Xi; Ming

Patent Applications and Registrations

Patent applications and USPTO patent grants for Xi; Ming.The latest application filed is for "method and apparatuses for reducing porogen accumulation from a uv-cure chamber".

Company Profile

1.74.85

Xi; Ming - Palo Alto CA
Xi; Ming - Shanghai CN
XI; Ming - Hangzhou CN
Xi; Ming - Beijing CN
Xi; Ming - Sunnyvale CA
Xi; Ming - Milpitas CA
Xi; Ming - Milipitas CA
Xi; Ming - Santa Clara CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method and apparatuses for reducing porogen accumulation from a UV-cure chamber Grant 11,177,131 - Gytri , et al. November 16, 2	2021-11-16
Substrate used for III-V-nitride growth and manufacturing method thereof Grant 10,230,018 - Hao , et al.	2019-03-12
Purging of porogen from UV cure chamber Grant 10,121,682 - Smargiassi , et al. November 6, 2	2018-11-06
Method And Apparatuses For Reducing Porogen Accumulation From A Uv-cure Chamber App 20180315604 - Gytri; Lisa Marie ; et al.	2018-11-01
Method And Apparatus For Fusing Plurality Of Depth Images App 20180218485 - XI; Ming ; et al.	2018-08-02
Method for reducing porogen accumulation from a UV-cure chamber Grant 10,020,197 - Gytri , et al. July 10, 2	2018-07-10
Method and apparatus for processing audio/video file Grant 9,832,493 - Guo , et al. November 28, 2	2017-11-28
Substrate Used For Group Iii-v Nitride Growth And Method For Preparation Thereof App 20160359083 - HAO; Maosheng ; et al.	2016-12-08
Iii-v-nitride Semiconductor Epitaxial Wafer, Device Containing Epitaxial Wafer And Manufacturing Method Thereof App 20160359082 - HAO; Maosheng ; et al.	2016-12-08
Purging Of Porogen From Uv Cure Chamber App 20160284574 - Smargiassi; Eugene ; et al.	2016-09-29
Purging of porogen from UV cure chamber Grant 9,384,959 - Smargiassi , et al. July 5, 2	2016-07-05
Method And Apparatus For Processing Audio/video File App 20150358653 - GUO; Hauiyin ; et al.	2015-12-10
Method, Apparatus, Device And System For Inserting Audio Advertisement App 20150317699 - TIAN; Biao ; et al.	2015-11-05
Method And Apparatuses For Reducing Porogen Accumulation From A Uv-cure Chamber App 20150255285 - Gytri; Lisa ; et al.	2015-09-10
Method and apparatuses for reducing porogen accumulation from a UV-cure chamber Grant 9,073,100 - Gytri , et al. July 7, 2	2015-07-07
Atomic layer deposition apparatus Grant 9,031,685 - Chin , et al. May 12, 2	2015-05-12
Formation of a tantalum-nitride layer Grant 9,012,334 - Seutter , et al. April 21, 2	2015-04-21
Purging Of Porogen From Uv Cure Chamber App 20140230861 - SMARGIASSI; Eugene ; et al.	2014-08-21
Purging of porogen from UV cure chamber Grant 8,734,663 - Smargiassi , et al. May 27, 2	2014-05-27
Atomic Layer Deposition Apparatus App 20140130739 - CHIN; Barry L. ; et al.	2014-05-15
Atomic layer deposition apparatus Grant 8,626,330 - Chin , et al. January 7, 2	2014-01-07
Purging Of Porogen From Uv Cure Chamber App 20130298940 - Smargiassi; Eugene ; et al.	2013-11-14
Method And Apparatuses For Reducing Porogen Accumulation From A Uv-cure Chamber App 20130284087 - Gytri; Lisa ; et al.	2013-10-31
Purging of porogen from UV cure chamber Grant 8,518,210 - Smargiassi , et al. August 27, 2	2013-08-27
Purging Of Porogen From Uv Cure Chamber App 20130160946 - Smargiassi; Eugene ; et al.	2013-06-27
Purging of porogen from UV cure chamber Grant 8,282,768 - Smargiassi , et al. October 9, 2	2012-10-09
Formation Of A Tantalum-nitride Layer App 20120178256 - Seutter; Sean M. ; et al.	2012-07-12
Apparatus for cyclical depositing of thin films Grant 8,123,860 - Thakur , et al. February 28, 2	2012-02-28
Formation of a tantalum-nitride layer Grant 8,114,789 - Seutter , et al. February 14, 2	2012-02-14
