Xia; Dingwei
Patent Applications and Registrations
Patent applications and USPTO patent grants for Xia; Dingwei.The latest application filed is for "apparatus for molding a semiconductor wafer and process therefor".
- Xia; Dingwei - Singapore SG
- Xia, Dingwei - Yishun Avenue SG
| Patent | Date |
|---|---|
| Apparatus for molding a semiconductor wafer and process therefor Grant 9,524,885 - Seng , et al. December 20, 2 | 2016-12-20 |
| Apparatus For Molding A Semiconductor Wafer And Process Therefor App 20140333006 - Seng; Jimmy Chew Hwee ; et al. | 2014-11-13 |
| Apparatus for molding a semiconductor wafer and process therefor Grant 8,791,583 - Chew , et al. July 29, 2 | 2014-07-29 |
| Method and apparatus for forming a flip chip semiconductor package and method for producing a substrate for the flip chip semiconductor package App 20050106784 - Xia, Dingwei | 2005-05-19 |
| Apparatus for molding a semiconductor wafer and process therefor App 20050064065 - Seng, Jimmy Chew Hwee ; et al. | 2005-03-24 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.
| 