Wu; Ting-Hau
Patent Applications and Registrations
Patent applications and USPTO patent grants for Wu; Ting-Hau.The latest application filed is for "mems devices and methods of fabrication thereof".
Company Profile
3.36.33
- Wu; Ting-Hau - Yilan TW
- Wu; Ting-Hau - Yilan City TW
- Wu; Ting-Hau - Yilan County N/A TW
Patent Activity
| Patent | Date |
|---|---|
| MEMS devices and methods of fabrication thereof Grant 11,104,129 - Peng , et al. August 31, 2 | 2021-08-31 |
| MEMS method and structure Grant 10,889,493 - Wu , et al. January 12, 2 | 2021-01-12 |
| MEMS devices and methods of fabrication thereof Grant 10,688,786 - Peng , et al. | 2020-06-23 |
| MEMS Devices and Methods of Fabrication Thereof App 20200023642 - Peng; Jung-Huei ; et al. | 2020-01-23 |
| MEMS Method and Structure App 20190119105 - Wu; Ting-Hau ; et al. | 2019-04-25 |
| MEMS method and structure Grant 10,160,642 - Wu , et al. Dec | 2018-12-25 |
| MEMS Devices and Methods of Fabrication Thereof App 20180311955 - Peng; Jung-Huei ; et al. | 2018-11-01 |
| MEMS and method for forming the same Grant 10,023,459 - Chang , et al. July 17, 2 | 2018-07-17 |
| MEMS devices and methods of fabrication thereof Grant 9,950,522 - Peng , et al. April 24, 2 | 2018-04-24 |
| Methods of forming a gyroscope sensor and a structure for a gyroscope sensors Grant 9,677,884 - Wu , et al. June 13, 2 | 2017-06-13 |
| Semiconductor bonding structure and process Grant 9,502,370 - Chang , et al. November 22, 2 | 2016-11-22 |
| MEMS Method and Structure App 20160325988 - Wu; Ting-Hau ; et al. | 2016-11-10 |
| MEMS method and structure Grant 9,394,164 - Wu , et al. July 19, 2 | 2016-07-19 |
| Semiconductor Bonding Structure and Process App 20160163670 - Chang; Kuei-Sung ; et al. | 2016-06-09 |
| Socket type MEMS bonding Grant 9,321,632 - Wu April 26, 2 | 2016-04-26 |
| Semiconductor bonding structure and process Grant 9,281,287 - Chang , et al. March 8, 2 | 2016-03-08 |
| Triple-axis MEMS accelerometer Grant 9,238,581 - Wu , et al. January 19, 2 | 2016-01-19 |
| MEMS Devices and Methods of Fabrication Thereof App 20160009089 - Peng; Jung-Huei ; et al. | 2016-01-14 |
| MEMS and Method for Forming the Same App 20150353342 - Chang; Kuei-Sung ; et al. | 2015-12-10 |
| MEMS devices and methods of fabrication thereof Grant 9,138,994 - Peng , et al. September 22, 2 | 2015-09-22 |
| Method For The Prevention Of Suspended Silicon Structure Etching During Reactive Ion Etching App 20150191350 - Wu; Ting-Hau ; et al. | 2015-07-09 |
| Method for the prevention of suspended silicon structure etching during reactive ion etching Grant 8,987,845 - Wu , et al. March 24, 2 | 2015-03-24 |
| Semiconductor Bonding Structure and Process App 20150054161 - Chang; Kuei-Sung ; et al. | 2015-02-26 |
| Semiconductor bonding structure and process Grant 8,878,355 - Chang , et al. November 4, 2 | 2014-11-04 |
| Gyroscope Sensors App 20140283369 - WU; Ting-Hau ; et al. | 2014-09-25 |
| MEMS Method and Structure App 20140264644 - Wu; Ting-Hau ; et al. | 2014-09-18 |
| Gyroscope sensors Grant 8,776,600 - Wu , et al. July 15, 2 | 2014-07-15 |
| Socket Type Mems Bonding App 20140193949 - Wu; Ting-Hau | 2014-07-10 |
| Method for the Prevention of Suspended Silicon Structure Etching During Reactive Ion Etching App 20140131818 - Wu; Ting-Hau ; et al. | 2014-05-15 |
| Semiconductor Bonding Structure and Process App 20140117510 - Chang; Kuei-Sung ; et al. | 2014-05-01 |
| Triple-Axis MEMS Accelerometer App 20140024160 - Wu; Ting-Hau ; et al. | 2014-01-23 |
| Laser bonding for stacking semiconductor substrates Grant 8,563,400 - Wu , et al. October 22, 2 | 2013-10-22 |
