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Package Structure With Fan-out Feature
App 20220310468 - LIN; Meng-Liang ; et al. | 2022-09-29 |
Semiconductor devices and methods of manufacturing
Grant 11,430,776 - Wu , et al. August 30, 2 | 2022-08-30 |
Via structure for packaging and a method of forming
Grant 11,410,953 - Ho , et al. August 9, 2 | 2022-08-09 |
Package Structure And Method Of Fabricating The Same
App 20220238456 - Wu; Yi-Wen ; et al. | 2022-07-28 |
Hybrid Micro-bump Integration With Redistribution Layer
App 20220230978 - Yang; Ting-Li ; et al. | 2022-07-21 |
Dual-sided Routing in 3D SiP Structure
App 20220199541 - Tsai; Po-Hao ; et al. | 2022-06-23 |
Structure and formation method of chip package with fan-out feature
Grant 11,362,010 - Lin , et al. June 14, 2 | 2022-06-14 |
Dual-sided routing in 3D SiP structure
Grant 11,322,447 - Tsai , et al. May 3, 2 | 2022-05-03 |
Package structure and method of fabricating the same
Grant 11,302,650 - Wu , et al. April 12, 2 | 2022-04-12 |
Method of making a pillar structure having a non-metal sidewall protection structure and integrated circuit including the same
Grant 11,257,714 - Hwang , et al. February 22, 2 | 2022-02-22 |
Integrated circuit packages and methods of forming same
Grant 11,239,233 - Wu , et al. February 1, 2 | 2022-02-01 |
Semiconductor Devices And Methods Of Manufacturing
App 20210391317 - Wu; Yi-Wen ; et al. | 2021-12-16 |
Method For Forming Package Structure
App 20210384125 - TSAI; Po-Hao ; et al. | 2021-12-09 |
Semiconductor Package With Improved Interposer Structure
App 20210375755 - Wu; Yi-Wen ; et al. | 2021-12-02 |
Integrated fan-out package and method of fabricating the same
Grant 11,133,265 - Hu , et al. September 28, 2 | 2021-09-28 |
Wafer level mold chase
Grant 11,114,313 - Liu , et al. September 7, 2 | 2021-09-07 |
Package structure with dam structure and method for forming the same
Grant 11,101,214 - Tsai , et al. August 24, 2 | 2021-08-24 |
Semiconductor package with improved interposer structure
Grant 11,094,625 - Wu , et al. August 17, 2 | 2021-08-17 |
Semiconductor Package And Method Of Manufacturing The Same
App 20210242117 - Hung; Shih-Ting ; et al. | 2021-08-05 |
Package Structure And Method Of Fabricating The Same
App 20210225776 - Wu; Yi-Wen ; et al. | 2021-07-22 |
Package Structure And Method Of Fabricating The Same
App 20210175168 - Wu; Yi-Wen ; et al. | 2021-06-10 |
Semiconductor packages and methods of manufacturing the same
Grant 11,024,581 - Wu , et al. June 1, 2 | 2021-06-01 |
Structure And Formation Method Of Chip Package With Fan-out Feature
App 20210118757 - LIN; Meng-Liang ; et al. | 2021-04-22 |
Semiconductor Device and Method
App 20210098397 - Yu; Chen-Hua ; et al. | 2021-04-01 |
Integrated fan-out package and method of fabricating the same
Grant 10,930,586 - Wu , et al. February 23, 2 | 2021-02-23 |
Dual-sided Routing in 3D SiP Structure
App 20210050295 - Tsai; Po-Hao ; et al. | 2021-02-18 |
Structure And Formation Method Of Chip Package With Conductive Support Elements
App 20200411444 - TSAI; Po-Hao ; et al. | 2020-12-31 |
Integrated circuit packages and methods of forming same
Grant 10,872,885 - Wu , et al. December 22, 2 | 2020-12-22 |
