| Patent | Date |
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Trench insulation structure with enlarged electrically conductive side wall
App 20220293728 - LERNER; Ralf | 2022-09-15 |
Method of manufacturing semiconductor devices to increase yield in micro-transfer printing
Grant 11,437,266 - Lerner September 6, 2 | 2022-09-06 |
Ohmic contacts in semiconductor devices
Grant 11,417,757 - Sizov August 16, 2 | 2022-08-16 |
Anti-reflective layers in semiconductor devices
Grant 11,404,461 - Gabler August 2, 2 | 2022-08-02 |
Anodic bonding of a substrate of glass having contact vias to a substrate of silicon
Grant 11,398,452 - Weinberger , et al. July 26, 2 | 2022-07-26 |
Trench insulation structure with enlarged electrically conductive side wall
Grant 11,355,582 - Lerner June 7, 2 | 2022-06-07 |
Semiconductor device for light detection
Grant 11,276,787 - Gabler March 15, 2 | 2022-03-15 |
Substrates For Iii-nitride Epitaxy
App 20210381126 - Sizov; Victor ; et al. | 2021-12-09 |
Electrically modulated IR sensitive photodiode and its integration in CMOS
Grant 11,177,410 - Gabler , et al. November 16, 2 | 2021-11-16 |
Methods of fabricating field-effect transistors
Grant 11,152,504 - Reghunathan , et al. October 19, 2 | 2021-10-19 |
Lens layers for semiconductor devices
Grant 11,107,851 - Gabler August 31, 2 | 2021-08-31 |
Semiconductor structure
Grant 11,081,411 - Pittner August 3, 2 | 2021-08-03 |
Semiconductor device and method of manufacturing a semiconductor device
Grant 11,049,968 - Hee , et al. June 29, 2 | 2021-06-29 |
Optical sensors in semiconductor devices
Grant 11,037,974 - Zimmer , et al. June 15, 2 | 2021-06-15 |
Method for a transfer print between substrates
Grant 11,037,812 - Lerner , et al. June 15, 2 | 2021-06-15 |
Geometrically Shaped Components In An Assembly For A Transfer Print And Associated Methods
App 20210149311 - LERNER; Ralf | 2021-05-20 |
Semiconductor circuits, devices and methods
Grant 11,009,529 - Heinrich , et al. May 18, 2 | 2021-05-18 |
Through Silicon Via and Redistribution Layer
App 20210087053 - Weidner; Thomas ; et al. | 2021-03-25 |
Cmos Wavefront Sensors
App 20210066376A1 - | 2021-03-04 |
Semiconductor substrate and method for producing a semiconductor substrate
Grant 10,930,497 - Lerner February 23, 2 | 2021-02-23 |
Programmable read-only memory having at least four memory cells, each having switching element and data storage element arranged so that each switching element is connected to at least two selection lines and the storage elements are shared by a data line
Grant 10,930,359 - Rachinsky , et al. February 23, 2 | 2021-02-23 |
Flash memory with reference voltage generation from a plurality of cells
Grant 10,910,046 - Micakovic , et al. February 2, 2 | 2021-02-02 |
Method Of Fabricating A Field-effect Transistor
App 20210013340 - Reghunathan; Manoj Chandrika ; et al. | 2021-01-14 |
Method of manufacturing semiconductor devices to increase yield in microtransfer printing
App 20210005497 - LERNER; Ralf | 2021-01-07 |
Real-time Monitoring Of A Multi-zone Vertical Furnace With Early Detection Of A Failure Of A Heating Zone Element
App 20200411343 - GRUBER; Sven | 2020-12-31 |
Single Photon Avalanche Diode Devices
App 20200411710 - Gabler; Daniel ; et al. | 2020-12-31 |
Trench insulation structure with enlarged electrically conductive side wall
App 20200388674 - LERNER; Ralf | 2020-12-10 |
ESD-protection device and MOS-Transistor having at least one integrated ESD-protection device
App 20200388607 - STEINBECK; Lutz | 2020-12-10 |
Geometrically shaped components in an assembly for a transfer print and associated methods
Grant 10,845,710 - Lerner November 24, 2 | 2020-11-24 |
Electrically conductive via(s) in a semiconductor substrate and associated production method
Grant 10,825,728 - Knechtel , et al. November 3, 2 | 2020-11-03 |
Semiconductor Device for Light Detection
App 20200343389 - Gabler; Daniel | 2020-10-29 |
Anodic Bonding of a Substrate of Glass having Contact Vias to a Substrate of Silicon
App 20200258862 - A1 | 2020-08-13 |
Anodic Bonding of a Substrate of Glass having Contact Vias to a Substrate of Silicon
App 20200258863 - A1 | 2020-08-13 |
Optical sensor having two taps for photon-generated electrons of visible and IR light
Grant 10,672,808 - Gaebler | 2020-06-02 |
Anodic Bonding of a Substrate of Glass having Contact Vias to a Substrate of Silicon
App 20200118967 - WEINBERGER; Stefan ; et al. | 2020-04-16 |
Method of fabricating a tunnel oxide layer and a tunnel oxide layer for a semiconductor device
Grant 10,622,449 - Hee , et al. | 2020-04-14 |
Sleek serial interface for a wrapper boundary register (device and method)
Grant 10,591,537 - Mueller-Schniek | 2020-03-17 |
Lens Layers For Semiconductor Devices
App 20200052026 - Gabler; Daniel | 2020-02-13 |
Semiconductor Structure
App 20200051875 - PITTNER; Matthias | 2020-02-13 |
Flash Memory
App 20200020394 - MICAKOVIC; Predrag ; et al. | 2020-01-16 |
Semiconductor device
Grant 10,529,866 - Tee , et al. J | 2020-01-07 |
Substrates For Iii-nitride Epitaxy
App 20190390365 - Sizov; Victor ; et al. | 2019-12-26 |
Anti-reflective Layers In Semiconductor Devices
App 20190393251 - Gabler; Daniel | 2019-12-26 |
Thermopile test structure and methods employing same
Grant 10,502,631 - Hofmann , et al. Dec | 2019-12-10 |
Optical Sensor Having Two Taps For Photon-generated Electrons Of Visible And Ir Light
App 20190363113 - Gaebler; Daniel | 2019-11-28 |
Electrically Modulated Ir Sensitive Photodiode And Its Integration In Cmos
App 20190288151 - GABLER; Daniel ; et al. | 2019-09-19 |
Programmable Read-only Memory Device
App 20190287636 - RACHINSKY; Rumen ; et al. | 2019-09-19 |
Optical sensor having two taps for photon-generated electrons of visible and IR light
Grant 10,411,049 - Gaebler Sept | 2019-09-10 |
Electrically Conductive Via(s) In A Semiconductor Substrate And Associated Production Method
App 20190198395 - Knechtel; Roy ; et al. | 2019-06-27 |
Sleek Serial Interface For A Wrapper Boundary Register (device And Method)
App 20190170821 - Mueller-Schniek; Ulrike | 2019-06-06 |
Electrically conductive via(s) in a semiconductor substrate and associated production method
Grant 10,199,274 - Knechtel , et al. Fe | 2019-02-05 |
Integrated circuit having a component provided by transfer print and method for making the integrated circuit
Grant 10,186,502 - Lerner Ja | 2019-01-22 |
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