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Stacked LC resonator and band pass filter using the same
Grant 9,276,548 - Horng , et al. March 1, 2 | 2016-03-01 |
Stacked Lc Resonator And Band Pass Filter Using The Same
App 20130300520 - HORNG; Tzyy-Sheng ; et al. | 2013-11-14 |
Microelectromechanical microphone packaging system
Grant 7,945,062 - Wang , et al. May 17, 2 | 2011-05-17 |
Stacked Lc Resonator And Bandpass Filter Of Using The Same
App 20100265009 - Horng; Tzyy-Sheng ; et al. | 2010-10-21 |
Semiconductor Substrate For Transmitting Differential Pair
App 20080093116 - Lee; Pao-Nan ; et al. | 2008-04-24 |
Semiconductor Device Having A Passive Device
App 20080093702 - Cheng; Hung-Hsiang ; et al. | 2008-04-24 |
Semiconductor package structure with microstrip antennan
Grant 7,352,056 - Wu April 1, 2 | 2008-04-01 |
Semiconductor Package
App 20070267758 - TAO; Su ; et al. | 2007-11-22 |
Microelectromechanical microphone packaging system
App 20070205499 - Wang; Wei-Chung ; et al. | 2007-09-06 |
Inductor and capacitor formed of build-up vias
Grant 7,248,134 - Wu , et al. July 24, 2 | 2007-07-24 |
Integrated capacitor on packaging substrate
Grant 7,199,445 - Wu April 3, 2 | 2007-04-03 |
Impedance standard substrate and method for calibrating vector network analyzer
Grant 7,084,639 - Wu , et al. August 1, 2 | 2006-08-01 |
Impedance standard substrate and correction method for vector network analyzer
Grant 7,072,780 - Wu , et al. July 4, 2 | 2006-07-04 |
High frequency substrate comprised of dielectric layers of different dielectric coefficients
Grant 7,061,347 - Chen , et al. June 13, 2 | 2006-06-13 |
Impedance standard substrate and method for calibrating vector network analyzer
Grant 7,053,627 - Wu , et al. May 30, 2 | 2006-05-30 |
Circuit board with reduced simultaneous switching noise
App 20060108690 - Wu; Sung-Mao ; et al. | 2006-05-25 |
Inductor and capacitor formed of build-up vias
App 20060103483 - Wu; Sung-Mao ; et al. | 2006-05-18 |
Integrated capacitor on packaging substrate
App 20060081960 - Wu; Sung-Mao | 2006-04-20 |
Semiconductor package structure with microstrip antennan
App 20060076658 - Wu; Sung-Mao | 2006-04-13 |
Semiconductor package
App 20050189641 - Tao, Su ; et al. | 2005-09-01 |
Semiconductor package
Grant 6,933,605 - Tao , et al. August 23, 2 | 2005-08-23 |
Impedance standard substrate and method for calibrating vector network analyzer
App 20050127923 - Wu, Sung Mao ; et al. | 2005-06-16 |
Semiconductor package structure and method for manufacturing the same
App 20050046046 - Chiu, Chi-Tsung ; et al. | 2005-03-03 |
High frequency substrate
App 20040155733 - Chen, Kun-Ching ; et al. | 2004-08-12 |
Impedance standard substrate and correction method for vector network analyzer
App 20040138844 - Wu, Sung-Mao ; et al. | 2004-07-15 |
Flip chip package
App 20040124541 - Wu, Sung Mao ; et al. | 2004-07-01 |
High frequency substrate
App 20040124955 - Wu, Sung-Mao ; et al. | 2004-07-01 |
[printed Circuit Board Design]
App 20040104044 - WU, SUNG-MAO | 2004-06-03 |
Semiconductor package
App 20040104462 - Tao, Su ; et al. | 2004-06-03 |
Semiconductor package structure and method for manufacturing the same
App 20040089929 - Chiu, Chi-Tsung ; et al. | 2004-05-13 |
Impedance standard substrate and method for calibrating vector network analyzer
App 20040070405 - Wu, Sung Mao ; et al. | 2004-04-15 |
Online IC package searching system
App 20040059739 - Lin, I-Linag ; et al. | 2004-03-25 |
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