Atomic Layer Deposition Apparatus App 20120006265 - CHIN; BARRY L. ; et al.	2012-01-12
Atomic layer deposition apparatus Grant 8,027,746 - Chin , et al. September 27, 2	2011-09-27
Atomic Layer Deposition Apparatus App 20110111603 - CHIN; BARRY L. ; et al.	2011-05-12
System And Method For Forming An Integrated Barrier Layer App 20110100295 - Xi; Ming ; et al.	2011-05-05
System and method for forming an integrated barrier layer Grant 7,867,914 - Xi , et al. January 11, 2	2011-01-11
Atomic layer deposition apparatus Grant 7,860,597 - Chin , et al. December 28, 2	2010-12-28
Formation Of A Tantalum-nitride Layer App 20100311237 - Seutter; Sean M. ; et al.	2010-12-09
Apparatus and method for plasma assisted deposition Grant 7,779,784 - Chen , et al. August 24, 2	2010-08-24
Formation of a tantalum-nitride layer Grant 7,781,326 - Seutter , et al. August 24, 2	2010-08-24
Methods for depositing tungsten layers employing atomic layer deposition techniques Grant 7,745,333 - Lai , et al. June 29, 2	2010-06-29
Plasma-enhanced cyclic layer deposition process for barrier layers Grant 7,732,325 - Yang , et al. June 8, 2	2010-06-08
Method for depositing tungsten-containing layers by vapor deposition techniques Grant 7,709,385 - Xi , et al. May 4, 2	2010-05-04
Atomic Layer Deposition Apparatus App 20100099270 - Chin; Barry L. ; et al.	2010-04-22
Pulsed deposition process for tungsten nucleation Grant 7,695,563 - Lu , et al. April 13, 2	2010-04-13
Method for forming tungsten materials during vapor deposition processes Grant 7,674,715 - Kori , et al. March 9, 2	2010-03-09
Atomic layer deposition apparatus Grant 7,660,644 - Chin , et al. February 9, 2	2010-02-09
Formation of composite tungsten films Grant 7,605,083 - Lai , et al. October 20, 2	2009-10-20
Method For Depositing Tungsten-containing Layers By Vapor Deposition Techniques App 20090156003 - XI; MING ; et al.	2009-06-18
Plasma-enhanced Cyclic Layer Deposition Process For Barrier Layers App 20090111264 - YANG; MICHAEL X. ; et al.	2009-04-30
Method And System For Chemically Enhanced Laser Trimming Of Substrate Edges App 20090107519 - Ishikawa; Tetsuya ; et al.	2009-04-30
Apparatus For Cyclical Depositing Of Thin Films App 20090056626 - THAKUR; RANDHIR P.S. ; et al.	2009-03-05
Plasma-enhanced cyclic layer deposition process for barrier layers Grant 7,473,638 - Yang , et al. January 6, 2	2009-01-06
Pulsed Deposition Process For Tungsten Nucleation App 20080317954 - LU; XINLIANG ; et al.	2008-12-25
Method for forming tungsten materials during vapor deposition processes Grant 7,465,666 - Kori , et al. December 16, 2	2008-12-16
Method for depositing tungsten-containing layers by vapor deposition techniques Grant 7,465,665 - Xi , et al. December 16, 2	2008-12-16
Methods For Depositing Tungsten Layers Employing Atomic Layer Deposition Techniques App 20080280438 - Lai; Ken Kaung ; et al.	2008-11-13
Formation Of Composite Tungsten Films App 20080227291 - LAI; KEN K. ; et al.	2008-09-18
Methods for depositing tungsten layers employing atomic layer deposition techniques Grant 7,405,158 - Lai , et al. July 29, 2	2008-07-29
Multiple precursor cyclical deposition system Grant 7,396,565 - Yang , et al. July 8, 2	2008-07-08
Formation of composite tungsten films Grant 7,384,867 - Lai , et al. June 10, 2	2008-06-10
System And Method For Forming An Integrated Barrier Layer App 20080014352 - XI; MING ; et al.	2008-01-17
Method For Forming Tungsten Materials During Vapor Deposition Processes App 20070254481 - KORI; MORIS ; et al.	2007-11-01
System and method for forming an integrated barrier layer Grant 7,279,432 - Xi , et al. October 9, 2	2007-10-09
