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Method And Apparatuses For Reducing Porogen Accumulation From A Uv-cure Chamber App 20180315604 - Gytri; Lisa Marie ;   et al. | 2018-11-01 |
Method And Apparatus For Fusing Plurality Of Depth Images App 20180218485 - XI; Ming ;   et al. | 2018-08-02 |
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Method and apparatus for processing audio/video file Grant 9,832,493 - Guo , et al. November 28, 2 | 2017-11-28 |
Substrate Used For Group Iii-v Nitride Growth And Method For Preparation Thereof App 20160359083 - HAO; Maosheng ;   et al. | 2016-12-08 |
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Purging Of Porogen From Uv Cure Chamber App 20160284574 - Smargiassi; Eugene ;   et al. | 2016-09-29 |
Purging of porogen from UV cure chamber Grant 9,384,959 - Smargiassi , et al. July 5, 2 | 2016-07-05 |
Method And Apparatus For Processing Audio/video File App 20150358653 - GUO; Hauiyin ;   et al. | 2015-12-10 |
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Method And Apparatuses For Reducing Porogen Accumulation From A Uv-cure Chamber App 20150255285 - Gytri; Lisa ;   et al. | 2015-09-10 |
Method and apparatuses for reducing porogen accumulation from a UV-cure chamber Grant 9,073,100 - Gytri , et al. July 7, 2 | 2015-07-07 |
Atomic layer deposition apparatus Grant 9,031,685 - Chin , et al. May 12, 2 | 2015-05-12 |
Formation of a tantalum-nitride layer Grant 9,012,334 - Seutter , et al. April 21, 2 | 2015-04-21 |
Purging Of Porogen From Uv Cure Chamber App 20140230861 - SMARGIASSI; Eugene ;   et al. | 2014-08-21 |
Purging of porogen from UV cure chamber Grant 8,734,663 - Smargiassi , et al. May 27, 2 | 2014-05-27 |
Atomic Layer Deposition Apparatus App 20140130739 - CHIN; Barry L. ;   et al. | 2014-05-15 |
Atomic layer deposition apparatus Grant 8,626,330 - Chin , et al. January 7, 2 | 2014-01-07 |
Purging Of Porogen From Uv Cure Chamber App 20130298940 - Smargiassi; Eugene ;   et al. | 2013-11-14 |
Method And Apparatuses For Reducing Porogen Accumulation From A Uv-cure Chamber App 20130284087 - Gytri; Lisa ;   et al. | 2013-10-31 |
Purging of porogen from UV cure chamber Grant 8,518,210 - Smargiassi , et al. August 27, 2 | 2013-08-27 |
Purging Of Porogen From Uv Cure Chamber App 20130160946 - Smargiassi; Eugene ;   et al. | 2013-06-27 |
Purging of porogen from UV cure chamber Grant 8,282,768 - Smargiassi , et al. October 9, 2 | 2012-10-09 |
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Formation of a tantalum-nitride layer Grant 8,114,789 - Seutter , et al. February 14, 2 | 2012-02-14 |
Atomic Layer Deposition Apparatus App 20120006265 - CHIN; BARRY L. ;   et al. | 2012-01-12 |
Atomic layer deposition apparatus Grant 8,027,746 - Chin , et al. September 27, 2 | 2011-09-27 |
Atomic Layer Deposition Apparatus App 20110111603 - CHIN; BARRY L. ;   et al. | 2011-05-12 |
System And Method For Forming An Integrated Barrier Layer App 20110100295 - Xi; Ming ;   et al. | 2011-05-05 |
System and method for forming an integrated barrier layer Grant 7,867,914 - Xi , et al. January 11, 2 | 2011-01-11 |
Atomic layer deposition apparatus Grant 7,860,597 - Chin , et al. December 28, 2 | 2010-12-28 |
Formation Of A Tantalum-nitride Layer App 20100311237 - Seutter; Sean M. ;   et al. | 2010-12-09 |
Apparatus and method for plasma assisted deposition Grant 7,779,784 - Chen , et al. August 24, 2 | 2010-08-24 |
Formation of a tantalum-nitride layer Grant 7,781,326 - Seutter , et al. August 24, 2 | 2010-08-24 |
Methods for depositing tungsten layers employing atomic layer deposition techniques Grant 7,745,333 - Lai , et al. June 29, 2 | 2010-06-29 |
Plasma-enhanced cyclic layer deposition process for barrier layers Grant 7,732,325 - Yang , et al. June 8, 2 | 2010-06-08 |
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Atomic Layer Deposition Apparatus App 20100099270 - Chin; Barry L. ;   et al. | 2010-04-22 |
Pulsed deposition process for tungsten nucleation Grant 7,695,563 - Lu , et al. April 13, 2 | 2010-04-13 |
Method for forming tungsten materials during vapor deposition processes Grant 7,674,715 - Kori , et al. March 9, 2 | 2010-03-09 |
Atomic layer deposition apparatus Grant 7,660,644 - Chin , et al. February 9, 2 | 2010-02-09 |
Formation of composite tungsten films Grant 7,605,083 - Lai , et al. October 20, 2 | 2009-10-20 |
Method For Depositing Tungsten-containing Layers By Vapor Deposition Techniques App 20090156003 - XI; MING ;   et al. | 2009-06-18 |
Plasma-enhanced Cyclic Layer Deposition Process For Barrier Layers App 20090111264 - YANG; MICHAEL X. ;   et al. | 2009-04-30 |
