Wu; Paul Y.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wu; Paul Y..The latest application filed is for "thin profile metal trace to suppress skin effect and extend package interconnect bandwidth".

Company Profile

0.14.12

Wu; Paul Y. - Saratoga CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Low insertion loss package pin structure and method Grant 10,038,259 - Wu , et al. July 31, 2	2018-07-31
Dynamic configuration of equivalent series resistance Grant 9,377,802 - Wyland , et al. June 28, 2	2016-06-28
Capacitors within an interposer coupled to supply and ground planes of a substrate Grant 9,337,138 - Abugharbieh , et al. May 10, 2	2016-05-10
Thin Profile Metal Trace To Suppress Skin Effect And Extend Package Interconnect Bandwidth App 20150282299 - Shi; Hong ; et al.	2015-10-01
Conductor structure with integrated via element Grant 9,144,150 - Wu September 22, 2	2015-09-22
Low Insertion Loss Package Pin Structure And Method App 20150222033 - Wu; Paul Y. ; et al.	2015-08-06
Semiconductor Device Having Bucket-shaped Under-bump Metallizaton And Method Of Forming Same App 20150187715 - Hart; Michael J. ; et al.	2015-07-02
Warpage management for fan-out mold packaged integrated circuit Grant 9,006,030 - Kwon , et al. April 14, 2	2015-04-14
Multi-layer Core Organic Package Substrate App 20140262440 - Kim; Namhoon ; et al.	2014-09-18
Interconnect pattern for semiconductor packaging Grant 8,743,559 - Wu , et al. June 3, 2	2014-06-03
Conductor Structure With Integrated Via Element App 20130277099 - Wu; Paul Y.	2013-10-24
Air through-silicon via structure Grant 8,519,542 - Kim , et al. August 27, 2	2013-08-27
Integrated Circuit Connectivity Using Flexible Circuitry App 20130181360 - Kim; Namhoon ; et al.	2013-07-18
Power distribution network Grant 8,410,579 - Ghia , et al. April 2, 2	2013-04-02
Power Distribution Network App 20120139083 - Ghia; Atul V. ; et al.	2012-06-07
Semiconductor device package and methods of manufacturing the same Grant 8,178,962 - Chee , et al. May 15, 2	2012-05-15
Air Through-silicon Via Structure App 20120032326 - Kim; Namhoon ; et al.	2012-02-09
Through-silicon Vias With Low Parasitic Capacitance App 20110291287 - Wu; Paul Y. ; et al.	2011-12-01
Semiconductor Device Having Bucket-shaped Under-bump Metallization And Method Of Forming Same App 20110210443 - Hart; Michael J. ; et al.	2011-09-01

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