| Laser Bonding for Stacking Semiconductor Substrates App 20130140285 - Wu; Ting-Hau ; et al. | 2013-06-06 |
| Method for reducing chip warpage Grant 8,455,999 - Wu , et al. June 4, 2 | 2013-06-04 |
| Laser bonding for stacking semiconductor substrates Grant 8,367,516 - Wu , et al. February 5, 2 | 2013-02-05 |
| Triple-axis MEMS accelerometer Grant 8,362,578 - Wu , et al. January 29, 2 | 2013-01-29 |
| Gyroscope Sensors App 20130000409 - WU; Ting-Hau ; et al. | 2013-01-03 |
| Process for eliminating delamination between amorphous silicon layers Grant 8,309,441 - Lee , et al. November 13, 2 | 2012-11-13 |
| Method to produce 3-D optical gyroscope my MEMS technology Grant 8,281,658 - Wu , et al. October 9, 2 | 2012-10-09 |
| Method and apparatus for cooling an integrated circuit Grant 8,237,263 - Wu , et al. August 7, 2 | 2012-08-07 |
| Metal-ceramic multilayer structure Grant 8,237,235 - Wu , et al. August 7, 2 | 2012-08-07 |
| MEMS microphone with single polysilicon film Grant 8,218,286 - Wu , et al. July 10, 2 | 2012-07-10 |
| Triple-axis MEMS accelerometer having a bottom capacitor Grant 8,106,470 - Wu , et al. January 31, 2 | 2012-01-31 |
| Method for Reducing Chip Warpage App 20120007220 - Wu; Ting-Hau ; et al. | 2012-01-12 |
| Method for reducing chip warpage Grant 8,053,336 - Wu , et al. November 8, 2 | 2011-11-08 |
| Low stress photo-sensitive resin with sponge-like structure and devices manufactured employing same Grant 8,053,377 - Tsai , et al. November 8, 2 | 2011-11-08 |
| Process for Eliminating Delamination between Amorphous Silicon Layers App 20110263106 - Lee; Jiou-Kang ; et al. | 2011-10-27 |
| Silicon undercut prevention in sacrificial oxide release process and resulting MEMS structures Grant 7,998,775 - Tsai , et al. August 16, 2 | 2011-08-16 |
| Process for eliminating delamination between amorphous silicon layers Grant 7,999,257 - Lee , et al. August 16, 2 | 2011-08-16 |
| Method and Apparatus for Cooling an Integrated Circuit App 20110156245 - Wu; Ting-Hau ; et al. | 2011-06-30 |
| Multi-step process for forming high-aspect-ratio holes for MEMS devices Grant 7,923,379 - Lee , et al. April 12, 2 | 2011-04-12 |
| Low Stress Photo-Sensitive Resin with Sponge-Like Structure and Devices Manufactured Employing Same App 20110081740 - TSAI; SHANG-YING ; et al. | 2011-04-07 |
| Socket Type Mems Bonding App 20110012247 - Wu; Ting-Hau | 2011-01-20 |
| Triple-Axis MEMS Accelerometer Having a Bottom Capacitor App 20100308424 - Wu; Ting-Hau ; et al. | 2010-12-09 |
| Triple-Axis MEMS Accelerometer App 20100301433 - Wu; Ting-Hau ; et al. | 2010-12-02 |
| Metal-Ceramic Multilayer Structure App 20100258883 - Wu; Ting-Hau ; et al. | 2010-10-14 |
| MEMS Devices and Methods of Fabrication Thereof App 20100225708 - Peng; Jung-Huei ; et al. | 2010-09-09 |
| Silicon Undercut Prevention in Sacrificial Oxide Release Process and Resulting MEMS Structures App 20100203664 - Tsai; Shang-Ying ; et al. | 2010-08-12 |
| Method to produce 3-D optical gyroscope my MEMS technology App 20100175479 - Wu; Ting-Hau ; et al. | 2010-07-15 |
| Laser Bonding for Stacking Semiconductor Substrates App 20100178732 - Wu; Ting-Hau ; et al. | 2010-07-15 |
| MEMS Microphone with Single Polysilicon Film App 20100117168 - Wu; Ting-Hau ; et al. | 2010-05-13 |
| Method for Reducing Chip Warpage App 20100120202 - Wu; Ting-Hau ; et al. | 2010-05-13 |
| Multi-Step Process for Forming High-Aspect-Ratio Holes for MEMS Devices App 20100120260 - Lee; Jiou-Kang ; et al. | 2010-05-13 |
| Process for Eliminating Delamination between Amorphous Silicon Layers App 20090294766 - Lee; Jiou-Kang ; et al. | 2009-12-03 |
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