| Patent | Date |
|---|
Amorphous silicon doped yttrium oxide films and methods of formation
Grant 11,370,669 - Sato , et al. June 28, 2 | 2022-06-28 |
Multizone flow gasbox for processing chamber
Grant 11,367,594 - Tong , et al. June 21, 2 | 2022-06-21 |
Hardmask Tuning By Electrode Adjustment
App 20220130665 - Tsiang; Michael Wenyoung ; et al. | 2022-04-28 |
Tensile Nitride Deposition Systems And Methods
App 20220130661 - Tsiang; Michael Wenyoung ; et al. | 2022-04-28 |
Systems And Methods For Forming Uv-cured Low-k Dielectric Films
App 20220108884 - Xie; Bo ; et al. | 2022-04-07 |
Systems And Methods For Depositing Low-k Dielectric Films
App 20220084815 - Xie; Bo ; et al. | 2022-03-17 |
Systems And Methods For Cleaning Low-k Deposition Chambers
App 20220081765 - Xie; Bo ; et al. | 2022-03-17 |
Self-Aligned Double Patterning With Spatial Atomic Layer Deposition
App 20220059362 - Li; Ning ; et al. | 2022-02-24 |
Methods And Systems To Modulate Film Stress
App 20220028660 - Tanaka; Tsutomu ; et al. | 2022-01-27 |
Systems And Methods For Depositing Low-k Dielectric Films
App 20210407792 - Xie; Bo ; et al. | 2021-12-30 |
Self-aligned double patterning with spatial atomic layer deposition
Grant 11,164,753 - Li , et al. November 2, 2 | 2021-11-02 |
Methods and systems to modulate film stress
Grant 11,158,489 - Tanaka , et al. October 26, 2 | 2021-10-26 |
Methods And Apparatus For Low Temperature Silicon Nitride Films
App 20210265157 - Yan; Wenbo ; et al. | 2021-08-26 |
Geometrically selective deposition of dielectric films utilizing low frequency bias
Grant 11,081,318 - Ohno , et al. August 3, 2 | 2021-08-03 |
Methods for ALD of Metal Oxides on Metal Surfaces
App 20210217610 - Bhuyan; Bhaskar Jyoti ; et al. | 2021-07-15 |
Atomic layer deposition of films comprising silicon, carbon and nitrogen using halogenated silicon precursors
Grant 11,028,478 - Nguyen , et al. June 8, 2 | 2021-06-08 |
Multizone Flow Gasbox For Processing Chamber
App 20210159053 - Tong; Mingle ; et al. | 2021-05-27 |
Methods and apparatus for low temperature silicon nitride films
Grant 11,017,997 - Yan , et al. May 25, 2 | 2021-05-25 |
Method and apparatus for deposition of low-k films
Grant 10,957,532 - Li , et al. March 23, 2 | 2021-03-23 |
Methods for ALD of metal oxides on metal surfaces
Grant 10,943,780 - Bhuyan , et al. March 9, 2 | 2021-03-09 |
Method and Apparatus for Selective Deposition of Dielectric Films
App 20210043448 - Li; Ning ; et al. | 2021-02-11 |
Methods And Apparatus For Deposition Of Low-K Films
App 20200332415 - Bhuyan; Bhaskar Jyoti ; et al. | 2020-10-22 |
Methods For Metal Oxide Post-Treatment
App 20200165725 - Sato; Tatsuya E. ; et al. | 2020-05-28 |
Method And Apparatus For Deposition Of Low-K Films
App 20200006064 - Li; Ning ; et al. | 2020-01-02 |
Methods And Apparatus For Low Temperature Silicon Nitride Films
App 20190348271 - Yan; Wenbo ; et al. | 2019-11-14 |
Method and apparatus for deposition of low-k films
Grant 10,453,678 - Li , et al. Oc | 2019-10-22 |
Amorphous Silicon Doped Yttrium Oxide Films And Methods of Formation
App 20190221426 - Sato; Tatsuya E. ; et al. | 2019-07-18 |
Geometrically Selective Deposition Of Dielectric Films Utilizing Low Frequency Bias
App 20190189400 - Ohno; Kenichi ; et al. | 2019-06-20 |
Selective deposition of silicon nitride films for spacer applications
Grant 10,319,583 - Li , et al. | 2019-06-11 |
Methods For ALD Of Metal Oxides On Metal Surfaces
App 20190157067 - Bhuyan; Bhaskar Jyoti ; et al. | 2019-05-23 |
Top lamp module for carousel deposition chamber
Grant 10,273,578 - Yudovsky , et al. | 2019-04-30 |
Methods for the continuous processing of substrates
Grant 10,236,198 - Wu , et al. | 2019-03-19 |
High temperature silicon oxide atomic layer deposition technology
Grant 10,170,298 - Yan , et al. J | 2019-01-01 |
Methods for depositing low K and low wet etch rate dielectric thin films
Grant 10,147,599 - Li , et al. De | 2018-12-04 |
Methods and apparatus for selective dry etch
Grant 10,134,581 - Li , et al. November 20, 2 | 2018-11-20 |
Method And Apparatus For Deposition Of Low-K Films
App 20180301333 - Li; Ning ; et al. | 2018-10-18 |
Atomic Layer Deposition Of Films Comprising Silicon, Carbon And Nitrogen Using Halogenated Silicon Precursors
App 20180291505 - Nguyen; Victor ; et al. | 2018-10-11 |
Method And Apparatus For Selective Deposition Of Dielectric Films
App 20180211833 - Li; Ning ; et al. | 2018-07-26 |
Atomic layer deposition of films comprising silicon, carbon and nitrogen using halogenated silicon precursors
Grant 10,023,958 - Nguyen , et al. July 17, 2 | 2018-07-17 |
PEALD of films comprising silicon nitride
Grant 9,984,868 - Nguyen , et al. May 29, 2 | 2018-05-29 |
Methods And Systems To Modulate Film Stress
App 20180130642 - Tanaka; Tsutomu ; et al. | 2018-05-10 |
High Temperature Silicon Oxide Atomic Layer Deposition Technology
App 20180076023 - Yan; Wenbo ; et al. | 2018-03-15 |
Methods For Depositing Low K And Low Wet Etch Rate Dielectric Thin Films
App 20180040470 - Li; Ning ; et al. | 2018-02-08 |
High temperature silicon oxide atomic layer deposition technology
Grant 9,875,888 - Yan , et al. January 23, 2 | 2018-01-23 |
Continuous Substrate Processing System
App 20170365491 - Wu; Banqiu ; et al. | 2017-12-21 |
Methods for depositing low k and low wet etch rate dielectric thin films
Grant 9,799,511 - Li , et al. October 24, 2 | 2017-10-24 |
Methods And Apparatus For Selective Dry Etch
App 20170263438 - Li; Ning ; et al. | 2017-09-14 |
Selective Deposition Of Silicon Nitride Films For Spacer Applications
App 20170263437 - Li; Ning ; et al. | 2017-09-14 |
Continuous substrate processing system
Grant 9,748,125 - Wu , et al. August 29, 2 | 2017-08-29 |
