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Wu, Yi-Yung Patent Filings

Wu, Yi-Yung

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wu, Yi-Yung.The latest application filed is for "manufacturing method of monolithic integrated thermal bubble inkjet print heads and the structure for the same".

Company Profile
0.3.4
  • Wu, Yi-Yung - Taichung Hsien TW
  • Wu; Yi-Yung - Taichung TW
  • WU, YI-YUNG - HSINCHU HSIEN TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Manufacturing Method Of Monolithic Integrated Thermal Bubble Inkjet Print Heads And The Structure For The Same
App 20020075359 - Wuu, Dong-Sing ;   et al.
2002-06-20
Monolithic ink-jet print head and method of fabricating the same
Grant 6,406,134 - Hu , et al. June 18, 2
2002-06-18
Structure Of An Ink-jet Printhead Chip And Manufacturing Method Thereof
App 20020048943 - WANG, CHIEH-WEN ;   et al.
2002-04-25
Structure of an ink-jet printhead chip and manufacturing method thereof
App 20020020921 - Wang, Chieh-Wen ;   et al.
2002-02-21
Method For Manufacturing High-density Ink-jet Print Head
App 20010048452 - LAN, YUAN-LIANG ;   et al.
2001-12-06
Heat-generating resistor and use thereof
Grant 6,140,909 - Wu , et al. October 31, 2
2000-10-31
Method of prolonging lifetime of thermal bubble inkjet print head
Grant 6,126,260 - Lan , et al. October 3, 2
2000-10-03

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