stacked gate multi-gate FET structure nonvolatile memory device Grant 8,889,510 - Xiao , et al. November 18, 2 | 2014-11-18 |
System and method for integrated circuits with cylindrical gate structures Grant 8,884,363 - Xiao , et al. November 11, 2 | 2014-11-11 |
Three-dimensional Quantum Well Transistor And Fabrication Method App 20140203243 - XIAO; DE YUAN | 2014-07-24 |
Transistor And Fabriation Method App 20140193956 - XIAO; DE YUAN | 2014-07-10 |
Surrounding Stacked Gate Multi-gate Fet Structure Nonvolatile Memory Device App 20130302951 - Xiao; De Yuan ;   et al. | 2013-11-14 |
Method and system for forming conductive bumping with copper interconnection Grant 8,581,366 - Xiao , et al. November 12, 2 | 2013-11-12 |
System And Method For Integrated Circuits With Cylindrical Gate Structures App 20130228833 - Xiao; De Yuan ;   et al. | 2013-09-05 |
3-D electrically programmable and erasable single-transistor non-volatile semiconductor memory device Grant 8,471,323 - Xiao , et al. June 25, 2 | 2013-06-25 |
Hybrid Integrated Semiconductor Tri-gate And Split Dual-gate Finfet Devices And Method For Manufacturing App 20130102116 - XIAO; DE YUAN ;   et al. | 2013-04-25 |
Method And System For Forming Conductive Bumping With Copper Interconnection App 20130029483 - XIAO; DE YUAN ;   et al. | 2013-01-31 |
Method and system for forming conductive bumping with copper interconnection Grant 8,293,635 - Xiao , et al. October 23, 2 | 2012-10-23 |
Method And System For Forming Conductive Bumping With Copper Interconnection App 20120088363 - XIAO; DE YUAN ;   et al. | 2012-04-12 |
System and method for integrated circuits with cylindrical gate structures App 20110291190 - Xiao; De Yuan ;   et al. | 2011-12-01 |
Method and system for forming conductive bumping with copper interconnection Grant 8,053,907 - Xiao , et al. November 8, 2 | 2011-11-08 |
3-d Electrically Programmable And Erasable Single-transistor Non-volatile Semiconductor Memory Device App 20110084327 - XIAO; DE YUAN ;   et al. | 2011-04-14 |
Method and System for Forming Conductive Bumping with Copper Interconnection App 20100013100 - Xiao; De Yuan ;   et al. | 2010-01-21 |