Resist Fortification For Magnetic Media Patterning
App 20170206922 - BENCHER; Christopher Dennis ; et al. | 2017-07-20 |
Resist fortification for magnetic media patterning
Grant 9,646,642 - Bencher , et al. May 9, 2 | 2017-05-09 |
Cu/barrier interface enhancement
Grant 9,633,861 - Ye , et al. April 25, 2 | 2017-04-25 |
Enhancing electrical property and UV compatibility of ultrathin blok barrier film
Grant 9,580,801 - Ba , et al. February 28, 2 | 2017-02-28 |
High Temperature Thermal ALD Silicon Nitride Films
App 20170053792 - Lu; Xinliang ; et al. | 2017-02-23 |
Methods For Depositing Low K And Low Wet Etch Rate Dielectric Thin Films
App 20160322214 - Li; Ning ; et al. | 2016-11-03 |
Cobalt selectivity improvement in selective cobalt process sequence
Grant 9,478,460 - Shek , et al. October 25, 2 | 2016-10-25 |
Precise critical dimension control using bilayer ALD
Grant 9,443,716 - Takeshita , et al. September 13, 2 | 2016-09-13 |
Cobalt Selectivity Improvement In Selective Cobalt Process Sequence
App 20160141203 - SHEK; MEI-YEE ; et al. | 2016-05-19 |
Precise Critical Dimension Control Using Bilayer ALD
App 20160104613 - Takeshita; Kenji ; et al. | 2016-04-14 |
High Temperature Silicon Oxide Atomic Layer Deposition Technology
App 20160099143 - Yan; Wenbo ; et al. | 2016-04-07 |
Top Lamp Module For Carousel Deposition Chamber
App 20160097122 - Yudovsky; Joseph ; et al. | 2016-04-07 |
Accurate film thickness control in gap-fill technology
Grant 9,297,073 - Li , et al. March 29, 2 | 2016-03-29 |
Enhancing Electrical Property And Uv Compatibility Of Ultrathin Blok Barrier Film
App 20160071724 - BA; Xiaolan ; et al. | 2016-03-10 |
Enhancing Uv Compatibility Of Low K Barrier Film
App 20160013049 - YE; Weifeng ; et al. | 2016-01-14 |
Hole Pattern For Uniform Illumination Of Workpiece Below A Capacitively Coupled Plasma Source
App 20150380221 - Liu; Ren ; et al. | 2015-12-31 |
Accurate Film Thickness Control In Gap-fill Technology
App 20150299856 - LI; Ning ; et al. | 2015-10-22 |
Seamless Gap-fill With Spatial Atomic Layer Deposition
App 20150255324 - LI; Ning ; et al. | 2015-09-10 |
In-situ Carbon And Oxide Doping Of Atomic Layer Deposition Silicon Nitride Films
App 20150252477 - NGUYEN; Victor ; et al. | 2015-09-10 |
Cobalt selectivity improvement in selective cobalt process sequence
Grant 9,105,695 - Shek , et al. August 11, 2 | 2015-08-11 |
Self-Aligned Double Patterning With Spatial Atomic Layer Deposition
App 20150200110 - Li; Ning ; et al. | 2015-07-16 |
Atomic Layer Deposition Of Films Comprising Silicon, Carbon And Nitrogen Using Halogenated Silicon Precursors
App 20150147484 - Nguyen; Victor ; et al. | 2015-05-28 |
Cobalt Selectivity Improvement In Selective Cobalt Process Sequence
App 20140349480 - SHEK; Mei-yee ; et al. | 2014-11-27 |
Apparatus and methods for silicon oxide CVD resist planarization
Grant 8,852,962 - Verhaverbeke , et al. October 7, 2 | 2014-10-07 |
PEALD of Films Comprising Silicon Nitride
App 20140273529 - Nguyen; Victor ; et al. | 2014-09-18 |
Cu/barrier Interface Enhancement
App 20140273438 - YE; Weifeng ; et al. | 2014-09-18 |
Vbd And Tddb Improvement Thru Interface Engineering
App 20140273516 - XIA; Li-Qun ; et al. | 2014-09-18 |
Post-Deposition Treatment Methods For Silicon Nitride
App 20140273530 - Nguyen; Victor ; et al. | 2014-09-18 |
Plasma Doping Of Silicon-Containing Films
App 20140273524 - Nguyen; Victor ; et al. | 2014-09-18 |
Copper oxide removal techniques
Grant 8,758,638 - Ye , et al. June 24, 2 | 2014-06-24 |
Method to increase tensile stress of silicon nitride films using a post PECVD deposition UV cure
Grant 8,753,989 - Balseanu , et al. June 17, 2 | 2014-06-17 |
Resist Fortification For Magnetic Media Patterning
App 20140147700 - BENCHER; Christopher Dennis ; et al. | 2014-05-29 |
Resist fortification for magnetic media patterning
Grant 8,658,242 - Bencher , et al. February 25, 2 | 2014-02-25 |
Method And Apparatus For Low Temperature ALD Deposition
App 20140023794 - Mahajani; Maitreyee ; et al. | 2014-01-23 |
MODULATED COMPOSITIONAL AND STRESS CONTROLLED MULTILAYER ULTRATHIN CONFORMAL SiNx DIELECTRICS USED IN NANO DEVICE FABRICATION
App 20130333923 - Balseanu; Mihaela ; et al. | 2013-12-19 |
Plasma-enhanced chemical vapor deposition of crystalline germanium
Grant 8,598,020 - Nguyen , et al. December 3, 2 | 2013-12-03 |
Low temperature plasma enhanced chemical vapor deposition of conformal silicon carbon nitride and silicon nitride films
Grant 8,586,487 - Nguyen , et al. November 19, 2 | 2013-11-19 |
Methods of modifying interlayer adhesion
Grant 8,569,166 - Schmitt , et al. October 29, 2 | 2013-10-29 |
Boron film interface engineering
Grant 8,563,090 - Balseanu , et al. October 22, 2 | 2013-10-22 |
Multilayered low k cap with conformal gap fill and UV stable compressive stress properties
Grant 8,536,069 - Balseanu , et al. September 17, 2 | 2013-09-17 |
Adhesion Improvement For Low K Dielectrics To Conductive Materials
App 20130230986 - RAJAGOPALAN; NAGARAJAN ; et al. | 2013-09-05 |
Method of forming flash memory with ultraviolet treatment
Grant 8,501,568 - Balseanu , et al. August 6, 2 | 2013-08-06 |
Rotary Substrate Processing System
App 20130192761 - Yudovsky; Joseph ; et al. | 2013-08-01 |
Multi-Chamber Substrate Processing System
App 20130196078 - Yudovsky; Joseph ; et al. | 2013-08-01 |
Continuous Substrate Processing System
App 20130192524 - Wu; Banqiu ; et al. | 2013-08-01 |
Engineering Dielectric Films For Cmp Stop
App 20130189841 - Balseanu; Mihaela ; et al. | 2013-07-25 |
Multilayered low k cap with conformal gap fill and UV stable compressive stress properties
Grant 8,492,880 - Balseanu , et al. July 23, 2 | 2013-07-23 |
