Wu; Szu-An

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wu; Szu-An.The latest application filed is for "metal shielding layer in backside illumination image sensor chips and methods for forming the same".

Company Profile

3.34.41

Wu; Szu-An - Tainan TW
Wu; Szu-An - Hsin-Chu TW
Wu; Szu-An - Tainan City TW
Wu; Szu-An - Hsinchu TW
Wu; Szu-An - Hsinchu City TW
Wu, Szu-An - Yunlin TW
Wu, Szu-An - US

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Metal shielding layer in backside illumination image sensor chips and methods for forming the same Grant 11,018,176 - Chang , et al. May 25, 2	2021-05-25
Metal Shielding Layer in Backside Illumination Image Sensor Chips and Methods for Forming the Same App 20190252427 - Chang; Shih-Chieh ; et al.	2019-08-15
Metal shielding layer in backside illumination image sensor chips and methods for forming the same Grant 10,276,621 - Chang , et al.	2019-04-30
Grids in backside illumination image sensor chips and methods for forming the same Grant 9,978,784 - JangJian , et al. May 22, 2	2018-05-22
Image sensor isolation region and method of forming the same Grant 9,786,707 - JangJian , et al. October 10, 2	2017-10-10
Metal Shielding Layer in Backside Illumination Image Sensor Chips and Methods for Forming the Same App 20170213861 - Chang; Shih-Chieh ; et al.	2017-07-27
Image sensor isolation region and method of forming the same Grant 9,673,244 - JangJian , et al. June 6, 2	2017-06-06
Metal shielding layer in backside illumination image sensor chips and methods for forming the same Grant 9,620,555 - Chang , et al. April 11, 2	2017-04-11
In-situ formation of silicon and tantalum containing barrier Grant 9,543,234 - JangJian , et al. January 10, 2	2017-01-10
Oxidation-free copper metallization process using in-situ baking Grant 9,502,290 - Wang , et al. November 22, 2	2016-11-22
Metal Shielding Layer in Backside Illumination Image Sensor Chips and Methods for Forming the Same App 20160118434 - Chang; Shih-Chieh ; et al.	2016-04-28
Grids in Backside Illumination Image Sensor Chips and Methods for Forming the Same App 20160111458 - JangJian; Shiu-Ko ; et al.	2016-04-21
Metal shielding layer in backside illumination image sensor chips and methods for forming the same Grant 9,224,773 - Chang , et al. December 29, 2	2015-12-29
Grids in backside illumination image sensor chips and methods for forming the same Grant 9,219,092 - JangJian , et al. December 22, 2	2015-12-22
In-Situ Formation of Silicon and Tantalum Containing Barrier App 20150115450 - JangJian; Shiu-Ko ; et al.	2015-04-30
In-situ formation of silicon and tantalum containing barrier Grant 8,946,083 - JangJian , et al. February 3, 2	2015-02-03
Image sensor and method of manufacturing Grant 8,847,286 - Jangjian , et al. September 30, 2	2014-09-30
Single photoresist approach for high challenge photo process Grant 8,778,602 - Pan , et al. July 15, 2	2014-07-15
Image Sensor Isolation Region and Method of Forming the Same App 20130280849 - JangJian; Shiu-Ko ; et al.	2013-10-24
Oxidation-Free Copper Metallization Process Using In-situ Baking App 20130273735 - Wang; Yu-Sheng ; et al.	2013-10-17
Image Sensor Isolation Region and Method of Forming the Same App 20130234202 - JangJian; Shiu-Ko ; et al.	2013-09-12
Grids in Backside Illumination Image Sensor Chips and Methods for Forming the Same App 20130207213 - JangJian; Shiu-Ko ; et al.	2013-08-15
Image Sensor And Method Of Manufacturing App 20130181258 - JangJian; Shiu-Ko ; et al.	2013-07-18
Oxidation-free copper metallization process using in-situ baking Grant 8,470,390 - Wang , et al. June 25, 2	2013-06-25
Backside Illuminated CMOS Image Sensor App 20130149807 - JangJian; Shiu-Ko ; et al.	2013-06-13
Metal Shielding Layer in Backside Illumination Image Sensor Chips and Methods for Forming the Same App 20130134541 - Chang; Shih-Chieh ; et al.	2013-05-30
Metal Gate Stack Having Tialn Blocking/wetting Layer App 20130075831 - JangJian; Shiu-Ko ; et al.	2013-03-28
In-Situ Formation of Silicon and Tantalum Containing Barrier App 20120326312 - JangJian; Shiu-Ko ; et al.	2012-12-27