Semiconductor device and method
Grant 10,867,941 - Yu , et al. December 15, 2 | 2020-12-15 |
Wafer Level Mold Chase
App 20200365421 - LIU; Hsien-Wen ; et al. | 2020-11-19 |
Via Structure for Packaging and a Method of Forming
App 20200365541 - Ho; Ming-Che ; et al. | 2020-11-19 |
Bonding package components through plating
Grant 10,840,212 - Lim , et al. November 17, 2 | 2020-11-17 |
Forming Bonding Structures By Using Template Layer as Templates
App 20200328153 - Lii; Mirng-Ji ; et al. | 2020-10-15 |
Semiconductor Packages And Methods Of Manufacturing The Same
App 20200273805 - Wu; Yi-Wen ; et al. | 2020-08-27 |
Via structure for packaging and a method of forming
Grant 10,734,341 - Ho , et al. | 2020-08-04 |
Package Structure And Method For Forming The Same
App 20200211962 - TSAI; Po-Hao ; et al. | 2020-07-02 |
Semiconductor Package With Improved Interposer Structure
App 20200211956 - WU; Yi-Wen ; et al. | 2020-07-02 |
Forming bonding structures by using template layer as templates
Grant 10,700,001 - Lii , et al. | 2020-06-30 |
Integrated Fan-out Package And Method Of Fabricating The Same
App 20200118934 - Hu; Yu-Hsiang ; et al. | 2020-04-16 |
Via Structure for Packaging and a Method of Forming
App 20200058613 - Ho; Ming-Che ; et al. | 2020-02-20 |
Bonding Package Components Through Plating
App 20200020662 - Lim; Zheng-Yi ; et al. | 2020-01-16 |
Integrated Circuit Packages and Methods of Forming Same
App 20190393216 - Wu; Yi-Wen ; et al. | 2019-12-26 |
Integrated fan-out package and method of fabricating the same
Grant 10,510,673 - Hu , et al. Dec | 2019-12-17 |
Bonding package components through plating
Grant 10,483,230 - Lim , et al. Nov | 2019-11-19 |
Via structure for packaging and a method of forming
Grant 10,461,051 - Ho , et al. Oc | 2019-10-29 |
Integrated Fan-out Package And Method Of Fabricating The Same
App 20190279929 - Wu; Yi-Wen ; et al. | 2019-09-12 |
Semiconductor Device and Method
App 20190273055 - Yu; Chen-Hua ; et al. | 2019-09-05 |
Integrated fan-out package and method of fabricating the same
Grant 10,297,544 - Wu , et al. | 2019-05-21 |
Semiconductor device and method
Grant 10,297,560 - Yu , et al. | 2019-05-21 |
Integrated Fan-out Package And Method Of Fabricating The Same
App 20190096802 - Wu; Yi-Wen ; et al. | 2019-03-28 |
Via Structure for Packaging and a Method of Forming
App 20190088609 - Ho; Ming-Che ; et al. | 2019-03-21 |
Integrated Circuit Packages and Methods of Forming Same
App 20190006354 - Wu; Yi-Wen ; et al. | 2019-01-03 |
Integrated Fan-out Package And Method Of Fabricating The Same
App 20180374797 - Hu; Yu-Hsiang ; et al. | 2018-12-27 |
Cu pillar bump with L-shaped non-metal sidewall protection structure
Grant 10,163,837 - Hwang , et al. Dec | 2018-12-25 |
Via structure for packaging and a method of forming
Grant 10,134,700 - Ho , et al. November 20, 2 | 2018-11-20 |
Packaging devices and methods
Grant 10,079,200 - Liang , et al. September 18, 2 | 2018-09-18 |
Integrated fan-out package and method of fabricating the same
Grant 10,068,853 - Hu , et al. September 4, 2 | 2018-09-04 |
Bonding Structures and Methods Forming the Same
App 20180226342 - Lii; Mirng-Ji ; et al. | 2018-08-09 |
Semiconductor Device and Method
