loadpatents
name:-0.011380910873413
name:-0.052618980407715
name:-0.0017509460449219
Xia; Wanlin Patent Filings

Xia; Wanlin

Patent Applications and Registrations

Patent applications and USPTO patent grants for Xia; Wanlin.The latest application filed is for "heat dissipation device assembly incorporating retention member".

Company Profile
0.10.9
  • Xia; Wanlin - Shenzhen CN
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Mounting device for fans
Grant 7,374,397 - Lee , et al. May 20, 2
2008-05-20
Heat sink assembly with retention module and clip
Grant 7,277,288 - Lee , et al. October 2, 2
2007-10-02
Heat dissipation device assembly incorporating retention member
Grant 7,126,824 - Lee , et al. October 24, 2
2006-10-24
Heat sink with combined fins
Grant 7,044,197 - Lee , et al. May 16, 2
2006-05-16
Heat sink mounting assembly
Grant 6,977,816 - Lee , et al. December 20, 2
2005-12-20
Heat sink mounting assembly
Grant 6,944,026 - Lee , et al. September 13, 2
2005-09-13
Heat sink assembly having combined fins
Grant 6,901,993 - Lee , et al. June 7, 2
2005-06-07
Heat dissipation device assembly incorporating retention member
App 20050094379 - Lee, Hsieh Kun ;   et al.
2005-05-05
Heat dissipation device with interlocking fins
Grant 6,871,698 - Lee , et al. March 29, 2
2005-03-29
Heat sink mounting assembly
App 20040228095 - Lee, Hsieh Kun ;   et al.
2004-11-18
Heat sink assembly having combined fins
App 20040206475 - Lee, Hsieh Kun ;   et al.
2004-10-21
Heat sink with combined fins
App 20040194925 - Lee, Hsieh Kun ;   et al.
2004-10-07
Heat dissipation device with interlocking fins
App 20040194922 - Lee, Hsieh Kun ;   et al.
2004-10-07
Heat sink mounting assembly
App 20040170001 - Lee, Hsieh Kun ;   et al.
2004-09-02
Mounting device for fans
App 20040162018 - Lee, Hsieh Kun ;   et al.
2004-08-19
Clip for heat sink
Grant 6,754,080 - Lee , et al. June 22, 2
2004-06-22
Heat sink assembly with retention module and clip
App 20040105236 - Lee, Hsieh Kun ;   et al.
2004-06-03
Clip for heat sink
App 20040052053 - Lee, Hsieh Kun ;   et al.
2004-03-18
Heat sink
Grant D481,688 - Lee , et al. November 4, 2
2003-11-04

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