loadpatents
name:-0.014142036437988
name:-0.011553049087524
name:-0.013262033462524
Xiamen Changelight Co., Ltd. Patent Filings

Xiamen Changelight Co., Ltd.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Xiamen Changelight Co., Ltd..The latest application filed is for "mini light-emitting diode chip and manufacturing method thereof".

Company Profile
29.22.30
  • Xiamen Changelight Co., Ltd. - Fujian CN
  • XIAMEN CHANGELIGHT CO., LTD. - Xiamen CN
  • XIAMEN CHANGELIGHT CO., LTD. - Xiamen, Fujian CN
  • Xiamen Changelight Co., Ltd. - Xiamen, Fujian Province N/A CN
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Light emitting diode (LED) chip and manufacturing method and light emitting method thereof
Grant 11,456,399 - Wei , et al. September 27, 2
2022-09-27
Mini Light-emitting Diode Chip And Manufacturing Method Thereof
App 20220302352 - LIU; Yingce ;   et al.
2022-09-22
Semiconductor wafer and method for manufacturing semiconductor wafer thereof
Grant 11,328,924 - Chen , et al. May 10, 2
2022-05-10
Semiconductor chip of light emitting diode having quantum well layer stacked on N-type gallium nitride layer
Grant 11,201,260 - Wan , et al. December 14, 2
2021-12-14
Flip Light Emitting Chip and Manufacturing Method Thereof
App 20210343904 - LIU; Yingce ;   et al.
2021-11-04
Semiconductor Light Emitting Chip and Its Manufacturing Method
App 20210336089 - WU; Xingen ;   et al.
2021-10-28
Semiconductor Chip of Light Emitting Diode and Manufacturing Method Thereof
App 20210091262 - WU; Xingen ;   et al.
2021-03-25
Light-emitting diodes with buffer layers
Grant 10,937,926 - Lin , et al. March 2, 2
2021-03-02
Buffer layers having composite structures
Grant 10,916,422 - Chen , et al. February 9, 2
2021-02-09
High Voltage Light-emitting Diode And Method Of Producing The Same
App 20200251616 - Kind Code
2020-08-06
Flip-Chip of Light Emitting Diode and Manufacturing Method and Illuminating Method Thereof
App 20200251632 - Kind Code
2020-08-06
Semiconductor Wafer And Method For Manufacturing Semiconductor Wafer Thereof
App 20200219715 - CHEN; Kaixuan ;   et al.
2020-07-09
Light Emitting Diode (LED) Chip and Manufacturing Method and Light Emitting Method Thereof
App 20200176635 - WEI; Zhendong ;   et al.
2020-06-04
Selective growth of nitride buffer layer
Grant 10,658,541 - Chen , et al.
2020-05-19
Methods and display devices for micro-LED mass transfer processes
Grant 10,622,339 - Lin , et al.
2020-04-14
Semiconductor Chip of Light Emitting Diode and Quantum Well Layer Thereof and Manufacturing Method Thereof
App 20200091374 - WAN; Zhi ;   et al.
2020-03-19
Light-emitting Diode Chip And Method Of Manufacturing The Same
App 20200020830 - LIU; Yingce ;   et al.
2020-01-16
Methods And Display Devices For Micro-led Mass Transfer Processes
App 20200013760 - LIN; Zhiwei ;   et al.
2020-01-09
Light-emiting diode device and method of producing the same
Grant 10,468,550 - Lin , et al. No
2019-11-05
Light-emitting Diodes With Buffer Layers
App 20190296189 - Lin; Zhiwei ;   et al.
2019-09-26
Light-emiting Diode Device And Method Of Producing The Same
App 20190221709 - LIN; Zhiwei ;   et al.
2019-07-18
Light-emitting diode chips with enhanced brightness
Grant 10,333,028 - Chen , et al.
2019-06-25
Selective Growth Of Nitride Buffer Layer
App 20190103506 - Chen; Kaixuan ;   et al.
2019-04-04
Buffer Layers Having Composite Structures
App 20190088476 - Chen; Kaixuan ;   et al.
2019-03-21
Quartenary Led With Transparent Substrate And Aligned Electrodes
App 20190067525 - XU; Zhou ;   et al.
2019-02-28
Buffer layers having composite structures
Grant 10,121,656 - Chen , et al. November 6, 2
2018-11-06
HV-LED module having 3D light-emitting structure and manufacturing method thereof
Grant 10,043,850 - Lin , et al. August 7, 2
2018-08-07
Light-emitting Diode Chips With Enhanced Brightness
App 20170294557 - Chen; Liang ;   et al.
2017-10-12
Method of Manufacturing Buffer Layers Having Composite Structures
App 20170256403 - Chen; Kaixuan ;   et al.
2017-09-07
Buffer Layers Having Composite Structures
App 20170256404 - Chen; Kaixuan ;   et al.
2017-09-07
Hv-led Module Having 3d Light-emitting Structure And Manufacturing Method Thereof
App 20160276402 - Lin; Zhiwei ;   et al.
2016-09-22
Flexible Led Light Bar And Manufacturing Method Thereof
App 20150016116 - HUANG; ZUNXIANG ;   et al.
2015-01-15

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.

© 2024 USPTO.report | Privacy Policy | Resources | RSS Feed of Trademarks | Trademark Filings Twitter Feed