Low Temperature Plasma Enhanced Chemical Vapor Deposition Of Conformal Silicon Carbon Nitride And Silicon Nitride Films
App 20130183835 - Nguyen; Victor ; et al. | 2013-07-18 |
Prevention and reduction of solvent and solution penetration into porous dielectrics using a thin barrier layer
Grant 8,481,422 - Chan , et al. July 9, 2 | 2013-07-09 |
Apparatus And Methods For Silicon Oxide Cvd Resist Planarization
App 20130130405 - VERHAVERBEKE; Steven ; et al. | 2013-05-23 |
Method to minimize wet etch undercuts and provide pore sealing of extreme low k (k<2.5) dielectrics
Grant 8,445,075 - Xu , et al. May 21, 2 | 2013-05-21 |
Air gap integration scheme
Grant 8,389,376 - Demos , et al. March 5, 2 | 2013-03-05 |
MULTILAYERED LOW k CAP WITH CONFORMAL GAP FILL AND UV STABLE COMPRESSIVE STRESS PROPERTIES
App 20130005146 - Balseanu; Mihaela ; et al. | 2013-01-03 |
Silicon dioxide layer deposited with BDEAS
Grant 8,343,881 - Lee , et al. January 1, 2 | 2013-01-01 |
Method for depositing boron-rich films for lithographic mask applications
Grant 8,337,950 - Nguyen , et al. December 25, 2 | 2012-12-25 |
Fabrication of through-silicon vias on silicon wafers
Grant 8,329,575 - Rajagopalan , et al. December 11, 2 | 2012-12-11 |
Copper Oxide Removal Techniques
App 20120289049 - YE; WEIFENG ; et al. | 2012-11-15 |
Adhesion Improvement Of Dielectric Barrier To Copper By The Addition Of Thin Interface Layer
App 20120276301 - Lee; Yong-Won ; et al. | 2012-11-01 |
Fabrication of through-silicon vias on silicon wafers
Grant 8,283,237 - Rajagopalan , et al. October 9, 2 | 2012-10-09 |
MULTILAYERED LOW k CAP WITH CONFORMAL GAP FILL AND UV STABLE COMPRESSIVE STRESS PROPERTIES
App 20120248617 - Balseanu; Mihaela ; et al. | 2012-10-04 |
Method of forming a non-volatile memory having a silicon nitride charge trap layer
Grant 8,252,653 - Balseanu , et al. August 28, 2 | 2012-08-28 |
Prevention And Reduction Of Solvent And Solution Penetration Into Porous Dielectrics Using A Thin Barrier Layer
App 20120208366 - Chan; Kelvin ; et al. | 2012-08-16 |
Prevention and reduction of solvent and solution penetration into porous dielectrics using a thin barrier layer
Grant 8,236,684 - Chan , et al. August 7, 2 | 2012-08-07 |
Method To Increase Silicon Nitride Tensile Stress Using Nitrogen Plasma In-situ Treatment And Ex-situ Uv Cure
App 20120196450 - Balseanu; Mihaela ; et al. | 2012-08-02 |
Method To Increase Tensile Stress Of Silicon Nitride Films Using A Post Pecvd Deposition Uv Cure
App 20120196452 - Balseanu; Mihaela ; et al. | 2012-08-02 |
Resist Fortification For Magnetic Media Patterning
App 20120196155 - Bencher; Christopher D. ; et al. | 2012-08-02 |
Fabrication Of Through-silicon Vias On Silicon Wafers
App 20120164827 - RAJAGOPALAN; Nagarajan ; et al. | 2012-06-28 |
Fabrication Of Through-silicon Vias On Silicon Wafers
App 20120164829 - Rajagopalan; Nagarajan ; et al. | 2012-06-28 |
Dual Delivery Chamber Design
App 20120097330 - Iyengar; Prahallad ; et al. | 2012-04-26 |
Boron nitride and boron-nitride derived materials deposition method
Grant 8,148,269 - Balseanu , et al. April 3, 2 | 2012-04-03 |
Post-deposition treatment to enhance properties of Si-O-C low K films
Grant 8,143,174 - Xia , et al. March 27, 2 | 2012-03-27 |
Method to increase silicon nitride tensile stress using nitrogen plasma in-situ treatment and ex-situ UV cure
Grant 8,138,104 - Balseanu , et al. March 20, 2 | 2012-03-20 |
Method to increase tensile stress of silicon nitride films using a post PECVD deposition UV cure
Grant 8,129,290 - Balseanu , et al. March 6, 2 | 2012-03-06 |
Plasma-enhanced Chemical Vapor Deposition Of Crystalline Germanium
App 20110315992 - Nguyen; Victor T. ; et al. | 2011-12-29 |
Method of depositing boron nitride and boron nitride-derived materials
Grant 8,084,105 - Huh , et al. December 27, 2 | 2011-12-27 |
Silicon Dioxide Layer Deposited With Bdeas
App 20110298099 - LEE; Yong-Won ; et al. | 2011-12-08 |
Methods Of Modifying Interlayer Adhesion
App 20110237085 - SCHMITT; FRANCIMAR CAMPANA ; et al. | 2011-09-29 |
Methods to obtain low k dielectric barrier with superior etch resistivity
Grant 7,964,442 - Xu , et al. June 21, 2 | 2011-06-21 |
Method of modifying interlayer adhesion
Grant 7,960,294 - Schmitt , et al. June 14, 2 | 2011-06-14 |
Decreasing the etch rate of silicon nitride by carbon addition
Grant 7,951,730 - Bhatia , et al. May 31, 2 | 2011-05-31 |
Methods And Apparatus Of Creating Airgap In Dielectric Layers For The Reduction Of Rc Delay
App 20110104891 - AL-BAYATI; AMIR ; et al. | 2011-05-05 |
METHOD TO MINIMIZE WET ETCH UNDERCUTS AND PROVIDE PORE SEALING OF EXTREME LOW K (K<2.5) DIELECTRICS
App 20110092077 - XU; HUIWEN ; et al. | 2011-04-21 |
Method to improve the step coverage and pattern loading for dielectric films
Grant 7,923,386 - Balseanu , et al. April 12, 2 | 2011-04-12 |
Gapfill improvement with low etch rate dielectric liners
Grant 7,910,491 - Soo Kwon , et al. March 22, 2 | 2011-03-22 |
Methods and apparatus of creating airgap in dielectric layers for the reduction of RC delay
Grant 7,879,683 - Al-Bayati , et al. February 1, 2 | 2011-02-01 |
Methods and systems for forming at least one dielectric layer
Grant 7,871,926 - Xia , et al. January 18, 2 | 2011-01-18 |
Method to mitigate impact of UV and E-beam exposure on semiconductor device film properties by use of a bilayer film
Grant 7,851,384 - Liu , et al. December 14, 2 | 2010-12-14 |
Low temperature conformal oxide formation and applications
Grant 7,851,385 - Spuller , et al. December 14, 2 | 2010-12-14 |
Method of forming non-volatile memory having charge trap layer with compositional gradient
Grant 7,816,205 - Balseanu , et al. October 19, 2 | 2010-10-19 |
Method to deposit functionally graded dielectric films via chemical vapor deposition using viscous precursors
