loadpatents
Patent applications and USPTO patent grants for Wu; Kun-Lin.The latest application filed is for "printing device and ejection control module".
Patent | Date |
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Connector having a pair of springs at two opposite sides of a convex slide groove for urging an unlocking slider Grant 11,211,747 - Wang , et al. December 28, 2 | 2021-12-28 |
Printing device and ejection control module Grant 11,174,120 - Chang , et al. November 16, 2 | 2021-11-16 |
Printing Device And Ejection Control Module App 20210292125 - CHANG; YU-LUN ;   et al. | 2021-09-23 |
Apparatuses and methods for dual active of multiple subscriber identities Grant 10,911,995 - Tsai , et al. February 2, 2 | 2021-02-02 |
Connector App 20210006013 - WANG; CHIEN-CHIUNG ;   et al. | 2021-01-07 |
Screw driving device for use with an impact driver Grant 10,821,579 - Rajotte , et al. November 3, 2 | 2020-11-03 |
Apparatuses And Methods For Dual Active Of Multiple Subscriber Identities App 20200296638 - TSAI; Chih-Yuan ;   et al. | 2020-09-17 |
Plug connector assembly having an insulative member Grant 10,741,941 - Wu , et al. A | 2020-08-11 |
Plug Connector Assembly Having An Insulative Member App 20190140374 - WU; KUN-LIN ;   et al. | 2019-05-09 |
Grounding plate having an arcuate wall with a soldering notch Grant 9,774,113 - Zhang , et al. September 26, 2 | 2017-09-26 |
Hydroponic Device App 20170258021 - Chiu; Chia-Hsiang ;   et al. | 2017-09-14 |
Method For Enhancing Performance Of A Communications Apparatus In A Plmn Search Procedure And A Communications Apparatus Utilizing The Same App 20170142645 - WU; Kun-Lin ;   et al. | 2017-05-18 |
Grounding Plate Having An Arcuate Wall With A Soldering Notch App 20170040746 - ZHANG; XUE-LIANG ;   et al. | 2017-02-09 |
Femtocell And Resource Control Method Thereof App 20130107866 - Leu; Chun-Teh ;   et al. | 2013-05-02 |
Chemical mechanical polishing method Grant 8,389,410 - Wu , et al. March 5, 2 | 2013-03-05 |
Display Method, Application Program And Computer Readable Medium For Computer Key Function App 20110291942 - CHEN; Yu ;   et al. | 2011-12-01 |
Chemical Mechanical Polishing Method App 20110189854 - Wu; Kun-Lin ;   et al. | 2011-08-04 |
Chemical-mechanical polishing method Grant 7,947,603 - Wu , et al. May 24, 2 | 2011-05-24 |
Chemical-mechanical Polishing Method App 20080102635 - Wu; Kun-Lin ;   et al. | 2008-05-01 |
Chemical-mechanical polishing method Grant 7,335,598 - Wu , et al. February 26, 2 | 2008-02-26 |
Chemical-mechanical polishing method App 20050186799 - Wu, Kun-Lin ;   et al. | 2005-08-25 |
Chemical-mechanical polishing method Grant 6,913,993 - Wu , et al. July 5, 2 | 2005-07-05 |
Chemical-mechanical polishing method App 20020052117 - Wu, Kun-Lin ;   et al. | 2002-05-02 |
Method for forming via holes by using retardation layers to reduce overetching App 20020009877 - Wang, Shyan-Yhu ;   et al. | 2002-01-24 |
Method for preventing aluminum intrusions Grant 6,333,261 - Lin , et al. December 25, 2 | 2001-12-25 |
Chemical-mechanical polish machines and fabrication process using the same Grant 6,293,850 - Lin , et al. September 25, 2 | 2001-09-25 |
Method for forming capacitor Grant 6,197,650 - Wu March 6, 2 | 2001-03-06 |
Method of fabricating shallow trench isolation structure Grant 6,190,995 - Wu , et al. February 20, 2 | 2001-02-20 |
Chemical-mechanical polish machines and fabrication process using the same Grant 6,183,350 - Lin , et al. February 6, 2 | 2001-02-06 |
Method of fabricating shallow trench isolation Grant 6,180,467 - Wu , et al. January 30, 2 | 2001-01-30 |
Method for reducing silicide resistance Grant 6,140,232 - Lin , et al. October 31, 2 | 2000-10-31 |
Chemical-mechanical polishing pad Grant 6,120,366 - Lin , et al. September 19, 2 | 2000-09-19 |
Cleaning system with automatically controlled brush pressure Grant 6,119,294 - Lai , et al. September 19, 2 | 2000-09-19 |
Method for preventing poisoned vias and trenches Grant 6,071,806 - Wu , et al. June 6, 2 | 2000-06-06 |
Method for preventing poisoned vias and trenches Grant 6,013,581 - Wu , et al. January 11, 2 | 2000-01-11 |
Method of cleaning slurry remnants after the completion of a chemical-mechanical polish process Grant 5,876,508 - Wu , et al. March 2, 1 | 1999-03-02 |
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