loadpatents
name:-0.088111162185669
name:-0.013097047805786
name:-0.00054812431335449
Wynne; Jean E. Patent Filings

Wynne; Jean E.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wynne; Jean E..The latest application filed is for "barrier sequence for use in copper interconnect metallization".

Company Profile
0.10.9
  • Wynne; Jean E. - Fair Haven NY
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method of making a copper interconnect having a barrier liner of multiple metal layers
Grant 8,841,212 - Nogami , et al. September 23, 2
2014-09-23
Barrier Sequence For Use In Copper Interconnect Metallization
App 20130005137 - Nogami; Takeshi ;   et al.
2013-01-03
Programming of laser fuse
Grant 7,981,732 - Badami , et al. July 19, 2
2011-07-19
Low leakage metal-containing cap process using oxidation
Grant 7,867,897 - Gambino , et al. January 11, 2
2011-01-11
Laser fuse structures for high power applications
Grant 7,701,035 - Greco , et al. April 20, 2
2010-04-20
Low Leakage Metal-containing Cap Process Using Oxidation
App 20100021656 - Gambino; Jeffrey P. ;   et al.
2010-01-28
Low leakage metal-containing cap process using oxidation
Grant 7,598,614 - Gambino , et al. October 6, 2
2009-10-06
Barrier Sequence For Use In Copper Interconnect Metallization
App 20090179328 - Nogami; Takeshi ;   et al.
2009-07-16
Method of forming a crack stop void in a low-k dielectric layer between adjacent fuses
Grant 7,479,447 - Daubenspeck , et al. January 20, 2
2009-01-20
Programming Of Laser Fuse
App 20080194064 - Badami; Dinesh A. ;   et al.
2008-08-14
Structure and programming of laser fuse
Grant 7,384,824 - Badami , et al. June 10, 2
2008-06-10
Low Leakage Metal-containing Cap Process Using Oxidation
App 20070235875 - Gambino; Jeffrey P. ;   et al.
2007-10-11
Laser Fuse Structures For High Power Applications
App 20070120232 - Greco; Stephen E. ;   et al.
2007-05-31
Method Of Forming A Crack Stop Void In A Low-k Dielectric Layer Between Adjacent Fusees
App 20060223242 - Daubenspeck; Timothy H. ;   et al.
2006-10-05
Structure and programming of laser fuse
App 20060145291 - Badami; Dinesh A. ;   et al.
2006-07-06
Structure and programming of laser fuse
Grant 7,064,409 - Badami , et al. June 20, 2
2006-06-20
Structure And Programming Of Laser Fuse
App 20050093091 - Badami, Dinesh A. ;   et al.
2005-05-05
Heat dissipation from IC interconnects
Grant 6,798,066 - Motsiff , et al. September 28, 2
2004-09-28

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