Grant 7,802,538 - Padhi , et al. September 28, 2 | 2010-09-28 |
Engineering Boron-rich Films For Lithographic Mask Applications
App 20100233633 - Nguyen; Victor ; et al. | 2010-09-16 |
Method to increase the compressive stress of PECVD dielectric films
Grant 7,790,635 - Balseanu , et al. September 7, 2 | 2010-09-07 |
Method to improve the step coverage and pattern loading for dielectric films
Grant 7,780,865 - Balseanu , et al. August 24, 2 | 2010-08-24 |
Two-layer film for next generation damascene barrier application with good oxidation resistance
Grant 7,749,563 - Zheng , et al. July 6, 2 | 2010-07-06 |
Low dielectric (low k) barrier films with oxygen doping by plasma-enhanced chemical vapor deposition (PECVD)
Grant 7,745,328 - Yim , et al. June 29, 2 | 2010-06-29 |
Novel Air Gap Integration Scheme
App 20100151671 - Demos; Alexandros T. ; et al. | 2010-06-17 |
Method to increase the compressive stress of PECVD silicon nitride films
Grant 7,732,342 - Balseanu , et al. June 8, 2 | 2010-06-08 |
Selective copper-silicon-nitride layer formation for an improved dielectric film/copper line interface
Grant 7,718,548 - Lee , et al. May 18, 2 | 2010-05-18 |
Boron derived materials deposition method
Grant 7,704,816 - Huh , et al. April 27, 2 | 2010-04-27 |
Non-volatile Memory Having Charge Trap Layer With Compositional Gradient
App 20100096688 - Balseanu; Mihaela ; et al. | 2010-04-22 |
Boron Film Interface Engineering
App 20100098884 - BALSEANU; MIHAELA ; et al. | 2010-04-22 |
Non-volatile Memory Having Silicon Nitride Charge Trap Layer
App 20100096687 - BALSEANU; Mihaela ; et al. | 2010-04-22 |
Flash Memory With Treated Charge Trap Layer
App 20100099247 - Balseanu; Mihaela ; et al. | 2010-04-22 |
Gapfill Improvement With Low Etch Rate Dielectric Liners
App 20100099236 - Kwon; Young Soo ; et al. | 2010-04-22 |
Oxide-like seasoning for dielectric low k films
Grant 7,700,486 - Park , et al. April 20, 2 | 2010-04-20 |
Air gap integration scheme
Grant 7,670,924 - Demos , et al. March 2, 2 | 2010-03-02 |
Method To Improve The Step Coverage And Pattern Loading For Dielectric Films
App 20100048030 - BALSEANU; MIHAELA ; et al. | 2010-02-25 |
Prevention And Reduction Of Solvent And Solution Penetration Into Porous Dielectrics Using A Thin Barrier Layer
App 20090325381 - CHAN; KELVIN ; et al. | 2009-12-31 |
Methods And Appartus To Prevent Contamination Of A Photoresist Layer On A Substrate
App 20090317628 - Naik; Mehul ; et al. | 2009-12-24 |
Method Of Modifying Interlayer Adhesion
App 20090305514 - Schmitt; Francimar Campana ; et al. | 2009-12-10 |
Method For Critical Dimension Shrink Using Conformal Pecvd Films
App 20090286402 - Xia; Li-Qun ; et al. | 2009-11-19 |
Multi-stage curing of low K nano-porous films
Grant 7,611,996 - Schmitt , et al. November 3, 2 | 2009-11-03 |
Adhesion And Electromigration Improvement Between Dielectric And Conductive Layers
App 20090269923 - Lee; Sang M. ; et al. | 2009-10-29 |
Boron Nitride And Boron-nitride Derived Materials Deposition Method
App 20090263972 - Balseanu; Mihaela ; et al. | 2009-10-22 |
Method to improve the step coverage and pattern loading for dielectric films
Grant 7,601,651 - Balseanu , et al. October 13, 2 | 2009-10-13 |
Multi step ebeam process for modifying dielectric materials
Grant 7,588,803 - Demos , et al. September 15, 2 | 2009-09-15 |
Integration process for fabricating stressed transistor structure
Grant 7,566,655 - Balseanu , et al. July 28, 2 | 2009-07-28 |
Methods of modifying interlayer adhesion
Grant 7,563,728 - Schmitt , et al. July 21, 2 | 2009-07-21 |
Method For Integrating Porous Low-k Dielectric Layers
App 20090140418 - LI; SIYI ; et al. | 2009-06-04 |
Decreasing The Etch Rate Of Silicon Nitride By Carbon Addition
App 20090137132 - Bhatia; Ritwik ; et al. | 2009-05-28 |
Adhesion Improvement Of Dielectric Barrier To Copper By The Addition Of Thin Interface Layer
App 20090107626 - Lee; Yong-Won ; et al. | 2009-04-30 |
Methods and Systems for Forming at Least One Dielectric Layer
App 20090104764 - Xia; Li-Qun ; et al. | 2009-04-23 |
Methods And Apparatus Of Creating Airgap In Dielectric Layers For The Reduction Of Rc Delay
App 20090093112 - AL-BAYATI; AMIR ; et al. | 2009-04-09 |
Method For Forming An Air Gap In Multilevel Interconnect Structure
App 20090093100 - Xia; Li-Qun ; et al. | 2009-04-09 |
Methods To Obtain Low K Dielectric Barrier With Superior Etch Resistivity
App 20090093132 - XU; HUIWEN ; et al. | 2009-04-09 |
Low Temperature Conformal Oxide Formation And Applications
App 20090087977 - SPULLER; MATTHEW ; et al. | 2009-04-02 |
Decreasing the etch rate of silicon nitride by carbon addition
Grant 7,501,355 - Bhatia , et al. March 10, 2 | 2009-03-10 |
Low Dielectric (low K) Barrier Films With Oxygen Doping By Plasma-enhanced Chemical Vapor Deposition (pecvd)
App 20090053902 - Yim; Kang Sub ; et al. | 2009-02-26 |
Boron Derived Materials Deposition Method
App 20090017640 - Huh; Jeong-Uk ; et al. | 2009-01-15 |
Methods and apparatuses promoting adhesion of dielectric barrier film to copper
App 20090011148 - Rajagopalan; Nagarajan ; et al. | 2009-01-08 |
Low dielectric (low k) barrier films with oxygen doping by plasma-enhanced chemical vapor deposition (PECVD)
Grant 7,465,659 - Yim , et al. December 16, 2 | 2008-12-16 |
Adhesion improvement for low k dielectrics
Grant 7,459,404 - Li , et al. December 2, 2 | 2008-12-02 |
Boron Nitride And Boron Nitride-derived Materials Deposition Method
App 20080292798 - Huh; Jeong-Uk ; et al. | 2008-11-27 |
Method of forming a low-K dual damascene interconnect structure
Grant 7,435,685 - Delgadino , et al. October 14, 2 | 2008-10-14 |
Low temperature process to produce low-K dielectrics with low stress by plasma-enhanced chemical vapor deposition (PECVD)