Method For Depositing Tungsten-containing Layers By Vapor Deposition Techniques App 20070218688 - Xi; Ming ; et al.	2007-09-20
Reliability Barrier Integration For Cu Application App 20070151861 - XI; MING ; et al.	2007-07-05
Method for forming tungsten materials during vapor deposition processes Grant 7,235,486 - Kori , et al. June 26, 2	2007-06-26
Multi-chemistry plating system Grant 7,223,323 - Yang , et al. May 29, 2	2007-05-29
Method for depositing tungsten-containing layers by vapor deposition techniques Grant 7,220,673 - Xi , et al. May 22, 2	2007-05-22
Integration Process Of Tungsten Atomic Layer Deposition For Metallization Application App 20070099415 - Chen; Ling ; et al.	2007-05-03
Apparatus For Cyclical Depositing Of Thin Films App 20070095285 - Thakur; Randhir P.S. ; et al.	2007-05-03
Pulsed nucleation deposition of tungsten layers Grant 7,211,144 - Lu , et al. May 1, 2	2007-05-01
Pre-treatment to eliminate the defects formed during electrochemical plating App 20070080067 - Gu; Haiyang ; et al.	2007-04-12
Valve control system for atomic layer deposition chamber Grant 7,201,803 - Lu , et al. April 10, 2	2007-04-10
Apparatus for cyclical deposition of thin films Grant 7,175,713 - Thakur , et al. February 13, 2	2007-02-13
Plasma-enhanced Cyclic Layer Deposition Process For Barrier Layers App 20060292864 - Yang; Michael X. ; et al.	2006-12-28
Method For Forming Tungsten Materials During Vapor Deposition Processes App 20060292874 - Kori; Moris ; et al.	2006-12-28
Method For Depositing Tungsten-containing Layers By Vapor Deposition Techniques App 20060264031 - Xi; Ming ; et al.	2006-11-23
Atomic Layer Deposition Apparatus App 20060223286 - Chin; Barry L. ; et al.	2006-10-05
Method and system for controlling the presence of fluorine in refractory metal layers Grant 7,115,494 - Sinha , et al. October 3, 2	2006-10-03
Method and apparatus for depositing refractory metal layers employing sequential deposition techniques to form a nucleation layer Grant 7,101,795 - Xi , et al. September 5, 2	2006-09-05
Integration of titanium and titanium nitride layers Grant 7,094,685 - Yang , et al. August 22, 2	2006-08-22
Formation of a tantalum-nitride layer Grant 7,094,680 - Seutter , et al. August 22, 2	2006-08-22
Atomic layer deposition apparatus Grant 7,085,616 - Chin , et al. August 1, 2	2006-08-01
Method and system for controlling the presence of fluorine in refractory metal layers App 20060128132 - Sinha; Ashok ; et al.	2006-06-15
Method and system for controlling the presence of fluorine in refractory metal layers Grant 7,033,922 - Kori , et al. April 25, 2	2006-04-25
Apparatus and method for plasma assisted deposition App 20060075966 - Chen; Chen-An ; et al.	2006-04-13
Reliability barrier integration for Cu application Grant 7,026,238 - Xi , et al. April 11, 2	2006-04-11
Methods for depositing tungsten layers employing atomic layer deposition techniques App 20060040052 - Fang; Hongbin ; et al.	2006-02-23
Apparatus and method for plasma assisted deposition Grant 6,998,014 - Chen , et al. February 14, 2	2006-02-14
Methods for depositing tungsten layers employing atomic layer deposition techniques App 20060009034 - Lai; Ken Kaung ; et al.	2006-01-12
Formation of composite tungsten films App 20050287807 - Lai, Ken K. ; et al.	2005-12-29
Integration of titanium and titanium nitride layers App 20050277290 - Yang, Michael X. ; et al.	2005-12-15
Formation of a tantalum-nitride layer Grant 6,951,804 - Seutter , et al. October 4, 2	2005-10-04
Formation of composite tungsten films Grant 6,939,804 - Lai , et al. September 6, 2	2005-09-06
Formation of a tantalum-nitride layer App 20050164487 - Seutter, Sean M. ; et al.	2005-07-28
