Wylie; Jacob

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wylie; Jacob.The latest application filed is for "method and apparatus for wafer electroless plating".

Company Profile

0.10.7

Wylie; Jacob - Fremont CA
Wylie; Jacob - San Diego CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method and apparatus for wafer electroless plating Grant 9,287,110 - Thie , et al. March 15, 2	2016-03-15
Fluid handling system for wafer electroless plating and associated methods Grant 8,844,461 - Thie , et al. September 30, 2	2014-09-30
Method and Apparatus for Wafer Electroless Plating App 20130280917 - Thie; William ; et al.	2013-10-24
Method and apparatus for wafer electroless plating Grant 8,485,120 - Thie , et al. July 16, 2	2013-07-16
Wafer electroless plating system and associated methods Grant 8,314,027 - Thie , et al. November 20, 2	2012-11-20
Proximity processing using controlled batch volume with an integrated proximity head Grant 8,221,608 - Woods , et al. July 17, 2	2012-07-17
Wafer Electroless Plating System and Associated Methods App 20120045897 - Thie; William ; et al.	2012-02-23
Apparatus for gate valve movement in a minimum-space wet process environment Grant 8,083,207 - Wylie , et al. December 27, 2	2011-12-27
Wafer electroless plating system and associated methods Grant 8,069,813 - Thie , et al. December 6, 2	2011-12-06
Proximity Processing Using Controlled Batch Volume With An Integrated Proximity Head App 20110017605 - Woods; Carl A. ; et al.	2011-01-27
Proximity processing using controlled batch volume with an integrated proximity head Grant 7,811,423 - Woods , et al. October 12, 2	2010-10-12
Proximity Processing Using Controlled Batch Volume With An Integrated Proximtiy Head App 20080296166 - Woods; Carl A. ; et al.	2008-12-04
Fluid Handling System for Wafer Electroless Plating and Associated Methods App 20080251148 - Thie; William ; et al.	2008-10-16
Wafer Electroless Plating System and Associated Methods App 20080254621 - Thie; William ; et al.	2008-10-16
Method and Apparatus for Wafer Electroless Plating App 20080254225 - Thie; William ; et al.	2008-10-16

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.