App 20180158789 - Yu; Chen-Hua ; et al. | 2018-06-07 |
Method of forming post-passivation interconnect structure
Grant 9,953,891 - Wu , et al. April 24, 2 | 2018-04-24 |
Bonding structures and methods forming the same
Grant 9,935,047 - Lii , et al. April 3, 2 | 2018-04-03 |
Semiconductor device and method
Grant 9,871,009 - Yu , et al. January 16, 2 | 2018-01-16 |
Post-passivation interconnect structure and method of forming same
Grant 9,859,242 - Chen , et al. January 2, 2 | 2018-01-02 |
Semiconductor Device and Method
App 20170365564 - Yu; Chen-Hua ; et al. | 2017-12-21 |
Integrated Fan-out Package And Method Of Fabricating The Same
App 20170323853 - Hu; Yu-Hsiang ; et al. | 2017-11-09 |
Bonding Package Components Through Plating
App 20170294402 - Lim; Zheng-Yi ; et al. | 2017-10-12 |
Packaging Devices and Methods
App 20170250129 - Liang; Shih-Wei ; et al. | 2017-08-31 |
Via Structure For Packaging And A Method Of Forming
App 20170194276 - Ho; Ming-Che ; et al. | 2017-07-06 |
Semiconductor package and method of manufacturing the same
Grant 9,698,028 - Lu , et al. July 4, 2 | 2017-07-04 |
Bonding package components through plating
Grant 9,691,738 - Lim , et al. June 27, 2 | 2017-06-27 |
Method of forming Cu pillar bump with non-metal sidewall spacer and metal top cap
Grant 9,685,372 - Hwang , et al. June 20, 2 | 2017-06-20 |
Post-Passivation Interconnect Structure and Method of Forming Same
App 20170141060 - Chen; Hsien-Wei ; et al. | 2017-05-18 |
Packaging devices and methods
Grant 9,653,418 - Liang , et al. May 16, 2 | 2017-05-16 |
Bonding Structures And Methods Forming The Same
App 20170110401 - Lii; Mirng-Ji ; et al. | 2017-04-20 |
Package on package interconnect structure
Grant 9,607,921 - Lu , et al. March 28, 2 | 2017-03-28 |
Cu Pillar Bump With L-shaped Non-metal Sidewall Protection Structure
App 20170084563 - HWANG; Chien Ling ; et al. | 2017-03-23 |
Via structure for packaging and a method of forming
Grant 9,601,355 - Ho , et al. March 21, 2 | 2017-03-21 |
Post-passivation interconnect structure and method of forming same
Grant 9,559,070 - Chen , et al. January 31, 2 | 2017-01-31 |
Package redistribution layer structure and method of forming same
Grant 9,548,283 - Lin , et al. January 17, 2 | 2017-01-17 |
Cu pillar bump with L-shaped non-metal sidewall protection structure
Grant 9,524,945 - Hwang , et al. December 20, 2 | 2016-12-20 |
Zero stand-off bonding system and method
Grant 9,418,956 - Lin , et al. August 16, 2 | 2016-08-16 |
Post-Passivation Interconnect Structure and Method of Forming Same
App 20160218075 - Chen; Hsien-Wei ; et al. | 2016-07-28 |
Semiconductor device with bump structure on an interconncet structure
Grant 9,385,076 - Chen , et al. July 5, 2 | 2016-07-05 |
Methods and apparatus of packaging semiconductor devices
Grant 9,368,462 - Wu , et al. June 14, 2 | 2016-06-14 |
Via Structure For Packaging And A Method Of Forming
App 20160155650 - Ho; Ming-Che ; et al. | 2016-06-02 |
Post-passivation interconnect structure AMD method of forming same
Grant 9,305,856 - Chen , et al. April 5, 2 | 2016-04-05 |
Method of making a conductive pillar bump with non-metal sidewall protection structure
