Xia; Chunlin C.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Xia; Chunlin C..The latest application filed is for "methods for fabricating sensor device package using a sealing structure".
- Xia; Chunlin C. - Phoenix AZ US
| Patent | Date |
|---|---|
| Methods for fabricating sensor device package using a sealing structure Grant 8,476,087 - Hooper , et al. July 2, 2 | 2013-07-02 |
| Sensor device with sealing structure Grant 8,384,168 - Hooper , et al. February 26, 2 | 2013-02-26 |
| Sensor Device With Sealing Structure App 20120266684 - Hooper; Stephen R. ; et al. | 2012-10-25 |
| Methods For Fabricating Sensor Device Package Using A Sealing Structure App 20120270354 - Hooper; Stephen R. ; et al. | 2012-10-25 |
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