Clamshell and small volume chamber with fixed substrate support App 20050139160 - Lei, Lawrence C. ; et al.	2005-06-30
Integration of titanium and titanium nitride layers Grant 6,911,391 - Yang , et al. June 28, 2	2005-06-28
Method and system for controlling the presence of fluorine in refractory metal layers App 20050059241 - Kori, Moris ; et al.	2005-03-17
Clamshell and small volume chamber with fixed substrate support Grant 6,866,746 - Lei , et al. March 15, 2	2005-03-15
Multiple precursor cyclical deposition system Grant 6,846,516 - Yang , et al. January 25, 2	2005-01-25
Multiple precursor cyclical depositon system App 20050008779 - Yang, Michael Xi ; et al.	2005-01-13
Method for depositing refractory metal layers employing sequential deposition techniques App 20040247788 - Fang, Hongbin ; et al.	2004-12-09
Selective deposition of a barrier layer on a metal film Grant 6,809,026 - Yoon , et al. October 26, 2	2004-10-26
Method and apparatus for depositing refractory metal layers employing sequential deposition techniques to form a nucleation layer App 20040209465 - Xi, Ming ; et al.	2004-10-21
Reliability barrier integration for Cu application App 20040209460 - Xi, Ming ; et al.	2004-10-21
Method for depositing refractory metal layers employing sequential deposition techniques Grant 6,797,340 - Fang , et al. September 28, 2	2004-09-28
Valve control system for atomic layer deposition chamber App 20040143370 - Lu, Siqing ; et al.	2004-07-22
Multi-chemistry electrochemical processing system App 20040118694 - Yang, Michael X. ; et al.	2004-06-24
Valve control system for atomic layer deposition chamber Grant 6,734,020 - Lu , et al. May 11, 2	2004-05-11
Cyclical deposition of a variable content titanium silicon nitride layer Grant 6,720,027 - Yang , et al. April 13, 2	2004-04-13
Multi-chemistry plating system App 20040016637 - Yang, Michael X. ; et al.	2004-01-29
Formation of titanium nitride films using a cyclical deposition process App 20040013803 - Chung, Hua ; et al.	2004-01-22
Formation of composite tungsten films App 20040014315 - Lai, Ken K. ; et al.	2004-01-22
System and method for forming an integrated barrier layer App 20030232497 - Xi, Ming ; et al.	2003-12-18
Lid assembly for a processing system to facilitate sequential deposition techniques Grant 6,660,126 - Nguyen , et al. December 9, 2	2003-12-09
Clamshell and small volume chamber with fixed substrate support App 20030221780 - Lei, Lawrence C. ; et al.	2003-12-04
Metal nitride formation App 20030224217 - Byun, Jeong Soo ; et al.	2003-12-04
Aluminum oxide chamber and process App 20030198754 - Xi, Ming ; et al.	2003-10-23
Multiple precursor cyclical deposition system App 20030190423 - Yang, Michael Xi ; et al.	2003-10-09
Cyclical deposition of a variable content titanium silicon nitride layer App 20030190497 - Yang, Michael X. ; et al.	2003-10-09
Selective deposition of abarrier layer on a metal film App 20030181035 - Yoon, Hyungsuk Alexander ; et al.	2003-09-25
Chamber seasoning method to improve adhesion of F-containing dielectric film to metal for VLSI application Grant 6,624,064 - Sahin , et al. September 23, 2	2003-09-23
Apparatus for cyclical deposition of thin films App 20030172872 - Thakur, Randhir P.S. ; et al.	2003-09-18
Deposition of tungsten films for dynamic random access memory (DRAM) applications App 20030157760 - Xi, Ming ; et al.	2003-08-21
Apparatus and method for plasma assisted deposition App 20030143328 - Chen, Chen-An ; et al.	2003-07-31
Integration of titanium and titanium nitride layers App 20030143841 - Yang, Michael X. ; et al.	2003-07-31
Pulsed nucleation deposition of tungsten layers App 20030127043 - Lu, Xinliang ; et al.	2003-07-10