Grant 9,287,171 - Wu , et al. March 15, 2 | 2016-03-15 |
Via structure for packaging and a method of forming
Grant 9,263,302 - Ho , et al. February 16, 2 | 2016-02-16 |
Bonding Package Components Through Plating
App 20150364449 - Lim; Zheng-Yi ; et al. | 2015-12-17 |
Method Of Forming Post-passivation Interconnect Structure
App 20150325539 - WU; Yi-Wen ; et al. | 2015-11-12 |
Method Of Making A Pillar Structure Having A Non-metal Sidewall Protection Structure And Integrated Circuit Including The Same
App 20150325546 - HWANG; Chien Ling ; et al. | 2015-11-12 |
Semiconductor Package and Method of Manufacturing the Same
App 20150318252 - Lu; Wen-Hsiung ; et al. | 2015-11-05 |
Zero Stand-Off Bonding System and Method
App 20150303161 - Lin; Chun-Hung ; et al. | 2015-10-22 |
Method of making a pillar structure having a non-metal sidewall protection structure
Grant 9,136,167 - Hwang , et al. September 15, 2 | 2015-09-15 |
Via Structure For Packaging And A Method Of Forming
App 20150243531 - Ho; Ming-Che ; et al. | 2015-08-27 |
Packaging Devices and Methods
App 20150243615 - Liang; Shih-Wei ; et al. | 2015-08-27 |
Bonding package components through plating
Grant 9,117,772 - Lim , et al. August 25, 2 | 2015-08-25 |
Method Of Forming Cu Pillar Bump With Non-metal Sidewall Spacer And Metal Top Cap
App 20150228533 - HWANG; Chien Ling ; et al. | 2015-08-13 |
Post-passivation interconnect structure and method of forming the same
Grant 9,099,396 - Wu , et al. August 4, 2 | 2015-08-04 |
Semiconductor package having protective layer with curved surface and method of manufacturing same
Grant 9,082,776 - Lu , et al. July 14, 2 | 2015-07-14 |
Zero stand-off bonding system and method
Grant 9,064,880 - Lin , et al. June 23, 2 | 2015-06-23 |
Packaging devices and methods
Grant 9,030,010 - Liang , et al. May 12, 2 | 2015-05-12 |
Methods and Apparatus of Packaging Semiconductor Devices
App 20150123276 - Wu; Yi-Wen ; et al. | 2015-05-07 |
Cu pillar bump with non-metal sidewall spacer and metal top cap
Grant 9,018,758 - Hwang , et al. April 28, 2 | 2015-04-28 |
Methods and apparatus of packaging semiconductor devices
Grant 8,937,388 - Wu , et al. January 20, 2 | 2015-01-20 |
Method Of Making A Pillar Structure Having A Non-metal Sidewall Protection Structure
App 20140363970 - HWANG; Chien Ling ; et al. | 2014-12-11 |
Method Of Making A Conductive Pillar Bump With Non-metal Sidewall Protection Structure
App 20140335687 - WU; Yi-Wen ; et al. | 2014-11-13 |
UBM formation for integrated circuits
Grant 8,865,586 - Wu , et al. October 21, 2 | 2014-10-21 |
Cu pillar bump with non-metal sidewall protection structure
Grant 8,841,766 - Hwang , et al. September 23, 2 | 2014-09-23 |
Copper pillar bump with non-metal sidewall protection structure and method of making the same
Grant 8,823,167 - Wu , et al. September 2, 2 | 2014-09-02 |
Zero Stand-Off Bonding System and Method
App 20140183746 - Lin; Chun-Hung ; et al. | 2014-07-03 |
Forming wafer-level chip scale package structures with reduced number of seed layers
Grant 8,735,273 - Lu , et al. May 27, 2 | 2014-05-27 |
Packaging Devices and Methods
App 20140077369 - Liang; Shih-Wei ; et al. | 2014-03-20 |
Semiconductor Package And Method Of Manufacturing The Same
