WU; TSUNG-HUA
Patent Applications and Registrations
Patent applications and USPTO patent grants for WU; TSUNG-HUA.The latest application filed is for "optical sensing method and optical sensor module thereof".
- WU; TSUNG-HUA - ZHUBEI CITY TW
- Wu; Tsung-Hua - Taipei TW
- Wu; Tsung-Hua - Kaohsiung TW
- Wu; Tsung-Hua - Kaohsiung Hsien TW
- Wu; Tsung-Hua - Kao-Hsiung Hsien TW
- Wu; Tsung Hua - Niaosong Township TW
- Wu; Tsung-Hua - Kaohsing Hsien TW
| Patent | Date |
|---|---|
| Optical Sensing Method And Optical Sensor Module Thereof App 20210325253 - HSU; FENG-JUNG ; et al. | 2021-10-21 |
| Light Sensor Module App 20210285816 - HSU; FENG-JUNG ; et al. | 2021-09-16 |
| Connector and electronic device having the same Grant 7,955,100 - Chung , et al. June 7, 2 | 2011-06-07 |
| Connector And Electronic Device Having The Same App 20110003490 - Chung; Ming-Hung ; et al. | 2011-01-06 |
| Wafer structure with a multi-layer barrier in an UBM layer network device with power supply Grant 7,518,241 - Tai , et al. April 14, 2 | 2009-04-14 |
| Method of forming bumps Grant 7,375,020 - Wu , et al. May 20, 2 | 2008-05-20 |
| Chip scale package with micro antenna and method for manufacturing the same Grant 7,221,052 - Huang , et al. May 22, 2 | 2007-05-22 |
| Wafer structure App 20070045848 - Tai; Li-Cheng ; et al. | 2007-03-01 |
| Method For Forming Bumps App 20060276023 - Huang; Min-Lung ; et al. | 2006-12-07 |
| Wafer structure, chip structure, and fabricating process thereof App 20060134884 - Lo; Jian Wen ; et al. | 2006-06-22 |
| Wafer-level package structure Grant 7,064,428 - Tong , et al. June 20, 2 | 2006-06-20 |
| Chip Scale Package with Micro Antenna and Method for Manufacturing the same App 20060081982 - Huang; Min-Lung ; et al. | 2006-04-20 |
| Bump fabrication process Grant 6,967,153 - Tong , et al. November 22, 2 | 2005-11-22 |
| Structure for preventing burnt fuse pad from further electrical connection Grant 6,927,964 - Tong , et al. August 9, 2 | 2005-08-09 |
| Wafer-level Package Structure App 20050161812 - Tong, Ho-Ming ; et al. | 2005-07-28 |
| Method of forming bumps Grant 6,916,732 - Wu , et al. July 12, 2 | 2005-07-12 |
| Method Of Forming Bumps App 20050085061 - Wu, Tsung-Hua ; et al. | 2005-04-21 |
| Method of modifying tin to lead ratio in tin-lead bump Grant 6,877,653 - Tong , et al. April 12, 2 | 2005-04-12 |
| Process for fabricating wafer bumps Grant 6,846,719 - Tong , et al. January 25, 2 | 2005-01-25 |
| [method Of Forming Bumps] App 20040185651 - Wu, Tsung-Hua ; et al. | 2004-09-23 |
| Method for preventing burnt fuse pad from further electrical connection Grant 6,756,256 - Tong , et al. June 29, 2 | 2004-06-29 |
| [structure For Preventing Burnt Fuse Pad From Further Electrical Connection] App 20040114294 - Tong, Ho-Ming ; et al. | 2004-06-17 |
| Solder ball attaching process Grant 6,732,912 - Tong , et al. May 11, 2 | 2004-05-11 |
| Bump fabrication method Grant 6,720,244 - Tong , et al. April 13, 2 | 2004-04-13 |
| Bumping process Grant 6,713,320 - Tong , et al. March 30, 2 | 2004-03-30 |
| Solder paste for fabricating bump Grant 6,692,581 - Tong , et al. February 17, 2 | 2004-02-17 |
| Bump fabrication process Grant 6,664,128 - Tong , et al. December 16, 2 | 2003-12-16 |
| Lead-free bump fabrication process Grant 6,617,237 - Tong , et al. September 9, 2 | 2003-09-09 |
| Bump Fabrication Process App 20030166331 - Tong, Ho-Ming ; et al. | 2003-09-04 |
| Solder Paste For Fabricating Bump App 20030164204 - Tong, Ho-Ming ; et al. | 2003-09-04 |
| Solder Ball Attaching Process App 20030164395 - Tong, Ho-Ming ; et al. | 2003-09-04 |
| Bump fabrication method App 20030166332 - Tong, Ho-Ming ; et al. | 2003-09-04 |
| Bump Fabrication Process App 20030166330 - Tong, Ho-Ming ; et al. | 2003-09-04 |
| Method Of Modifying Tin To Lead Ratio In Tin-lead Bump App 20030160089 - Tong, Ho-Ming ; et al. | 2003-08-28 |
| Wafer-level Package Structure App 20030160323 - Tong, Ho-Ming ; et al. | 2003-08-28 |
| Bonding Structure For Bonding Substrates By Metal Studs App 20030161123 - Tong, Ho-Ming ; et al. | 2003-08-28 |
| Flip Chip Interconnection Structure And Fabrication Process Thereof App 20030160335 - TONG, HO-MING ; et al. | 2003-08-28 |
| Bmuping Process App 20030162321 - Tong, Ho-Ming ; et al. | 2003-08-28 |
| Method For Preventing Burnt Fuse Pad From Further Electrical Connection App 20030162331 - TONG, HO-MING ; et al. | 2003-08-28 |
| Lead-free Bump Fabrication Process App 20030162381 - Tong, Ho-Ming ; et al. | 2003-08-28 |
| Wafer Bump Fabrication Process App 20030162362 - Tong, Ho-Ming ; et al. | 2003-08-28 |
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