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CMOS image sensor big via bonding pad application for AICu process
Grant 8,680,635 - Tseng , et al. March 25, 2 | 2014-03-25 |
CMOS image sensor big via bonding pad application for AlCu Process
Grant 8,502,335 - Tseng , et al. August 6, 2 | 2013-08-06 |
CMOS Image Sensor Big Via Bonding Pad Application for AICu Process
App 20130134543 - Tseng; Uway ; et al. | 2013-05-30 |
CMOS image sensor big via bonding pad application for AICu process
Grant 8,344,471 - Tseng , et al. January 1, 2 | 2013-01-01 |
CMOS IMAGE SENSOR BIG VIA BONDING PAD APPLICATION FOR AlCu PROCESS
App 20110024867 - Tseng; Uway ; et al. | 2011-02-03 |
CMOS IMAGE SENSOR BIG VIA BONDING PAD APPLICATION FOR AICu PROCESS
App 20110024866 - Tseng; Uway ; et al. | 2011-02-03 |
Sidewall spacer for semiconductor device and fabrication method thereof
Grant 7,220,650 - Kao , et al. May 22, 2 | 2007-05-22 |
Microelectronic fabrication having edge passivated bond pad integrated with option selection device access aperture
Grant 7,067,896 - Wu , et al. June 27, 2 | 2006-06-27 |
Method for manufacturing isolation structures in a semiconductor device
App 20050277262 - Tsao, Chang-Sheng ; et al. | 2005-12-15 |
Sidewall spacer for semiconductor device and fabrication method thereof
App 20050227446 - Kao, Rong-Hui ; et al. | 2005-10-13 |
Method for implementing poly pre-doping in deep sub-micron process
App 20050118802 - Tsao, Chang-Sheng ; et al. | 2005-06-02 |
Microelectronic fabrication having edge passivated bond pad integrated with option selection device access aperture
App 20040089916 - Wu, Juei-Kuo ; et al. | 2004-05-13 |
Tunable threshold voltage of a thick field oxide ESD protection device with a N-field implant
Grant 6,717,220 - Cheng , et al. April 6, 2 | 2004-04-06 |
Optical sensor by using tunneling diode
Grant 6,693,317 - Yiu , et al. February 17, 2 | 2004-02-17 |
Passivation and planarization process for flip chip packages
Grant 6,667,230 - Chen , et al. December 23, 2 | 2003-12-23 |
Novel optical sensor by using tunneling diode
App 20030203525 - Yiu, Ho-Yin ; et al. | 2003-10-30 |
Method of fabricating borderless contact using graded-stair etch stop layers
Grant 6,635,576 - Liu , et al. October 21, 2 | 2003-10-21 |
Dynamic substrate-coupled electrostatic discharging protection circuit
Grant 6,611,028 - Cheng , et al. August 26, 2 | 2003-08-26 |
Dynamic substrate-coupled electrostatic discharging protection circuit
App 20030047787 - Cheng, Tao ; et al. | 2003-03-13 |
Use of a capping layer to reduce particle evolution during sputter pre-clean procedures
Grant 6,531,382 - Cheng , et al. March 11, 2 | 2003-03-11 |
Tunable threshold voltage of a thick field oxide ESD protection device with a N-field implant
App 20030017673 - Cheng, Tao ; et al. | 2003-01-23 |
Passivation and planarization process for flip chip packages
App 20030013291 - Chen, Dian-Hau ; et al. | 2003-01-16 |
Dynamic substrate-coupled electrostatic discharging protection circuit
Grant 6,479,872 - Cheng , et al. November 12, 2 | 2002-11-12 |
Novel optical sensor by using tunneling diode
App 20010039067 - Yiu, Ho-Yin ; et al. | 2001-11-08 |
Using p-type halo implant as ROM cell isolation in flat-cell mask ROM process
Grant 6,077,746 - You , et al. June 20, 2 | 2000-06-20 |
Stress buffered bond pad and method of making
Grant 5,942,800 - Yiu , et al. August 24, 1 | 1999-08-24 |
Method of protecting an alignment mark in a semiconductor manufacturing process with CMP
Grant 5,801,090 - Wu , et al. September 1, 1 | 1998-09-01 |
Technique for the removal of residual spin-on-glass (SOG) after full SOG etchback
Grant 5,747,381 - Wu , et al. May 5, 1 | 1998-05-05 |
Method for selectively depositing silicon oxide spacer layers
Grant 5,518,959 - Jang , et al. May 21, 1 | 1996-05-21 |
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