| Patent | Date |
|---|
Photosensitive Component, And Camera Module And Manufacturing Method Therefor
App 20220303437 - WANG; Mingzhu ; et al. | 2022-09-22 |
Camera module and molding circuit board assembly, circuit board and application thereof
Grant 11,451,693 - Wang , et al. September 20, 2 | 2022-09-20 |
Molded Photosensitive Assembly For Array Imaging Module For Electronic Device And Manufacturing Method Thereof
App 20220268968 - WANG; Mingzhu ; et al. | 2022-08-25 |
Photosensitive component, and camera module and manufacturing method therefor
Grant 11,388,320 - Wang , et al. July 12, 2 | 2022-07-12 |
Camera Module, Molded Photosensitive Assembly And Manufacturing Method Thereof, And Electronic Device
App 20220179288 - HUANG; Zhen ; et al. | 2022-06-09 |
Photosensitive Assembly And Camera Module And Manufacturing Method Thereof
App 20220094822 - WANG; Mingzhu ; et al. | 2022-03-24 |
Photosensitive assembly and camera module and manufacturing method thereof
Grant 11,223,751 - Wang , et al. January 11, 2 | 2022-01-11 |
Photosensitive Component, And Camera Module And Manufacturing Method Therefor
App 20210306530 - WANG; Mingzhu ; et al. | 2021-09-30 |
Camera Module And Molding Circuit Board Assembly, Circuit Board And Application Thereof
App 20210266436 - WANG; Mingzhu ; et al. | 2021-08-26 |
Camera module and molding circuit board assembly, circuit board and application thereof
Grant 11,039,052 - Wang , et al. June 15, 2 | 2021-06-15 |
Photosensitive Assembly and Camera Module and Manufacturing Method Thereof
App 20210127040 - WANG; Mingzhu ; et al. | 2021-04-29 |
Array Imaging Module and Molded Photosensitive Assembly and Manufacturing Method Thereof for Electronic Device
App 20210088696 - WANG; Mingzhu ; et al. | 2021-03-25 |
Molded photosensitive assembly of array imaging module
Grant 10,908,324 - Wang , et al. February 2, 2 | 2021-02-02 |
Camera Module And Molding Circuit Board Assembly, Circuit Board And Application Thereof
App 20200244852 - Kind Code | 2020-07-30 |
Molded Photosensitive Assembly for Array Imaging Module for Electronic Device and Manufacturing Method Thereof
App 20200218034 - WANG; Mingzhu ; et al. | 2020-07-09 |
Molded photosensitive assembly for array imaging module for electronic device
Grant 10,578,837 - Wang , et al. | 2020-03-03 |
Photosensitive assembly and camera module and manufacturing method thereof
Grant 10,582,097 - Wang , et al. | 2020-03-03 |
Photosensitive Assembly and Camera Module and Manufacturing Method Thereof
App 20190253585 - WANG; Mingzhu ; et al. | 2019-08-15 |
Array Imaging Module and Molded Photosensitive Assembly and Manufacturing Method Thereof for Electronic Device
App 20190179099 - WANG; Mingzhu ; et al. | 2019-06-13 |
Photosensitive assembly and camera module and manufacturing method thereof
Grant 10,321,028 - Wang , et al. | 2019-06-11 |
Manufacturing method of a molded photosensitive assembly of an array imaging module
Grant 10,274,694 - Wang , et al. | 2019-04-30 |
Array Imaging Module and Molded Photosensitive Assembly, Circuit Board Assembly and Manufacturing Methods Thereof for Electronic Device
App 20190041727 - WANG; Mingzhu ; et al. | 2019-02-07 |
Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device
Grant 10,175,447 - Wang , et al. J | 2019-01-08 |
Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device
Grant 10,148,859 - Wang , et al. De | 2018-12-04 |
Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device
Grant 10,126,519 - Wang , et al. November 13, 2 | 2018-11-13 |
Array Imaging Module and Molded Photosensitive Assembly and Manufacturing Method Thereof for Electronic Device
App 20180288296 - WANG; Mingzhu ; et al. | 2018-10-04 |
Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device
Grant 10,033,913 - Wang , et al. July 24, 2 | 2018-07-24 |
Array Imaging Module and Molded Photosensitive Assembly and Manufacturing Method Thereof for Electronic Device
App 20180164529 - WANG; Mingzhu ; et al. | 2018-06-14 |
Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device
Grant 9,906,700 - Wang , et al. February 27, 2 | 2018-02-27 |
Array Imaging Module and Molded Photosensitive Assembly and Manufacturing Method Thereof for Electronic Device
App 20180020138 - WANG; Mingzhu ; et al. | 2018-01-18 |
Array Imaging Module and Molded Photosensitive Assembly and Manufacturing Method Thereof for Electronic Device
App 20180012923 - WANG; Mingzhu ; et al. | 2018-01-11 |
Array Imaging Module and Molded Photosensitive Assembly and Manufacturing Method Thereof for Electronic Device
App 20180009141 - WANG; Mingzhu ; et al. | 2018-01-11 |
Photosensitive Assembly and Camera Module and Manufacturing Method Thereof
App 20180007244 - WANG; Mingzhu ; et al. | 2018-01-04 |
Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device
Grant 9,826,132 - Wang , et al. November 21, 2 | 2017-11-21 |
Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device
Grant 9,781,325 - Wang , et al. October 3, 2 | 2017-10-03 |
Array Imaging Module and Molded Photosensitive Assembly and Manufacturing Method Thereof for Electronic Device
App 20170264801 - WANG; Mingzhu ; et al. | 2017-09-14 |
Array Imaging Module and Molded Photosensitive Assembly and Manufacturing Method Thereof for Electronic Device
App 20170264804 - WANG; Mingzhu ; et al. | 2017-09-14 |
Array Imaging Module and Molded Photosensitive Assembly and Manufacturing Method Thereof for Electronic Device
App 20170264803 - WANG; Mingzhu ; et al. | 2017-09-14 |
Array Imaging Module and Molded Photosensitive Assembly and Manufacturing Method Thereof for Electronic Device
App 20170264802 - WANG; Mingzhu ; et al. | 2017-09-14 |
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