Wu; Ruisheng

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wu; Ruisheng.The latest application filed is for "page displaying method, apparatus based on h5 webpage, and computer readable storage medium".

Company Profile

3.8.11

Wu; Ruisheng - Beijing CN
Wu; Ruisheng - Shanghai CN
Wu; Ruisheng - Songjiang N/A CN

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method and apparatus for providing speech service Grant 11,360,737 - Zhou , et al. June 14, 2	2022-06-14
Page displaying method, apparatus based on H5 webpage, and computer readable storage medium Grant 10,839,140 - Su , et al. November 17, 2	2020-11-17
Page Displaying Method, Apparatus Based On H5 Webpage, And Computer Readable Storage Medium App 20190392025 - SU; Hong ; et al.	2019-12-26
Method And Apparatus For Providing Speech Service App 20190012138 - ZHOU; Jianliang ; et al.	2019-01-10
Substrateless Power Device Packages App 20150340301 - Feng; Tao ; et al.	2015-11-26
Substrateless power device packages Grant 9,136,154 - Feng , et al. September 15, 2	2015-09-15
Substrateless power device packages Grant 8,987,878 - Feng , et al. March 24, 2	2015-03-24
Substrateless Power Device Packages App 20150056752 - Feng; Tao ; et al.	2015-02-26
Wafer level packaging method of encapsulating the bottom and side of a semiconductor chip Grant 8,486,803 - Huang , et al. July 16, 2	2013-07-16
Wafer Level Packaging Method Of Encapsulating The Bottom And Side Of A Semiconductor Chip App 20130095612 - Huang; Ping ; et al.	2013-04-18
Method of Avoiding Resin Outflow from the Wafer Scribe line in WLCSP App 20120142165 - Huang; Ping ; et al.	2012-06-07
Substrateless Power Device Packages App 20120104580 - Feng; Tao ; et al.	2012-05-03
Semiconductor Package Process With Improved Die Attach Method For Ultrathin Chips App 20110294262 - Huang; Ping ; et al.	2011-12-01
Insulated Gate Bipolar Transistor (IGBT) Collector Formed with Ge/A1 and Production Method App 20100327314 - Huang; Ping ; et al.	2010-12-30
Wafer level chip scale package and method of laser marking the same Grant 7,842,543 - Wu , et al. November 30, 2	2010-11-30
Wafer level chip scale package and method of laser marking the same App 20100207283 - Wu; Ruisheng ; et al.	2010-08-19

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