Wu; Shyh-Ing
Patent Applications and Registrations
Patent applications and USPTO patent grants for Wu; Shyh-Ing.The latest application filed is for "method for forming passivation layer".
- Wu; Shyh-Ing - Kaohsiung County TW
- Wu; Shyh-Ing - Kaohsiung TW
- Wu; Shyh-Ing - Kaohsiung Hsien TW
| Patent | Date |
|---|---|
| Method for forming passivation layer Grant 7,727,878 - Su , et al. June 1, 2 | 2010-06-01 |
| Bumping process and structure thereof Grant 7,651,937 - Hsieh , et al. January 26, 2 | 2010-01-26 |
| Wafer structure with a multi-layer barrier in an UBM layer network device with power supply Grant 7,518,241 - Tai , et al. April 14, 2 | 2009-04-14 |
| Method for Forming Passivation Layer App 20070232052 - Su; Cheng-Hsueh ; et al. | 2007-10-04 |
| Chip structure and manufacturing method of the same App 20070108612 - Hsieh; Chueh-An ; et al. | 2007-05-17 |
| Wafer structure App 20070045848 - Tai; Li-Cheng ; et al. | 2007-03-01 |
| Bumping process and structure thereof App 20070049001 - Hsieh; Chueh-An ; et al. | 2007-03-01 |
| Wafer structure, chip structure and bumping process App 20060097392 - Wu; Shyh-Ing | 2006-05-11 |
| Method of attaching a heat sink to an IC package Grant 6,918,178 - Chao , et al. July 19, 2 | 2005-07-19 |
| [bump-forming Process] App 20040124171 - Wu, Shyh-Ing | 2004-07-01 |
| Solder paste for fabricating bump Grant 6,692,581 - Tong , et al. February 17, 2 | 2004-02-17 |
| Solder Paste For Fabricating Bump App 20030164204 - Tong, Ho-Ming ; et al. | 2003-09-04 |
| Method of attaching a heat sink to an IC package App 20030106212 - Chao, Shin-Hua ; et al. | 2003-06-12 |
| Semiconductor packaging device Grant 5,982,625 - Chen , et al. November 9, 1 | 1999-11-09 |
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