| Patent | Date |
|---|
Dielectric Layer, Interconnection Structure Using The Same, And Manufacturing Method Thereof
App 20210202241 - HO; Yi-Chen ; et al. | 2021-07-01 |
Dielectric layer, interconnection structure using the same, and manufacturing method thereof
Grant 10,950,426 - Ho , et al. March 16, 2 | 2021-03-16 |
Dielectric Layer, Interconnection Structure Using The Same, And Manufacturing Method Thereof
App 20200058495 - HO; Yi-Chen ; et al. | 2020-02-20 |
Semiconductor structure having an air-gap region and a method of manufacturing the same
Grant 10,361,152 - Su , et al. | 2019-07-23 |
Method for fabricating back-contact type solar cell
Grant 9,178,086 - Hu , et al. November 3, 2 | 2015-11-03 |
Impurity doped UV protection layer
Grant 9,136,226 - Wu , et al. September 15, 2 | 2015-09-15 |
Method For Fabricating Back-contact Type Solar Cell
App 20150243806 - HU; Yen-Cheng ; et al. | 2015-08-27 |
Semiconductor Structure Having An Air-gap Region And A Method Of Manufacturing The Same
App 20150200160 - SU; Shu-Hui ; et al. | 2015-07-16 |
Semiconductor structure having an air-gap region and a method of manufacturing the same
Grant 8,999,839 - Su , et al. April 7, 2 | 2015-04-07 |
Method of making a semiconductor device including barrier layers for copper interconnect
Grant 8,975,749 - Liu , et al. March 10, 2 | 2015-03-10 |
Solar cell
Grant 8,952,244 - Hu , et al. February 10, 2 | 2015-02-10 |
Solar Cell And Manufacturing Method Thereof
App 20140295612 - Kuo; Cheng-Chang ; et al. | 2014-10-02 |
Solar cell and method of fabricating the same
Grant 8,835,753 - Hu , et al. September 16, 2 | 2014-09-16 |
Solar cell
Grant 8,779,281 - Hu , et al. July 15, 2 | 2014-07-15 |
Method Of Making A Semiconductor Device Including Barrier Layers For Copper Interconnect
App 20140127898 - LIU; Nai-Wei ; et al. | 2014-05-08 |
Solar Cell And Method For Fabricating The Same
App 20140060629 - Lai; Liang-Hsing ; et al. | 2014-03-06 |
Solar Cell And Fabricating Method Thereof
App 20140048129 - CHEN; Tsung-Pao ; et al. | 2014-02-20 |
Barrier layers for copper interconnect
Grant 8,653,664 - Liu , et al. February 18, 2 | 2014-02-18 |
Solar Cell And Manufacturing Method Thereof
App 20130312820 - HU; Yen-Cheng ; et al. | 2013-11-28 |
Semiconductor Structure Having An Air-gap Region And A Method Of Manufacturing The Same
App 20130252144 - SU; Shu-Hui ; et al. | 2013-09-26 |
Solar Panel Module
App 20130192658 - Tseng; Huang-Chi ; et al. | 2013-08-01 |
Solar Cell Having Buried Electrode
App 20130167919 - LAI; Liang-Hsing ; et al. | 2013-07-04 |
Semiconductor structure having an air-gap region and a method of manufacturing the same
Grant 8,456,009 - Su , et al. June 4, 2 | 2013-06-04 |
Method of fabricating a solar cell
Grant 8,338,217 - Hu , et al. December 25, 2 | 2012-12-25 |
Method of forming solar cell
Grant 8,334,163 - Hu , et al. December 18, 2 | 2012-12-18 |
Method Of Fabricating Solar Cell
App 20120264253 - Chiu; Ming-Hui ; et al. | 2012-10-18 |
Method Of Fabricating A Solar Cell
App 20120171805 - Hu; Yen-Cheng ; et al. | 2012-07-05 |
Solar Cell And Method Of Fabricating The Same
App 20120167966 - Hu; Yen-Cheng ; et al. | 2012-07-05 |
Solar Cell
App 20120167973 - Hu; Yen-Cheng ; et al. | 2012-07-05 |
Solar Cell And Manufacturing Method Thereof
App 20120138127 - Kuo; Cheng-Chang ; et al. | 2012-06-07 |
Solar Cell
App 20120097236 - Hu; Yen-Cheng ; et al. | 2012-04-26 |
Solar Cell And Method Of Making The Same
App 20120097246 - Liu; Chee-Wee ; et al. | 2012-04-26 |
Semiconductor device including I/O oxide nitrided core oxide on substrate
Grant 8,084,328 - Wu , et al. December 27, 2 | 2011-12-27 |
Semiconductor Structure Having An Air-gap Region And A Method Of Manufacturing The Same
App 20110198757 - SU; Shu-Hui ; et al. | 2011-08-18 |
Semiconductor device including I/O oxide nitrided core oxide on substrate, and method of manufacture
App 20110081758 - Wu; Zhen-Cheng ; et al. | 2011-04-07 |
Barrier Layers For Copper Interconnect
App 20110006429 - LIU; Nai-Wei ; et al. | 2011-01-13 |
Semiconductor device including I/O oxide and nitrided core oxide on substrate
Grant 7,834,405 - Wu , et al. November 16, 2 | 2010-11-16 |
Impurity Doped UV Protection Layer
App 20100213518 - Wu; Zhen-Cheng ; et al. | 2010-08-26 |
Impurity doped UV protection layer
Grant 7,732,923 - Wu , et al. June 8, 2 | 2010-06-08 |
Semiconductor device
Grant 7,485,949 - Ko , et al. February 3, 2 | 2009-02-03 |