Grant 7,422,776 - Yim , et al. September 9, 2 | 2008-09-09 |
Method for forming ultra low k films using electron beam
Grant 7,422,774 - Zheng , et al. September 9, 2 | 2008-09-09 |
Selective Copper-silicon-nitride Layer Formation For An Improved Dielectric Film/copper Line Interface
App 20080213997 - Lee; Sang M. ; et al. | 2008-09-04 |
Novel Air Gap Integration Scheme
App 20080182404 - DEMOS; ALEXANDROS T. ; et al. | 2008-07-31 |
Method To Increase The Compressive Stress Of Pecvd Dielectric Films
App 20080146007 - Balseanu; Mihaela ; et al. | 2008-06-19 |
Method Of Forming A Low-k Dual Damascene Interconnect Structure
App 20080145998 - DELGADINO; GERARDO A. ; et al. | 2008-06-19 |
Post-deposition Treatment To Enhance Properties Of Si-o-c Low K Films
App 20080132087 - Xia; Li-Qun ; et al. | 2008-06-05 |
Multi-stage Curing Of Low K Nano-porous Films
App 20080099920 - Schmitt; Francimar ; et al. | 2008-05-01 |
Post-deposition treatment to enhance properties of Si-O-C low k films
Grant 7,326,657 - Xia , et al. February 5, 2 | 2008-02-05 |
Method To Increase Silicon Nitride Tensile Stress Using Nitrogen Plasma In-situ Treatment And Ex-situ Uv Cure
App 20080020591 - Balseanu; Mihaela ; et al. | 2008-01-24 |
Decreasing the etch rate of silicon nitride by carbon addition
App 20080014761 - Bhatia; Ritwik ; et al. | 2008-01-17 |
Method of depositing low k barrier layers
Grant 7,319,068 - Xia , et al. January 15, 2 | 2008-01-15 |
METHOD TO MINIMIZE WET ETCH UNDERCUTS AND PROVIDE PORE SEALING OF EXTREME LOW K (K<2.5) DIELECTRICS
App 20070287301 - Xu; Huiwen ; et al. | 2007-12-13 |
Method To Mitigate Impact Of Uv And E-beam Exposure On Semiconductor Device Film Properties By Use Of A Bilayer Film
App 20070281497 - Liu; Yijun ; et al. | 2007-12-06 |
Methods And Apparatus For E-beam Treatment Used To Fabricate Integrated Circuit Devices
App 20070275569 - MOGHADAM; FARHAD ; et al. | 2007-11-29 |
Method To Improve The Step Coverage And Pattern Loading For Dielectric Films
App 20070232071 - Balseanu; Mihaela ; et al. | 2007-10-04 |
Method To Improve The Step Coverage And Pattern Loading For Dielectric Films
App 20070232082 - Balseanu; Mihaela ; et al. | 2007-10-04 |
Low-k spacer integration into CMOS transistors
App 20070202640 - Al-Bayati; Amir ; et al. | 2007-08-30 |
Method for producing gate stack sidewall spacers
Grant 7,253,123 - Arghavani , et al. August 7, 2 | 2007-08-07 |
Selective etching of organosilicate films over silicon oxide stop etch layers
Grant 7,244,672 - Nguyen , et al. July 17, 2 | 2007-07-17 |
Methods Of Modifying Interlayer Adhesion
App 20070141855 - Schmitt; Francimar Campana ; et al. | 2007-06-21 |
Adhesion improvement for low k dielectrics to conductive materials
Grant 7,229,911 - Rajagopalan , et al. June 12, 2 | 2007-06-12 |
Method of modifying interlayer adhesion
Grant 7,226,876 - Schmitt , et al. June 5, 2 | 2007-06-05 |
Method To Deposit Functionally Graded Dielectric Films Via Chemical Vapor Deposition Using Viscous Precursors
App 20070079753 - Padhi; Deenesh ; et al. | 2007-04-12 |
Selective etching of organosilicate films over silicon oxide stop etch layers
Grant 7,183,201 - Nguyen , et al. February 27, 2 | 2007-02-27 |
Method Of Depositing Low K Barrier Layers
App 20070042610 - Xia; Li-Qun ; et al. | 2007-02-22 |
Method to deposit functionally graded dielectric films via chemical vapor deposition using viscous precursors
Grant 7,166,544 - Padhi , et al. January 23, 2 | 2007-01-23 |
Method of depositing low k films
Grant 7,160,821 - Huang , et al. January 9, 2 | 2007-01-09 |
Low dielectric (low k) barrier films with oxygen doping by plasma-enhanced chemical vapor deposition (PECVD)
Grant 7,157,384 - Yim , et al. January 2, 2 | 2007-01-02 |
CVD plasma assisted lower dielectric constant SICOH film
Grant 7,153,787 - Cho , et al. December 26, 2 | 2006-12-26 |
Method of depositing dielectric materials including oxygen-doped silicon carbide in damascene applications
Grant 7,151,053 - Lee , et al. December 19, 2 | 2006-12-19 |
Method to increase tensile stress of silicon nitride films using a post PECVD deposition UV cure
App 20060269693 - Balseanu; Mihaela ; et al. | 2006-11-30 |
Method to increase the compressive stress of PECVD silicon nitride films
App 20060269692 - Balseanu; Mihaela ; et al. | 2006-11-30 |
Integration process for fabricating stressed transistor structure
App 20060270217 - Balseanu; Mihaela ; et al. | 2006-11-30 |
Boron diffusion barrier by nitrogen incorporation in spacer dielectrics
Grant 7,132,353 - Xia , et al. November 7, 2 | 2006-11-07 |
Method of forming a low-K dual damascene interconnect structure
Grant 7,132,369 - Delgadino , et al. November 7, 2 | 2006-11-07 |
New Low Dielectric (low K) Barrier Films With Oxygen Doping By Plasma-enhanced Chemical Vapor Deposition (pecvd)
App 20060246737 - Yim; Kang Sub ; et al. | 2006-11-02 |
Method of depositing low K barrier layers
Grant 7,125,813 - Xia , et al. October 24, 2 | 2006-10-24 |
Oxide-like Seasoning For Dielectric Low K Films
App 20060219175 - Park; Sohyun ; et al. | 2006-10-05 |
Oxide-like seasoning for dielectric low k films
Grant 7,115,508 - Park , et al. October 3, 2 | 2006-10-03 |
Method of depositing dielectric films
Grant 7,117,064 - Nemani , et al. October 3, 2 | 2006-10-03 |
In-situ oxide capping after CVD low k deposition
Grant 7,112,541 - Xia , et al. September 26, 2 | 2006-09-26 |
Method of eliminating photoresist poisoning in damascene applications
App 20060205206 - Xu; Ping ; et al. | 2006-09-14 |
Adhesion improvement for low k dielectrics
App 20060189162 - Huang; Lihua Li ; et al. | 2006-08-24 |
Bi-layer approach for a hermetic low dielectric constant layer for barrier applications
