WU; Ming-Hao
Patent Applications and Registrations
Patent applications and USPTO patent grants for WU; Ming-Hao.The latest application filed is for "package structure having solder mask layer with low dielectric constant and method of fabricating the same".
- WU; Ming-Hao - Taoyuan TW
- Wu; Ming-Hao - Taoyuan City TW
- Wu; ming hao - Xiamen CN
- Wu; Ming-Hao - Taoyuan County TW
| Patent | Date |
|---|---|
| Package Structure Having Solder Mask Layer With Low Dielectric Constant And Method Of Fabricating The Same App 20220240367 - WU; Ming-Hao ; et al. | 2022-07-28 |
| Package Carrier And Manufacturing Method Thereof App 20220159824 - Wu; Ming-Hao ; et al. | 2022-05-19 |
| Circuit Board And Manufacturing Method Thereof App 20220087033 - WU; Ming-Hao ; et al. | 2022-03-17 |
| Package Structure And Manufacturing Method Thereof App 20210074606 - Wang; Pei-Wei ; et al. | 2021-03-11 |
| Circuit board structure Grant 10,939,538 - Wu , et al. March 2, 2 | 2021-03-02 |
| Led Lighting Device App 20200313319 - Cao; liang liang ; et al. | 2020-10-01 |
| Multilayer circuit board structure and manufacturing method thereof Grant 10,736,215 - Lee , et al. | 2020-08-04 |
| Circuit board and method for manufacturing the same Grant 10,616,992 - Chen , et al. | 2020-04-07 |
| Manufacturing method of circuit board structure Grant 10,356,901 - Wu , et al. July 16, 2 | 2019-07-16 |
| Manufacturing method of circuit structure Grant 10,314,179 - Chang , et al. | 2019-06-04 |
| Manufacturing Method Of Circuit Structure App 20180302992 - Chang; Hung-Lin ; et al. | 2018-10-18 |
| Manufacturing Method Of Circuit Board Structure App 20180295723 - Wu; Ming-Hao ; et al. | 2018-10-11 |
| Circuit board structure Grant 10,080,284 - Wu , et al. September 18, 2 | 2018-09-18 |
| Circuit structure and manufacturing method thereof Grant 10,051,748 - Chang , et al. August 14, 2 | 2018-08-14 |
| Circuit board structure and manufacturing method thereof Grant 10,039,184 - Wu , et al. July 31, 2 | 2018-07-31 |
| Circuit Board Structure And Manufacturing Method Thereof App 20180153036 - Wu; Ming-Hao ; et al. | 2018-05-31 |
| Circuit Board And Method For Manufacturing The Same App 20180116056 - CHEN; Yin-Ju ; et al. | 2018-04-26 |
| Circuit Board Structure App 20180077799 - Wu; Ming-Hao ; et al. | 2018-03-15 |
| Circuit board and method for manufacturing the same Grant 9,883,598 - Chen , et al. January 30, 2 | 2018-01-30 |
| Circuit board structure and manufacturing method thereof Grant 9,860,984 - Wu , et al. January 2, 2 | 2018-01-02 |
| Circuit board structure Grant 9,832,873 - Chiang , et al. November 28, 2 | 2017-11-28 |
| Circuit Board Structure App 20170171975 - Chiang; Shu-Sheng ; et al. | 2017-06-15 |
| Circuit Board Structure And Manufacturing Method Thereof App 20170171973 - Wu; Ming-Hao ; et al. | 2017-06-15 |
| Circuit Structure And Manufacturing Method Thereof App 20170164468 - CHANG; HUNG-LIN ; et al. | 2017-06-08 |
| Manufacturing process for substrate structure having component-disposing area Grant 9,646,852 - Chang , et al. May 9, 2 | 2017-05-09 |
| Circuit board structure and manufacturing method thereof Grant 9,609,746 - Chiang , et al. March 28, 2 | 2017-03-28 |
| Circuit Board And Method For Manufacturing The Same App 20170034925 - CHEN; Yin-Ju ; et al. | 2017-02-02 |
| Circuit Board And Method For Manufacturing The Same App 20160363974 - CHEN; Yin-Ju ; et al. | 2016-12-15 |
| Circuit board and method for manufacturing the same Grant 9,491,865 - Chen , et al. November 8, 2 | 2016-11-08 |
| Circuit Board And Method For Manufacturing The Same App 20160316565 - CHEN; Yin-Ju ; et al. | 2016-10-27 |
| Manufacturing Process For Substrate Structure Having Component-disposing Area App 20160093514 - Chang; Cheng-Jui ; et al. | 2016-03-31 |
| Substrate structure having component-disposing area and manufacturing process thereof Grant 9,258,908 - Chang , et al. February 9, 2 | 2016-02-09 |
| Wiring Board Structure App 20150053462 - Wu; Ming-Hao ; et al. | 2015-02-26 |
| Substrate Structure Having Component-disposing Area And Manufacturing Process Thereof App 20140138130 - Chang; Cheng-Jui ; et al. | 2014-05-22 |
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