Wu, Zhe-Sung
Patent Applications and Registrations
Patent applications and USPTO patent grants for Wu, Zhe-Sung.The latest application filed is for "method of wire bonding of a semiconductor device for resolving oxidation of copper bonding pad".
- Wu, Zhe-Sung - Taipei TW
| Patent | Date |
|---|---|
| Fabrication method for solder bump pattern of rear section wafer package App 20040082159 - Shieh, Wen-Lo ; et al. | 2004-04-29 |
| Method of wire bonding of a semiconductor device for resolving oxidation of copper bonding pad App 20040082174 - Shieh, Wen-Lo ; et al. | 2004-04-29 |
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