Grant 7,091,137 - Lee , et al. August 15, 2 | 2006-08-15 |
Multi step ebeam process for modifying dielectric materials
App 20060171653 - Demos; Alexandros T. ; et al. | 2006-08-03 |
Method for producing gate stack sidewall spacers
App 20060154493 - Arghavani; Reza ; et al. | 2006-07-13 |
Method of decreasing the k value in sioc layer deposited by chemical vapor deposition
Grant 7,074,708 - Gaillard , et al. July 11, 2 | 2006-07-11 |
Method of depositing dielectric films
App 20060141805 - Nemani; Srinivas D. ; et al. | 2006-06-29 |
Method for forming ultra low k films using electron beam
Grant 7,060,330 - Zheng , et al. June 13, 2 | 2006-06-13 |
Ultra low dielectric materials based on hybrid system of linear silicon precursor and organic porogen by plasma-enhanced chemical vapor deposition (PECVD)
Grant 7,056,560 - Yim , et al. June 6, 2 | 2006-06-06 |
Method of improving stability in low k barrier layers
Grant 7,049,249 - Li , et al. May 23, 2 | 2006-05-23 |
Tensile and compressive stressed materials for semiconductors
App 20060105106 - Balseanu; Mihaela ; et al. | 2006-05-18 |
High-power dielectric seasoning for stable wafer-to-wafer thickness uniformity of dielectric CVD films
App 20060093756 - Rajagopalan; Nagarajan ; et al. | 2006-05-04 |
Method of eliminating photoresist poisoning in damascene applications
Grant 7,034,409 - Xu , et al. April 25, 2 | 2006-04-25 |
Adhesion improvement for low k dielectrics
Grant 7,030,041 - Li , et al. April 18, 2 | 2006-04-18 |
Method to reduce plasma damage during cleaning of semiconductor wafer processing chamber
App 20060054183 - Nowak; Thomas ; et al. | 2006-03-16 |
Method to deposit functionally graded dielectric films via chemical vapor deposition using viscous precursors
App 20060046520 - Padhi; Deenesh ; et al. | 2006-03-02 |
Adhesion improvement for low k dielectrics to conductive materials
App 20060046479 - Rajagopalan; Nagarajan ; et al. | 2006-03-02 |
Low temperature process to produce low-K dielectrics with low stress by plasma-enhanced chemical vapor deposition (PECVD)
App 20060043591 - Yim; Kang Sub ; et al. | 2006-03-02 |
Method of depositing dielectric films
Grant 7,001,850 - Nemani , et al. February 21, 2 | 2006-02-21 |
Method of depositing low k films
App 20050260864 - Huang, Tzu-Fang ; et al. | 2005-11-24 |
Selective etching of organosilicate films over silicon oxide stop etch layers
App 20050255697 - Nguyen, Huong Thanh ; et al. | 2005-11-17 |
In-situ oxide capping after CVD low k deposition
App 20050250348 - Xia, Li-Qun ; et al. | 2005-11-10 |
Multi-stage curing of low K nano-porous films
App 20050230834 - Schmitt, Francimar ; et al. | 2005-10-20 |
Adhesion improvement for low k dielectrics to conductive materials
App 20050233555 - Rajagopalan, Nagarajan ; et al. | 2005-10-20 |
Method of depositing dielectric materials in damascene applications
App 20050233576 - Lee, Ju-Hyung ; et al. | 2005-10-20 |
Oxide-like seasoning for dielectric low k films
App 20050227499 - Park, Sohyun ; et al. | 2005-10-13 |
Method of modifying interlayer adhesion
App 20050208759 - Campana Schmitt, Francimar ; et al. | 2005-09-22 |
Adhesion improvement for low k dielectrics
App 20050202685 - Huang, Lihua Li ; et al. | 2005-09-15 |
CVD plasma assisted lower dielectric constant SICOH film
Grant 6,943,127 - Cho , et al. September 13, 2 | 2005-09-13 |
Hardness improvement of silicon carboxy films
Grant 6,936,309 - Li , et al. August 30, 2 | 2005-08-30 |
Methods and apparatus for E-beam treatment used to fabricate integrated circuit devices
Grant 6,936,551 - Moghadam , et al. August 30, 2 | 2005-08-30 |
Methods and apparatuses promoting adhesion of dielectric barrier film to copper
App 20050186339 - Rajagopalan, Nagarajan ; et al. | 2005-08-25 |
Method for modifying dielectric characteristics of dielectric layers
Grant 6,921,727 - Chiang , et al. July 26, 2 | 2005-07-26 |
Solvent free photoresist strip and residue removal processing for post etching of low-k films
App 20050158667 - Nguyen, Huong Thanh ; et al. | 2005-07-21 |
Method for forming ultra low k films using electron beam
App 20050153073 - Zheng, Yi ; et al. | 2005-07-14 |
CVD plasma assisted lower dielectric constant sicoh film
App 20050153572 - Cho, Seon-Mee ; et al. | 2005-07-14 |
Method of modifying interlayer adhesion
Grant 6,913,992 - Schmitt , et al. July 5, 2 | 2005-07-05 |
Method for curing low dielectric constant film using direct current bias
Grant 6,914,014 - Li , et al. July 5, 2 | 2005-07-05 |
Methods of reducing plasma-induced damage for advanced plasma CVD dielectrics
Grant 6,911,403 - Li , et al. June 28, 2 | 2005-06-28 |
Low dielectric (low k) barrier films with oxygen doping by plasma-enhanced chemical vapor deposition (PECVD)
App 20050130440 - Yim, Kang Sub ; et al. | 2005-06-16 |
Methods and apparatus for e-beam treatment used to fabricate integrated circuit devices
App 20050130404 - Moghadam, Farhad ; et al. | 2005-06-16 |
Lid cooling mechanism and method for optimized deposition of low-K dielectric using TR methylsilane-ozone based processes
Grant 6,899,763 - Pokharna , et al. May 31, 2 | 2005-05-31 |
Method of depositing dielectric materials in damascene applications
Grant 6,890,850 - Lee , et al. May 10, 2 | 2005-05-10 |
Side wall passivation films for damascene cu/low k electronic devices
Grant 6,878,620 - Nguyen , et al. April 12, 2 | 2005-04-12 |
Post-deposition treatment to enhance properties of Si-O-C low K films
App 20050070128 - Xia, Li-Qun ; et al. | 2005-03-31 |
Bi-layer approach for a hermetic low dielectric constant layer for barrier applications
App 20050042889 - Lee, Albert ; et al. | 2005-02-24 |
Method of improving stability in low k barrier layers