App 20140054764 - Lu; Wen-Hsiung ; et al. | 2014-02-27 |
Mechanisms for forming copper pillar bumps
Grant 8,659,155 - Cheng , et al. February 25, 2 | 2014-02-25 |
Package Redistribution Layer Structure and Method of Forming Same
App 20140008785 - Lin; Tsung-Shu ; et al. | 2014-01-09 |
Bonding Package components Through Plating
App 20130334692 - Lim; Zheng-Yi ; et al. | 2013-12-19 |
Methods and Apparatus of Packaging Semiconductor Devices
App 20130328190 - Wu; Yi-Wen ; et al. | 2013-12-12 |
Conductive feature for semiconductor substrate and method of manufacture
Grant 8,587,119 - Hwang , et al. November 19, 2 | 2013-11-19 |
Post passivation interconnect with oxidation prevention layer
Grant 8,569,887 - Hwang , et al. October 29, 2 | 2013-10-29 |
Post-passivation Interconnect Structure Amd Method Of Forming Same
App 20130207258 - CHEN; Hsien-Wei ; et al. | 2013-08-15 |
Metal bump formation
Grant 8,501,615 - Cheng , et al. August 6, 2 | 2013-08-06 |
Package on Package Interconnect Structure
App 20130181338 - Lu; Wen-Hsiung ; et al. | 2013-07-18 |
UBM Formation for Integrated Circuits
App 20130175685 - Wu; Yi-Wen ; et al. | 2013-07-11 |
Semiconductor Device With Bump Structure On Post-passivation Interconncet
App 20130147031 - CHEN; Hsien-Wei ; et al. | 2013-06-13 |
Cu pillar bump with non-metal sidewall protection structure
Grant 8,441,124 - Wu , et al. May 14, 2 | 2013-05-14 |
Post-passivation Interconnect Structure And Method Of Forming The Same
App 20130113094 - WU; Yi-Wen ; et al. | 2013-05-09 |
Forming Wafer-Level Chip Scale Package Structures with Reduced number of Seed Layers
App 20130009307 - Lu; Wen-Hsiung ; et al. | 2013-01-10 |
Metal Bump Formation
App 20120322255 - Cheng; Ming-Da ; et al. | 2012-12-20 |
Copper Pillar Bump With Non-metal Sidewall Protection Structure And Method Of Making The Same
App 20120280388 - WU; Yi-Wen ; et al. | 2012-11-08 |
Method of forming metal pillar
Grant 8,242,011 - Lim , et al. August 14, 2 | 2012-08-14 |
Method Of Forming Metal Pillar
App 20120178251 - LIM; Zheng-Yi ; et al. | 2012-07-12 |
Semiconductor Device Having Under-bump Metallization (ubm) Structure And Method Of Forming The Same
App 20120098124 - WU; Yi-Wen ; et al. | 2012-04-26 |
Cu Pillar Bump With Non-metal Sidewall Spacer And Metal Top Cap
App 20110298123 - HWANG; Chien Ling ; et al. | 2011-12-08 |
Cu Pillar Bump With L-shaped Non-metal Sidewall Protection Structure
App 20110285011 - HWANG; Chien Ling ; et al. | 2011-11-24 |
Cu Pillar Bump With Non-metal Sidewall Protection Structure
App 20110266667 - WU; Yi-Wen ; et al. | 2011-11-03 |
Conductive Feature For Semiconductor Substrate And Method Of Manufacture
App 20110254159 - HWANG; Chien Ling ; et al. | 2011-10-20 |
Cu Pillar Bump With Non-metal Sidewall Protection Structure
App 20110233761 - Hwang; Chien Ling ; et al. | 2011-09-29 |
Mechanisms For Forming Copper Pillar Bumps
App 20110101527 - CHENG; Ming-Da ; et al. | 2011-05-05 |
Pillar Bump With Barrier Layer
App 20110101523 - HWANG; Chien Ling ; et al. | 2011-05-05 |
Post Passivation Interconnect With Oxidation Prevention Layer
App 20110101521 - HWANG; Chien Ling ; et al. | 2011-05-05 |
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