Wu; Ping-Kun

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wu; Ping-Kun.The latest application filed is for "encapsulated damascene with improved overlayer adhesion".

Company Profile

0.9.6

Wu; Ping-Kun - Hsin-Chu TW
Wu; Ping-Kun - Chu-Pei TW
Wu; Ping-Kun - Chang-Hua TW
Wu; Ping-Kun - Hsinchu TW
Wu; Ping-Kun - Chang-Hua City TW
Wu; Ping-Kun - Hsin-Chu City TW
Wu, Ping Kun - Tao-Yuan City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Structure for a multiple-gate FET device and a method for its fabrication Grant RE45,180 - Chen , et al. October 7, 2	2014-10-07
Structure for a multiple-gate FET device and a method for its fabrication Grant RE45,165 - Chen , et al. September 30, 2	2014-09-30
Encapsulated damascene with improved overlayer adhesion Grant 7,737,556 - Wang , et al. June 15, 2	2010-06-15
Structure for a multiple-gate FET device and a method for its fabrication Grant 7,381,649 - Chen , et al. June 3, 2	2008-06-03
Method for forming a multi-layer seed layer for improved Cu ECP Grant 7,265,038 - Wu , et al. September 4, 2	2007-09-04
CMOS logic gate fabricated on hybrid crystal orientations and method of forming thereof Grant 7,208,815 - Chen , et al. April 24, 2	2007-04-24
Encapsulated damascene with improved overlayer adhesion App 20070075428 - Wang; Chao-Hsiung ; et al.	2007-04-05
Semiconductor structure and method for integrating SOI devices and bulk devices Grant 7,105,897 - Chen , et al. September 12, 2	2006-09-12
Semiconductor structure and method for integrating SOI devices and bulk devices App 20060097316 - Chen; Hao-Yu ; et al.	2006-05-11
CMOS logic gate fabricated on hybrid crystal orientations and method of forming thereof App 20060049460 - Chen; Hung-Wei ; et al.	2006-03-09
Diffusion barrier for damascene structures App 20050263891 - Lee, Bih-Huey ; et al.	2005-12-01
Method for forming a multi-layer seed layer for improved Cu ECP App 20050110147 - Wu, Ping-Kun ; et al.	2005-05-26
Helix antenna with a cap of high dielectric coefficient App 20030071755 - Lin, Jammy ; et al.	2003-04-17

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