App 20050042858 - Li, Lihua ; et al. | 2005-02-24 |
Methods of reducing plasma-induced damage for advanced plasma CVD dielectrics
App 20050042885 - Li, Lihua ; et al. | 2005-02-24 |
Post-deposition treatment to enhance properties of Si-O-C low films
Grant 6,858,923 - Xia , et al. February 22, 2 | 2005-02-22 |
Method of depositing a low k dielectric barrier film for copper damascene application
Grant 6,849,562 - Lang , et al. February 1, 2 | 2005-02-01 |
Method of depositing dielectric films
App 20050020048 - Nemani, Srinivas D. ; et al. | 2005-01-27 |
Method for producing semiconductor including forming a layer containing at least silicon carbide and forming a second layer containing at least silicon oxygen carbide
Grant 6,838,393 - Yim , et al. January 4, 2 | 2005-01-04 |
Use of cyclic siloxanes for hardness improvement
App 20040234688 - Singh, Vinita ; et al. | 2004-11-25 |
Use of cyclic siloxanes for hardness improvement of low k dielectric films
Grant 6,815,373 - Singh , et al. November 9, 2 | 2004-11-09 |
Method of depositing low K films
Grant 6,806,207 - Huang , et al. October 19, 2 | 2004-10-19 |
Method of depositing low K barrier layers
App 20040198070 - Xia, Li-Qun ; et al. | 2004-10-07 |
Plasma enhanced CVD low k carbon-doped silicon oxide film deposition using VHF-RF power
Grant 6,797,643 - Rocha-Alvarez , et al. September 28, 2 | 2004-09-28 |
Method for modifying dielectric characteristics of dielectric layers
App 20040180556 - Chiang, Kang-Lie ; et al. | 2004-09-16 |
Method of improving stability in low k barrier layers
Grant 6,790,788 - Li , et al. September 14, 2 | 2004-09-14 |
Method of improving interlayer adhesion
App 20040175929 - Schmitt, Francimar Campana ; et al. | 2004-09-09 |
Method of decreasing the K value in SIOC layer deposited by chemical vapor deposition
Grant 6,784,119 - Gaillard , et al. August 31, 2 | 2004-08-31 |
Method of decreasing the K value in SIOC layer deposited by chemical vapor deposition
App 20040166665 - Gaillard, Frederic ; et al. | 2004-08-26 |
Fluorine-containing layers for damascene structures
Grant 6,777,171 - Xu , et al. August 17, 2 | 2004-08-17 |
Method of forming a low-K dual damascene interconnect structure
App 20040157453 - Delgadino, Gerardo A. ; et al. | 2004-08-12 |
Ultra low dielectric materials based on hybrid system of linear silicon precursor and organic porogen by plasma-enhanced chemical vapor deposition (PECVD)
App 20040156987 - Yim, Kang Sub ; et al. | 2004-08-12 |
Method of depositing dielectric films
Grant 6,764,958 - Nemani , et al. July 20, 2 | 2004-07-20 |
Method For Curing Low Dielectric Constant Film Using Direct Current Bias
App 20040137758 - Li, Lihua ; et al. | 2004-07-15 |
Method Of Improving Stability In Low K Barrier Layers
App 20040137756 - Li, Lihua ; et al. | 2004-07-15 |
Method and apparatus to improve cracking thresholds and mechanical properties of low-k dielectric material
App 20040137757 - Li, Lihua ; et al. | 2004-07-15 |
Method of depositing low k barrier layers
Grant 6,759,327 - Xia , et al. July 6, 2 | 2004-07-06 |
Integration scheme for dual damascene structure
Grant 6,753,258 - Gaillard , et al. June 22, 2 | 2004-06-22 |
Silicon carbide cap layers for low dielectric constant silicon oxide layers
Grant 6,750,141 - Xia , et al. June 15, 2 | 2004-06-15 |
Method of eliminating photoresist poisoning in damascene applications
App 20040106278 - Xu, Ping ; et al. | 2004-06-03 |
Method for forming ultra low k films using electron beam
App 20040101633 - Zheng, Yi ; et al. | 2004-05-27 |
Method for curing low dielectric constant film by electron beam
App 20040101632 - Zhu, Wen H. ; et al. | 2004-05-27 |
Side wall passivation films for damascene cu/low k electronic devices
App 20040092095 - Nguyen, Son Van ; et al. | 2004-05-13 |
Plasma Enhanced Cvd Low K Carbon-doped Silicon Oxide Film Deposition Using Vhf-rf Power
App 20040082193 - Rocha-Alvarez, Juan Carlos ; et al. | 2004-04-29 |
Cluster tool for E-beam treated films
App 20040069410 - Moghadam, Farhad ; et al. | 2004-04-15 |
Two-layer film for next generation damascene barrier application with good oxidation resistance
App 20040067308 - Zheng, Yi ; et al. | 2004-04-08 |
Method for depositing a low k dielectric film (K>3.5) for hard mask application
Grant 6,699,784 - Xia , et al. March 2, 2 | 2004-03-02 |
Method of decreasing the K value in SIOC layer deposited by chemical vapor deposition
App 20040029400 - Gaillard, Frederic ; et al. | 2004-02-12 |
Solvent free photoresist strip and residue removal processing for post etching of low-k films
Grant 6,680,164 - Nguyen , et al. January 20, 2 | 2004-01-20 |
Methods and apparatus for E-beam treatment used to fabricate integrated circuit devices
App 20030232495 - Moghadam, Farhad ; et al. | 2003-12-18 |
Method and apparatus for processing semiconductor substrates with hydroxyl radicals
App 20030221621 - Pokharna, Himanshu ; et al. | 2003-12-04 |
Method of eliminating photoresist poisoning in damascene applications
Grant 6,656,837 - Xu , et al. December 2, 2 | 2003-12-02 |
Reacting an organosilicon compound with an oxidizing gas to form an ultra low k dielectric
App 20030211244 - Li, Lihua ; et al. | 2003-11-13 |
Methods and apparatus to enhance properties of Si-O-C low K films
Grant 6,635,575 - Xia , et al. October 21, 2 | 2003-10-21 |
Crosslink cyclo-siloxane compound with linear bridging group to form ultra low k dielectric
App 20030194495 - Li, Lihua ; et al. | 2003-10-16 |
Use of cyclic siloxanes for hardness improvement
App 20030194880 - Singh, Vinita ; et al. | 2003-10-16 |
Methods for depositing dielectric material
App 20030194496 - Xu, Ping ; et al. | 2003-10-16 |
Process for forming a low dielectric constant carbon-containing film
