loadpatents
Patent applications and USPTO patent grants for Xia; Wanlin.The latest application filed is for "heat dissipation device assembly incorporating retention member".
Patent | Date |
---|---|
Mounting device for fans Grant 7,374,397 - Lee , et al. May 20, 2 | 2008-05-20 |
Heat sink assembly with retention module and clip Grant 7,277,288 - Lee , et al. October 2, 2 | 2007-10-02 |
Heat dissipation device assembly incorporating retention member Grant 7,126,824 - Lee , et al. October 24, 2 | 2006-10-24 |
Heat sink with combined fins Grant 7,044,197 - Lee , et al. May 16, 2 | 2006-05-16 |
Heat sink mounting assembly Grant 6,977,816 - Lee , et al. December 20, 2 | 2005-12-20 |
Heat sink mounting assembly Grant 6,944,026 - Lee , et al. September 13, 2 | 2005-09-13 |
Heat sink assembly having combined fins Grant 6,901,993 - Lee , et al. June 7, 2 | 2005-06-07 |
Heat dissipation device assembly incorporating retention member App 20050094379 - Lee, Hsieh Kun ;   et al. | 2005-05-05 |
Heat dissipation device with interlocking fins Grant 6,871,698 - Lee , et al. March 29, 2 | 2005-03-29 |
Heat sink mounting assembly App 20040228095 - Lee, Hsieh Kun ;   et al. | 2004-11-18 |
Heat sink assembly having combined fins App 20040206475 - Lee, Hsieh Kun ;   et al. | 2004-10-21 |
Heat sink with combined fins App 20040194925 - Lee, Hsieh Kun ;   et al. | 2004-10-07 |
Heat dissipation device with interlocking fins App 20040194922 - Lee, Hsieh Kun ;   et al. | 2004-10-07 |
Heat sink mounting assembly App 20040170001 - Lee, Hsieh Kun ;   et al. | 2004-09-02 |
Mounting device for fans App 20040162018 - Lee, Hsieh Kun ;   et al. | 2004-08-19 |
Clip for heat sink Grant 6,754,080 - Lee , et al. June 22, 2 | 2004-06-22 |
Heat sink assembly with retention module and clip App 20040105236 - Lee, Hsieh Kun ;   et al. | 2004-06-03 |
Clip for heat sink App 20040052053 - Lee, Hsieh Kun ;   et al. | 2004-03-18 |
Heat sink Grant D481,688 - Lee , et al. November 4, 2 | 2003-11-04 |
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