Wu; Tung-Ting

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wu; Tung-Ting.The latest application filed is for "device crack-stop structure to prevent damage due to dicing crack".

Company Profile

4.7.9

Wu; Tung-Ting - Taipei City TW
Wu; Tung-Ting - Taipei TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Device Crack-stop Structure To Prevent Damage Due To Dicing Crack App 20220246549 - Wu; Tung-Ting ; et al.	2022-08-04
Device crack-stop structure to prevent damage due to dicing crack Grant 11,348,881 - Wu , et al. May 31, 2	2022-05-31
Semiconductor Devices For Image Sensing App 20210351218 - Kuo; Chin-Chia ; et al.	2021-11-11
High Performance Image Sensor App 20210265412 - Wu; Tung-Ting ; et al.	2021-08-26
Semiconductor devices for image sensing Grant 11,075,242 - Kuo , et al. July 27, 2	2021-07-27
High performance image sensor Grant 10,991,746 - Wu , et al. April 27, 2	2021-04-27
Device Crack-stop Structure To Prevent Damage Due To Dicing Crack App 20210098392 - Wu; Tung-Ting ; et al.	2021-04-01
High Performance Image Sensor App 20200135792 - Wu; Tung-Ting ; et al.	2020-04-30
Semiconductor Devices For Image Sensing App 20190165026 - Kuo; Chin-Chia ; et al.	2019-05-30
Image sensor with low step height between back-side metal and pixel array Grant 10,074,680 - Tseng , et al. September 11, 2	2018-09-11
Semiconductor devices, image sensors, and methods of manufacture thereof Grant 9,859,326 - Chen , et al. January 2, 2	2018-01-02
Image Sensor with Low Step Height between Back-side Metal and Pixel Array App 20160190190 - Tseng; Chien-Hsien ; et al.	2016-06-30
Image sensor with low step height between back-side metal and pixel array Grant 9,299,740 - Tseng , et al. March 29, 2	2016-03-29
Semiconductor Devices, Image Sensors, and Methods of Manufacture Thereof App 20150214267 - Chen; Sheng-Chau ; et al.	2015-07-30
System and method for preventing etch arcing during semiconductor processing Grant 8,791,571 - Hsu , et al. July 29, 2	2014-07-29
Image Sensor with Low Step Height between Back-side Metal and Pixel Array App 20130320469 - Tseng; Chien-Hsien ; et al.	2013-12-05

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