Wu; Jiung
Patent Applications and Registrations
Patent applications and USPTO patent grants for Wu; Jiung.The latest application filed is for "profile of through via protrusion in 3dic interconnect".
- Wu; Jiung - Kueishan Shiang TW
| Patent | Date |
|---|---|
| Profile of through via protrusion in 3DIC interconnect Grant 11,004,741 - Wu , et al. May 11, 2 | 2021-05-11 |
| Profile of Through Via Protrusion in 3DIC Interconnect App 20200144119 - Wu; Jiung ; et al. | 2020-05-07 |
| Profile of through via protrusion in 3DIC interconnect Grant 10,566,237 - Wu , et al. Feb | 2020-02-18 |
| Profile of Through Via Protrusion in 3DIC Interconnect App 20190122927 - Wu; Jiung ; et al. | 2019-04-25 |
| Profile of through via protrusion in 3DIC interconnect Grant 10,163,705 - Wu , et al. Dec | 2018-12-25 |
| Self-alignment for redistribution layer Grant 10,074,595 - Yang , et al. September 11, 2 | 2018-09-11 |
| Self-Alignment for Redistribution Layer App 20180012825 - Yang; Ku-Feng ; et al. | 2018-01-11 |
| Self-alignment for redistribution layer Grant 9,786,580 - Yang , et al. October 10, 2 | 2017-10-10 |
| Profile of Through Via Protrusion in 3DIC Interconnect App 20150311141 - Wu; Jiung ; et al. | 2015-10-29 |
| Self-alignment For Redistribution Layer App 20150137382 - Yang; Ku-Feng ; et al. | 2015-05-21 |
| Reducing substrate warpage in semiconductor processing Grant 8,691,706 - Yu , et al. April 8, 2 | 2014-04-08 |
| Reducing Substrate Warpage in Semiconductor Processing App 20130183831 - Yu; Chen-Hua ; et al. | 2013-07-18 |
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