Grant 6,632,478 - Gaillard , et al. October 14, 2 | 2003-10-14 |
Hardness improvement of silicon carboxy films
App 20030186000 - Li, Lihua ; et al. | 2003-10-02 |
Method of decreasing the K value in SiOC layer deposited by chemical vapor deposition
Grant 6,627,532 - Gaillard , et al. September 30, 2 | 2003-09-30 |
Method of depositing a low k dielectric barrier film for copper damascene application
App 20030165618 - Lang, Chi-I ; et al. | 2003-09-04 |
UV radiation source for densification of CVD carbon-doped silicon oxide films
Grant 6,614,181 - Harvey , et al. September 2, 2 | 2003-09-02 |
Method of depositing low K films
App 20030162410 - Huang, Tzu-Fang ; et al. | 2003-08-28 |
Thermal CVD process for depositing a low dielectric constant carbon-doped silicon oxide film
Grant 6,602,806 - Xia , et al. August 5, 2 | 2003-08-05 |
Method and apparatus for forming a dielectric film using helium as a carrier gas
Grant 6,599,574 - Yieh , et al. July 29, 2 | 2003-07-29 |
Low dielectric (low k) barrier films with oxygen doping by plasma-enhanced chemical vapor deposition (pecvd)
App 20030139035 - Yim, Kang Sub ; et al. | 2003-07-24 |
Method of depositing low k films using an oxidizing plasma
Grant 6,593,247 - Huang , et al. July 15, 2 | 2003-07-15 |
Method of depositing dielectric materials in damascene applications
App 20030129827 - Lee, Ju-Hyung ; et al. | 2003-07-10 |
Surface treatment of c-doped SiO2 film to enhance film stability during O2 ashing
Grant 6,583,497 - Xia , et al. June 24, 2 | 2003-06-24 |
Method for depositing a low k dielectric film (k<3.5) for hard mask application
App 20030113995 - Xia, Li-Qun ; et al. | 2003-06-19 |
CVD plasma assisted lower dielectric constant sicoh film
App 20030104708 - Cho, Seon-Mee ; et al. | 2003-06-05 |
Solvent free photoresist strip and residue removal processing for post etching of low-k films
App 20030104320 - Nguyen, Huong Thanh ; et al. | 2003-06-05 |
Method of depositing organosilicate layers
Grant 6,573,196 - Gaillard , et al. June 3, 2 | 2003-06-03 |
Method for cleaning a process chamber
Grant 6,569,257 - Nguyen , et al. May 27, 2 | 2003-05-27 |
Method for densification of CVD carbon-doped silicon oxide films through UV irradiation
Grant 6,566,278 - Harvey , et al. May 20, 2 | 2003-05-20 |
Post-deposition treatment to enhance properties of SI-O-C low films
App 20030077857 - Xia, Li-Qun ; et al. | 2003-04-24 |
Method of eliminating photoresist poisoning in damascene applications
App 20030077916 - Xu, Ping ; et al. | 2003-04-24 |
Method of depositing low k barrier layers
App 20030068881 - Xia, Li-Qun ; et al. | 2003-04-10 |
Method of depositing organosillicate layers
Grant 6,531,398 - Gaillard , et al. March 11, 2 | 2003-03-11 |
Multistep chamber cleaning and film deposition process using a remote plasma that also enhances film gap fill
Grant 6,503,843 - Xia , et al. January 7, 2 | 2003-01-07 |
Method of depositing organosilicate layers
Grant 6,500,773 - Gaillard , et al. December 31, 2 | 2002-12-31 |
CVD plasma assisted lower dielectric constant sicoh film
Grant 6,486,082 - Cho , et al. November 26, 2 | 2002-11-26 |
Post-deposition treatment to enhance properties of Si-O-C low K films
Grant 6,486,061 - Xia , et al. November 26, 2 | 2002-11-26 |
Silicon carbide cap layers for low dielectric constant silicon oxide layers
Grant 6,472,333 - Xia , et al. October 29, 2 | 2002-10-29 |
Surface treatment of C-doped SiO2 film to enhance film stability during O2 ashing
Grant 6,465,372 - Xia , et al. October 15, 2 | 2002-10-15 |
Dual frequency plasma enhanced chemical vapor deposition of silicon carbide layers
Grant 6,465,366 - Nemani , et al. October 15, 2 | 2002-10-15 |
Method of reducing undesired etching of insulation due to elevated boron concentrations
Grant 6,426,015 - Xia , et al. July 30, 2 | 2002-07-30 |
Formation of a liquid-like silica layer by reaction of an organosilicon compound and a hydroxyl forming compound
Grant 6,413,583 - Moghadam , et al. July 2, 2 | 2002-07-02 |
Sub-atmospheric chemical vapor deposition system with dopant bypass
Grant 6,360,685 - Xia , et al. March 26, 2 | 2002-03-26 |
Methods and apparatus for depositing premetal dielectric layer at sub-atmospheric and high temperature conditions
Grant 6,348,099 - Xia , et al. February 19, 2 | 2002-02-19 |
Methods and apparatus for gettering fluorine from chamber material surfaces
Grant 6,347,636 - Xia , et al. February 19, 2 | 2002-02-19 |
Method for using bypass lines to stabilize gas flow and maintain plasma inside a deposition chamber
Grant 6,258,735 - Xia , et al. July 10, 2 | 2001-07-10 |
Method for removing residue from substrate processing chamber exhaust line for silicon-oxygen-carbon deposition process
Grant 6,255,222 - Xia , et al. July 3, 2 | 2001-07-03 |
Two-step borophosphosilicate glass deposition process and related devices and apparatus
Grant 6,218,268 - Xia , et al. April 17, 2 | 2001-04-17 |
Methods for shallow trench isolation
Grant 6,114,216 - Yieh , et al. September 5, 2 | 2000-09-05 |
Methods and apparatus for forming ultra-shallow doped regions using doped silicon oxide films
Grant 6,099,647 - Yieh , et al. August 8, 2 | 2000-08-08 |
Methods and apparatus for forming ultra-shallow doped regions using doped silicon oxide films
Grant 5,994,209 - Yieh , et al. November 30, 1 | 1999-11-30 |
Methods for depositing premetal dielectric layer at sub-atmospheric and high temperature conditions
Grant 5,963,840 - Xia , et al. October 5, 1 | 1999-10-05 |
Method and apparatus for gettering fluorine from chamber material surfaces
Grant 5,935,340 - Xia , et al. August 10, 1 | 1999-08-10 |
Methods and apparatus for cleaning surfaces in a substrate processing system
Grant 5,812,403 - Fong , et al. September 22, 1 | 1998-09-22 |
| 