Method for forming dielectric film to improve adhesion of low-k film
Grant 7,465,676 - Tsai , et al. December 16, 2 | 2008-12-16 |
Semiconductor device
App 20080272493 - Ko; Chung-Chi ; et al. | 2008-11-06 |
Peeling-free porous capping material
App 20080188074 - Chen; I-I ; et al. | 2008-08-07 |
Initiation layer for reducing stress transition due to curing
App 20080116578 - Wang; Kuan-Chen ; et al. | 2008-05-22 |
Method Of Fabricating An Interconnect Structure
App 20070249164 - Chen; Pi-Tsung ; et al. | 2007-10-25 |
Method for forming dielectric film to improve adhesion of low-k film
App 20070249159 - Tsai; Fang Wen ; et al. | 2007-10-25 |
Copper damascene integration scheme for improved barrier layers
Grant 7,259,090 - Wu , et al. August 21, 2 | 2007-08-21 |
Copper interconnects
Grant 7,253,524 - Wu , et al. August 7, 2 | 2007-08-07 |
Method for planarizing semiconductor structures
Grant 7,247,571 - Chen , et al. July 24, 2 | 2007-07-24 |
Post-ESL porogen burn-out for copper ELK integration
Grant 7,217,648 - Lu , et al. May 15, 2 | 2007-05-15 |
Interconnect structure with dielectric barrier and fabrication method thereof
Grant 7,196,423 - Wu , et al. March 27, 2 | 2007-03-27 |
Reliability improvement of SiOC etch with trimethylsilane gas passivation in Cu damascene interconnects
Grant 7,193,325 - Wu , et al. March 20, 2 | 2007-03-20 |
Method for planarizing semiconductor structures
App 20070054494 - Chen; Ying-Tsung ; et al. | 2007-03-08 |
Semiconductor device including I/O oxide and nitrided core oxide on substrate, and method of manufacture
App 20070013009 - Wu; Zhen-Cheng ; et al. | 2007-01-18 |
Decreasing metal-silicide oxidation during wafer queue time
Grant 7,160,800 - Wu , et al. January 9, 2 | 2007-01-09 |
Method of a non-metal barrier copper damascene integration
Grant 7,151,315 - Wu , et al. December 19, 2 | 2006-12-19 |
Metal barrier integrity via use of a novel two step PVD-ALD deposition procedure
Grant 7,135,408 - Wu , et al. November 14, 2 | 2006-11-14 |
Silicon oxycarbide and silicon carbonitride based materials for MOS devices
Grant 7,115,974 - Wu , et al. October 3, 2 | 2006-10-03 |
BEOL integration scheme for etching damage free ELK
App 20060216924 - Wu; Zhen-Cheng ; et al. | 2006-09-28 |
Decreasing Metal-Silicide Oxidation During Wafer Queue Time
App 20060154481 - Wu; Zhen-Cheng ; et al. | 2006-07-13 |
Impurity doped UV protection layer
App 20060145303 - Wu; Zhen-Cheng ; et al. | 2006-07-06 |
Post-ESL porogen burn-out for copper ELK integration
App 20060134906 - Lu; Yung-Cheng ; et al. | 2006-06-22 |
Back end of line integration scheme
App 20060125102 - Wu; Zhen-Cheng ; et al. | 2006-06-15 |
Methods and Structures to Produce a Strain-Inducing Layer in a Semiconductor Device
App 20060118892 - Wu; Zhen-Cheng ; et al. | 2006-06-08 |
Method of forming copper interconnects
Grant 7,056,826 - Wu , et al. June 6, 2 | 2006-06-06 |
Copper damascene barrier and capping layer
App 20060024954 - Wu; Zhen-Cheng ; et al. | 2006-02-02 |
Copper damascene integration scheme for improved barrier layers
App 20050245071 - Wu, Zhen-Cheng ; et al. | 2005-11-03 |
Reliability improvement of SiOC etch with trimethylsilane gas passivation in Cu damascene interconnects
App 20050245100 - Wu, Zhen-Cheng ; et al. | 2005-11-03 |
Silicon oxycarbide and silicon carbonitride based materials for MOS devices
App 20050236694 - Wu, Zhen-Cheng ; et al. | 2005-10-27 |
Interconnect structure with dielectric barrier and fabrication method thereof
App 20050212135 - Wu, Zhen-Cheng ; et al. | 2005-09-29 |
Copper interconnects
App 20050110153 - Wu, Zhen-Cheng ; et al. | 2005-05-26 |
Method of fabricating barrierless and embedded copper damascene interconnects
Grant 6,878,621 - Wu , et al. April 12, 2 | 2005-04-12 |
Method of a non-metal barrier copper damascene integration
App 20040251547 - Wu, Zhen-Cheng ; et al. | 2004-12-16 |
Novel method of fabricating barrierless and embedded copper damascene interconnects
App 20040142561 - Wu, Zhen-Cheng ; et al. | 2004-07-22 |
Method of forming copper interconnects
App 20040130035 - Wu, Zhen-Cheng ; et al. | 2004-07-08 |
Structure for improving interlevel conductor connections
Grant 6,753,607 - Wu , et al. June 22, 2 | 2004-06-22 |
Metal barrier integrity via use of a novel two step PVD-ALD deposition procedure
App 20040087136 - Wu, Zhen-Cheng ; et al. | 2004-05-06 |
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