loadpatents
Patent applications and USPTO patent grants for Wynne; Jean E..The latest application filed is for "barrier sequence for use in copper interconnect metallization".
Patent | Date |
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Method of making a copper interconnect having a barrier liner of multiple metal layers Grant 8,841,212 - Nogami , et al. September 23, 2 | 2014-09-23 |
Barrier Sequence For Use In Copper Interconnect Metallization App 20130005137 - Nogami; Takeshi ;   et al. | 2013-01-03 |
Programming of laser fuse Grant 7,981,732 - Badami , et al. July 19, 2 | 2011-07-19 |
Low leakage metal-containing cap process using oxidation Grant 7,867,897 - Gambino , et al. January 11, 2 | 2011-01-11 |
Laser fuse structures for high power applications Grant 7,701,035 - Greco , et al. April 20, 2 | 2010-04-20 |
Low Leakage Metal-containing Cap Process Using Oxidation App 20100021656 - Gambino; Jeffrey P. ;   et al. | 2010-01-28 |
Low leakage metal-containing cap process using oxidation Grant 7,598,614 - Gambino , et al. October 6, 2 | 2009-10-06 |
Barrier Sequence For Use In Copper Interconnect Metallization App 20090179328 - Nogami; Takeshi ;   et al. | 2009-07-16 |
Method of forming a crack stop void in a low-k dielectric layer between adjacent fuses Grant 7,479,447 - Daubenspeck , et al. January 20, 2 | 2009-01-20 |
Programming Of Laser Fuse App 20080194064 - Badami; Dinesh A. ;   et al. | 2008-08-14 |
Structure and programming of laser fuse Grant 7,384,824 - Badami , et al. June 10, 2 | 2008-06-10 |
Low Leakage Metal-containing Cap Process Using Oxidation App 20070235875 - Gambino; Jeffrey P. ;   et al. | 2007-10-11 |
Laser Fuse Structures For High Power Applications App 20070120232 - Greco; Stephen E. ;   et al. | 2007-05-31 |
Method Of Forming A Crack Stop Void In A Low-k Dielectric Layer Between Adjacent Fusees App 20060223242 - Daubenspeck; Timothy H. ;   et al. | 2006-10-05 |
Structure and programming of laser fuse App 20060145291 - Badami; Dinesh A. ;   et al. | 2006-07-06 |
Structure and programming of laser fuse Grant 7,064,409 - Badami , et al. June 20, 2 | 2006-06-20 |
Structure And Programming Of Laser Fuse App 20050093091 - Badami, Dinesh A. ;   et al. | 2005-05-05 |
Heat dissipation from IC interconnects Grant 6,798,066 - Motsiff , et al. September 28, 2 | 2004-09-28 |
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