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name:-0.010939121246338
name:-0.0080459117889404
name:-0.00043010711669922
Wulkesch; Hans Patent Filings

Wulkesch; Hans

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wulkesch; Hans.The latest application filed is for "method for producing at least one optoelectronic semiconductor component".

Company Profile
0.10.9
  • Wulkesch; Hans - Munchen DE
  • Wulkesch; Hans - Munich N/A DE
  • Wulkesch; Hans - Muenchen DE
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method for producing at least one optoelectronic semiconductor component
Grant 9,105,771 - Weidner , et al. August 11, 2
2015-08-11
Method for selectively producing film laminates for packaging and for insulating unpackaged electronic components and functional patterns and corresponding device
Grant 8,591,689 - Naundorf , et al. November 26, 2
2013-11-26
Method For Producing At Least One Optoelectronic Semiconductor Component
App 20130214323 - Weidner; Karl ;   et al.
2013-08-22
Optoelectronic component and production method for an optoelectronic component
Grant 8,513,682 - Wegleiter , et al. August 20, 2
2013-08-20
Strip conductor structure for minimizing thermomechanical loads
Grant 8,415,802 - Kaspar , et al. April 9, 2
2013-04-09
Method for producing a hermetically sealed, electrical feedthrough using exothermic nanofilm
Grant 8,227,297 - Naundorf , et al. July 24, 2
2012-07-24
Method for making contact with a contact surface on a substrate
Grant 8,191,243 - Bittmann , et al. June 5, 2
2012-06-05
Method For Producing A Hermetically Sealed, Electrical Feedthrough Using Exothermic Nanofilm
App 20110049729 - Naundorf; Jorg ;   et al.
2011-03-03
Optoelectronic Component and Production Method for an Optoelectronic Component
App 20100301355 - Wegleiter; Walter ;   et al.
2010-12-02
Strip conductor structure for minimizing thermomechanocal loads
App 20100289152 - Kaspar; Michael ;   et al.
2010-11-18
Method for Selectively Producting Film Laminates for Packaging and for Insulating Unpackaged Electronic Components and Functional Patterns and Corresponding Device
App 20090029035 - Naundorf; Jorg ;   et al.
2009-01-29
Method for Producing Planar Insulating Layers With Breakthroughs at the Correct Position by Means of Laser Cutting and Devices Produced Accordingly
App 20090021923 - Bittmann; Ladislaus ;   et al.
2009-01-22
Adhesive Strip Conductor on an Insulating Layer
App 20080191360 - Weidner; Karl ;   et al.
2008-08-14
Strip Conductor Structure for Minimizing Thermomechanical Loads
App 20080164616 - Kaspar; Michael ;   et al.
2008-07-10

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