Method And System For Chemically Enhanced Laser Trimming Of Substrate Edges App 20090107519 - Ishikawa; Tetsuya ;   et al. | 2009-04-30 |
Apparatus For Cyclical Depositing Of Thin Films App 20090056626 - THAKUR; RANDHIR P.S. ;   et al. | 2009-03-05 |
Plasma-enhanced cyclic layer deposition process for barrier layers Grant 7,473,638 - Yang , et al. January 6, 2 | 2009-01-06 |
Pulsed Deposition Process For Tungsten Nucleation App 20080317954 - LU; XINLIANG ;   et al. | 2008-12-25 |
Method for forming tungsten materials during vapor deposition processes Grant 7,465,666 - Kori , et al. December 16, 2 | 2008-12-16 |
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Methods For Depositing Tungsten Layers Employing Atomic Layer Deposition Techniques App 20080280438 - Lai; Ken Kaung ;   et al. | 2008-11-13 |
Formation Of Composite Tungsten Films App 20080227291 - LAI; KEN K. ;   et al. | 2008-09-18 |
Methods for depositing tungsten layers employing atomic layer deposition techniques Grant 7,405,158 - Lai , et al. July 29, 2 | 2008-07-29 |
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Formation of composite tungsten films Grant 7,384,867 - Lai , et al. June 10, 2 | 2008-06-10 |
System And Method For Forming An Integrated Barrier Layer App 20080014352 - XI; MING ;   et al. | 2008-01-17 |
Method For Forming Tungsten Materials During Vapor Deposition Processes App 20070254481 - KORI; MORIS ;   et al. | 2007-11-01 |
System and method for forming an integrated barrier layer Grant 7,279,432 - Xi , et al. October 9, 2 | 2007-10-09 |
Method For Depositing Tungsten-containing Layers By Vapor Deposition Techniques App 20070218688 - Xi; Ming ;   et al. | 2007-09-20 |
Reliability Barrier Integration For Cu Application App 20070151861 - XI; MING ;   et al. | 2007-07-05 |
Method for forming tungsten materials during vapor deposition processes Grant 7,235,486 - Kori , et al. June 26, 2 | 2007-06-26 |
Multi-chemistry plating system Grant 7,223,323 - Yang , et al. May 29, 2 | 2007-05-29 |
Method for depositing tungsten-containing layers by vapor deposition techniques Grant 7,220,673 - Xi , et al. May 22, 2 | 2007-05-22 |
Integration Process Of Tungsten Atomic Layer Deposition For Metallization Application App 20070099415 - Chen; Ling ;   et al. | 2007-05-03 |
Apparatus For Cyclical Depositing Of Thin Films App 20070095285 - Thakur; Randhir P.S. ;   et al. | 2007-05-03 |
Pulsed nucleation deposition of tungsten layers Grant 7,211,144 - Lu , et al. May 1, 2 | 2007-05-01 |
Pre-treatment to eliminate the defects formed during electrochemical plating App 20070080067 - Gu; Haiyang ;   et al. | 2007-04-12 |
Valve control system for atomic layer deposition chamber Grant 7,201,803 - Lu , et al. April 10, 2 | 2007-04-10 |
Apparatus for cyclical deposition of thin films Grant 7,175,713 - Thakur , et al. February 13, 2 | 2007-02-13 |
Plasma-enhanced Cyclic Layer Deposition Process For Barrier Layers App 20060292864 - Yang; Michael X. ;   et al. | 2006-12-28 |
Method For Forming Tungsten Materials During Vapor Deposition Processes App 20060292874 - Kori; Moris ;   et al. | 2006-12-28 |
Method For Depositing Tungsten-containing Layers By Vapor Deposition Techniques App 20060264031 - Xi; Ming ;   et al. | 2006-11-23 |
Atomic Layer Deposition Apparatus App 20060223286 - Chin; Barry L. ;   et al. | 2006-10-05 |
Method and system for controlling the presence of fluorine in refractory metal layers Grant 7,115,494 - Sinha , et al. October 3, 2 | 2006-10-03 |
Method and apparatus for depositing refractory metal layers employing sequential deposition techniques to form a nucleation layer Grant 7,101,795 - Xi , et al. September 5, 2 | 2006-09-05 |
Integration of titanium and titanium nitride layers Grant 7,094,685 - Yang , et al. August 22, 2 | 2006-08-22 |
Formation of a tantalum-nitride layer Grant 7,094,680 - Seutter , et al. August 22, 2 | 2006-08-22 |
Atomic layer deposition apparatus Grant 7,085,616 - Chin , et al. August 1, 2 | 2006-08-01 |
Method and system for controlling the presence of fluorine in refractory metal layers App 20060128132 - Sinha; Ashok ;   et al. | 2006-06-15 |
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Integration of titanium and titanium nitride layers App 20050277290 - Yang, Michael X. ;   et al. | 2005-12-15 |
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Formation of composite tungsten films Grant 6,939,804 - Lai , et al. September 6, 2 | 2005-09-06 |
Formation of a tantalum-nitride layer App 20050164487 - Seutter, Sean M. ;   et al. | 2005-07-28 |