Metal gate structure of a semiconductor device Grant 8,294,202 - Jangjian , et al. October 23, 2	2012-10-23
High aspect ratio gap fill application using high density plasma chemical vapor deposition Grant 8,021,992 - Liou , et al. September 20, 2	2011-09-20
Single Photoresist Approach For High Challenge Photo Process App 20110070546 - Pan; Hung-Ting ; et al.	2011-03-24
Metal Gate Structure Of A Semiconductor Device App 20110006354 - JANGJIAN; Shiu-Ko ; et al.	2011-01-13
Methods of spin-on wafer cleaning Grant 7,611,589 - Wu , et al. November 3, 2	2009-11-03
Oxidation-Free Copper Metallization Process Using In-situ Baking App 20090181164 - Wang; Yu-Sheng ; et al.	2009-07-16
Forming Seed Layer in Nano-Trench Structure Using Net Deposition and Net Etch App 20090127097 - Chen; Kei-Wei ; et al.	2009-05-21
Systems and methods for optical measurement Grant 7,349,086 - Liou , et al. March 25, 2	2008-03-25
Systems and methods for optical measurement App 20070153272 - Liou; Joung-Wei ; et al.	2007-07-05
High aspect ratio gap fill application using high density plasma chemical vapor deposition App 20070049034 - Liou; Joung-Wei ; et al.	2007-03-01
Cap layer on doped dielectric App 20070026653 - Leu; Po-Hsiung ; et al.	2007-02-01
Hillock reduction in copper films App 20060270227 - Lin; Shih-Chi ; et al.	2006-11-30
Film treatment method preventing blocked etch of low-K dielectrics App 20060205232 - Li; Lih-Ping ; et al.	2006-09-14
Methods of spin-on wafer cleaning App 20060196526 - Wu; Jun ; et al.	2006-09-07
Gas distribution systems for deposition processes App 20060196417 - Lin; Chia-Hui ; et al.	2006-09-07
Method for forming shallow trench isolation structures App 20060166458 - Cheng; Yi-Lung ; et al.	2006-07-27
Inter-metal dielectric scheme for semiconductors App 20060105558 - Chuang; Harry ; et al.	2006-05-18
Robust fluorine containing Silica Glass (FSG) Film with less free fluorine App 20060017166 - Leu; Po-Hsiung ; et al.	2006-01-26
Chamber leakage detection by measurement of reflectivity of oxidized thin film Grant 6,985,222 - Cheng , et al. January 10, 2	2006-01-10
Carbon and halogen doped silicate glass dielectric layer and method for fabricating the same Grant 6,979,656 - Jangjian , et al. December 27, 2	2005-12-27
Carbon and halogen doped silicate glass dielectric layer and method for fabricating the same App 20050121751 - Jangjian, Shiu-Ko ; et al.	2005-06-09
Novel method to increase fluorine stability to improve gap fill ability and reduce k value of fluorine silicate glass (FSG) film App 20050009367 - Cheng, Yi-Lung ; et al.	2005-01-13
Method to solve IMD-FSG particle and increase Cp yield by using a new tougher UFUN season film Grant 6,815,007 - Yoo , et al. November 9, 2	2004-11-09
Method to solve particle performance of FSG layer by using UFU season film for FSG process Grant 6,815,072 - Yoo , et al. November 9, 2	2004-11-09
Chamber leakage detection by measurement of reflectivity of oxidized thin film App 20040212798 - Cheng, Hsi-Kuei ; et al.	2004-10-28
Semiconductor chamber process apparatus and method Grant 6,802,935 - Cheng , et al. October 12, 2	2004-10-12
Shallow trench isolation process Grant 6,784,077 - Lin , et al. August 31, 2	2004-08-31
Bypass gas feed system and method to improve reactant gas flow and film deposition App 20040118342 - Cheng, Yi-Lung ; et al.	2004-06-24
Dielectric ARC scheme to improve photo window in dual damascene process Grant 6,664,177 - Lin , et al. December 16, 2	2003-12-16
Semiconductor chamber process apparatus and method App 20030178141 - Cheng, Yi-Lung ; et al.	2003-09-25
Method for removing residual fluorine in HDP-CVD chamber Grant 6,602,560 - Cheng , et al. August 5, 2	2003-08-05
Semiconductor Wafer Cleaning Method To Remove Residual Contamination Including Metal Nitride Particles App 20030084919 - Tai, Yali ; et al.	2003-05-08
Method for reducing contaminants in a CVD chamber App 20030068448 - Cheng, Yi-Lung ; et al.	2003-04-10
Methods to improve copper-fluorinated silica glass interconnects Grant 6,136,680 - Lai , et al. October 24, 2	2000-10-24

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.