Deposition of tungsten for the formation of conformal tungsten silicide App 20030123216 - Yoon, Hyungsuk A. ; et al.	2003-07-03
Integration of ALD tantalum nitride and alpha-phase tantalum for copper metallization application App 20030124262 - Chen, Ling ; et al.	2003-07-03
Chamber hardware design for titanium nitride atomic layer deposition App 20030116087 - Nguyen, Anh N. ; et al.	2003-06-26
Method for depositing refractory metal layers employing sequential deposition techniques App 20030104126 - Fang, Hongbin ; et al.	2003-06-05
Plasma treatment of a titanium nitride film formed by chemical vapor deposition Grant 6,555,183 - Wang , et al. April 29, 2	2003-04-29
Bifurcated deposition process for depositing refractory metal layers employing atomic layer deposition and chemical vapor deposition techniques Grant 6,551,929 - Kori , et al. April 22, 2	2003-04-22
Chemical vapor deposition chamber App 20030019428 - Ku, Vincent W. ; et al.	2003-01-30
Atomic layer deposition apparatus App 20030023338 - Chin, Barry L. ; et al.	2003-01-30
Low-resistivity tungsten from high-pressure chemical vapor deposition using metal-organic precursor App 20030008070 - Seutter, Sean Michael ; et al.	2003-01-09
Integrated barrier layer structure for copper contact level metallization App 20020192948 - Chen, Fusen ; et al.	2002-12-19
Plasma treatment of a titanium nitride film formed by chemical vapor deposition App 20020155219 - Wang, Shulin ; et al.	2002-10-24
Valve control system for atomic layer deposition chamber App 20020127745 - Lu, Siqing ; et al.	2002-09-12
Lid assembly for a processing system to facilitate sequential deposition techniques App 20020121342 - Nguyen, Anh N. ; et al.	2002-09-05
Processing chamber and method of distributing process fluids therein to facilitate sequential deposition of films App 20020121241 - Nguyen, Anh N. ; et al.	2002-09-05
Formation of a tantalum-nitride layer App 20020106846 - Seutter, Sean M. ; et al.	2002-08-08
Method Of Depositing A Thick Titanium Nitride Film App 20020064598 - WANG, SHULIN ; et al.	2002-05-30
Reliability barrier integration for Cu application App 20020060363 - Xi, Ming ; et al.	2002-05-23
Method for performing metallo-organic chemical vapor deposition of titanium nitride at reduced temperature Grant 6,365,495 - Wang , et al. April 2, 2	2002-04-02
Method For Performing Metallo-organic Chemical Vapor Deposition Of Titanium Nitride At Reduced Temperature App 20020001928 - WANG, SHULIN ; et al.	2002-01-03
Method of titanium/titanium nitride integration Grant 6,326,690 - Wang , et al. December 4, 2	2001-12-04
CVD deposition method to improve adhesion of F-containing dielectric metal lines for VLSI application Grant 6,323,119 - Xi , et al. November 27, 2	2001-11-27
Head for vaporizing and flowing various precursor materials onto semiconductor wafers during chemical vapor deposition Grant 6,299,692 - Ku , et al. October 9, 2	2001-10-09
Method of titanium/titanium nitride integration App 20010001297 - Wang, Shulin ; et al.	2001-05-17
Method of titanium/titanium nitride integration Grant 6,214,714 - Wang , et al. April 10, 2	2001-04-10
Method of depositing and amorphous fluorocarbon film using HDP-CVD Grant 6,211,065 - Xi , et al. April 3, 2	2001-04-03
High temperature resistive heater for a process chamber Grant 6,066,836 - Chen , et al. May 23, 2	2000-05-23
Process for chlorine trifluoride chamber cleaning Grant 5,926,743 - Xi , et al. July 20, 1	1999-07-20
Process for chlorine trifluoride chamber cleaning Grant 5,849,092 - Xi , et al. December 15, 1	1998-12-15
High temperature susceptor Grant 5,837,058 - Chen , et al. November 17, 1	1998-11-17

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