Wu; Tzu-Heng

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wu; Tzu-Heng.The latest application filed is for "integrated microphone device and manufacturing method thereof".

Company Profile

4.11.10

Wu; Tzu-Heng - New Taipei TW
WU; Tzu-Heng - New Taipei City TW
Wu; Tzu-Heng - New Tapei TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Integrated microphone device and manufacturing method thereof Grant 11,184,694 - Cheng , et al. November 23, 2	2021-11-23
Method of fabricating semiconductor structure Grant 11,097,941 - Chang , et al. August 24, 2	2021-08-24
Integrated Microphone Device And Manufacturing Method Thereof App 20200213701 - CHENG; Chun-Wen ; et al.	2020-07-02
Integrated microphone device and manufacturing method thereof Grant 10,609,463 - Cheng , et al.	2020-03-31
Method Of Fabricating Semiconductor Structure App 20190256347 - CHANG; Yi-Hsien ; et al.	2019-08-22
Integrated Microphone Device And Manufacturing Method Thereof App 20190132662 - CHENG; Chun-Wen ; et al.	2019-05-02
Substrate structure, semiconductor structure and method for fabricating the same Grant 10,273,140 - Chang , et al.	2019-04-30
Semiconductor structure and manufacturing method thereof Grant 10,087,071 - Wu , et al. October 2, 2	2018-10-02
MEMS device and manufacturing method thereof Grant 10,065,852 - Cheng , et al. September 4, 2	2018-09-04
Semiconductor structure and manufacturing method thereof Grant 9,975,754 - Huang , et al. May 22, 2	2018-05-22
Semiconductor Structure And Manufacturing Method Thereof App 20180111824 - WU; TZU-HENG ; et al.	2018-04-26
Mems Device And Manufacturing Method Thereof App 20180086624 - CHENG; CHUN-WEN ; et al.	2018-03-29
Semiconductor Structure And Manufacturing Method Thereof App 20170297901 - HUANG; FU-CHUN ; et al.	2017-10-19
Semiconductor structure and manufacturing method thereof Grant 9,656,855 - Huang , et al. May 23, 2	2017-05-23
Capacitor with planarized bonding for CMOS-MEMS integration Grant 9,493,346 - Shen , et al. November 15, 2	2016-11-15
VHF etch barrier for semiconductor integrated microsystem Grant 9,449,867 - Wu , et al. September 20, 2	2016-09-20
Isolation structure for MEMS 3D IC integration Grant 9,446,945 - Tsai , et al. September 20, 2	2016-09-20
Substrate Structure, Semiconductor Structure And Method For Fabricating The Same App 20160207756 - CHANG; Yi-Hsien ; et al.	2016-07-21
Isolation Structure For Mems 3d Ic Integration App 20160145095 - Tsai; Yi-Heng ; et al.	2016-05-26
Capacitor With Planarized Bonding For Cmos-mems Integration App 20160031704 - Shen; Wei-Cheng ; et al.	2016-02-04
Vhf Etch Barrier For Semiconductor Integrated Microsystem App 20150364363 - Wu; Tzu-Heng ; et al.	2015-12-17

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