Wu; Jyun-Liang
Patent Applications and Registrations
Patent applications and USPTO patent grants for Wu; Jyun-Liang.The latest application filed is for "chip package and manufacturing method thereof".
- Wu; Jyun-Liang - Taichung TW
- WU; Jyun-Liang - Taichung City TW
| Patent | Date |
|---|---|
| Chip package and manufacturing method thereof Grant 9,947,716 - Ho , et al. April 17, 2 | 2018-04-17 |
| Chip package and manufacturing method thereof Grant 9,875,912 - Ho , et al. January 23, 2 | 2018-01-23 |
| Chip Package And Manufacturing Method Thereof App 20170148694 - HO; Yen-Shih ; et al. | 2017-05-25 |
| Chip Package And Manufacturing Method Thereof App 20170148844 - HO; Yen-Shih ; et al. | 2017-05-25 |
| Chip Package And Manufacturing Method Thereof App 20170110495 - WU; Jyun-Liang ; et al. | 2017-04-20 |
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