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Method and system for controlling the presence of fluorine in refractory metal layers App 20050059241 - Kori, Moris ;   et al. | 2005-03-17 |
Clamshell and small volume chamber with fixed substrate support Grant 6,866,746 - Lei , et al. March 15, 2 | 2005-03-15 |
Multiple precursor cyclical deposition system Grant 6,846,516 - Yang , et al. January 25, 2 | 2005-01-25 |
Multiple precursor cyclical depositon system App 20050008779 - Yang, Michael Xi ;   et al. | 2005-01-13 |
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Method and apparatus for depositing refractory metal layers employing sequential deposition techniques to form a nucleation layer App 20040209465 - Xi, Ming ;   et al. | 2004-10-21 |
Reliability barrier integration for Cu application App 20040209460 - Xi, Ming ;   et al. | 2004-10-21 |
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Multi-chemistry electrochemical processing system App 20040118694 - Yang, Michael X. ;   et al. | 2004-06-24 |
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System and method for forming an integrated barrier layer App 20030232497 - Xi, Ming ;   et al. | 2003-12-18 |
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Integration of ALD tantalum nitride and alpha-phase tantalum for copper metallization application App 20030124262 - Chen, Ling ;   et al. | 2003-07-03 |
Chamber hardware design for titanium nitride atomic layer deposition App 20030116087 - Nguyen, Anh N. ;   et al. | 2003-06-26 |
Method for depositing refractory metal layers employing sequential deposition techniques App 20030104126 - Fang, Hongbin ;   et al. | 2003-06-05 |
Plasma treatment of a titanium nitride film formed by chemical vapor deposition Grant 6,555,183 - Wang , et al. April 29, 2 | 2003-04-29 |
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Atomic layer deposition apparatus App 20030023338 - Chin, Barry L. ;   et al. | 2003-01-30 |
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Integrated barrier layer structure for copper contact level metallization App 20020192948 - Chen, Fusen ;   et al. | 2002-12-19 |
Plasma treatment of a titanium nitride film formed by chemical vapor deposition App 20020155219 - Wang, Shulin ;   et al. | 2002-10-24 |
Valve control system for atomic layer deposition chamber App 20020127745 - Lu, Siqing ;   et al. | 2002-09-12 |
Lid assembly for a processing system to facilitate sequential deposition techniques App 20020121342 - Nguyen, Anh N. ;   et al. | 2002-09-05 |
Processing chamber and method of distributing process fluids therein to facilitate sequential deposition of films App 20020121241 - Nguyen, Anh N. ;   et al. | 2002-09-05 |
Formation of a tantalum-nitride layer App 20020106846 - Seutter, Sean M. ;   et al. | 2002-08-08 |
Method Of Depositing A Thick Titanium Nitride Film App 20020064598 - WANG, SHULIN ;   et al. | 2002-05-30 |
Reliability barrier integration for Cu application App 20020060363 - Xi, Ming ;   et al. | 2002-05-23 |
Method for performing metallo-organic chemical vapor deposition of titanium nitride at reduced temperature Grant 6,365,495 - Wang , et al. April 2, 2 | 2002-04-02 |
Method For Performing Metallo-organic Chemical Vapor Deposition Of Titanium Nitride At Reduced Temperature App 20020001928 - WANG, SHULIN ;   et al. | 2002-01-03 |
Method of titanium/titanium nitride integration Grant 6,326,690 - Wang , et al. December 4, 2 | 2001-12-04 |
CVD deposition method to improve adhesion of F-containing dielectric metal lines for VLSI application Grant 6,323,119 - Xi , et al. November 27, 2 | 2001-11-27 |
Head for vaporizing and flowing various precursor materials onto semiconductor wafers during chemical vapor deposition Grant 6,299,692 - Ku , et al. October 9, 2 | 2001-10-09 |
Method of titanium/titanium nitride integration App 20010001297 - Wang, Shulin ;   et al. | 2001-05-17 |
Method of titanium/titanium nitride integration Grant 6,214,714 - Wang , et al. April 10, 2 | 2001-04-10 |
Method of depositing and amorphous fluorocarbon film using HDP-CVD Grant 6,211,065 - Xi , et al. April 3, 2 | 2001-04-03 |
High temperature resistive heater for a process chamber Grant 6,066,836 - Chen , et al. May 23, 2 | 2000-05-23 |
Process for chlorine trifluoride chamber cleaning Grant 5,926,743 - Xi , et al. July 20, 1 | 1999-07-20 |
Process for chlorine trifluoride chamber cleaning Grant 5,849,092 - Xi , et al. December 15, 1 | 1998-12-15 |
High temperature susceptor Grant 5,837,058 - Chen , et al. November 17, 1 | 1998-11-17 |