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Interconnect structure having conductor extending along dielectric block
Grant 11,457,525 - Wu , et al. September 27, 2 | 2022-09-27 |
Die Corner Removal For Underfill Crack Suppression In Semiconductor Die Packaging
App 20220302064 - CHEN; Wei-Yu ; et al. | 2022-09-22 |
Semiconductor Package and Method
App 20220302067 - Wu; Jiun Yi ; et al. | 2022-09-22 |
Semiconductor Package And Method Of Manufacture
App 20220302009 - Wu; Jiun Yi ; et al. | 2022-09-22 |
Semiconductor Package And Method Of Forming Same
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Semiconductor Device Package And Methods Of Manufacture
App 20220278087 - Wu; Jiun Yi ; et al. | 2022-09-01 |
Semiconductor Package and Method of Forming Thereof
App 20220278066 - Wu; Jiun Yi ; et al. | 2022-09-01 |
Semiconductor Package
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Semiconductor Packages And Forming Methods Thereof
App 20220262734 - Wu; Kai-Chiang ; et al. | 2022-08-18 |
Semiconductor device and method of forming the same
Grant 11,410,968 - Wu , et al. August 9, 2 | 2022-08-09 |
Semiconductor Structure And Manufacturing Method Thereof
App 20220246513 - Ho; Kuan-Lin ; et al. | 2022-08-04 |
Package structure and fabricating method thereof
Grant 11,398,422 - Lu , et al. July 26, 2 | 2022-07-26 |
Semiconductor package including cavity-mounted device
Grant 11,380,620 - Wu , et al. July 5, 2 | 2022-07-05 |
Semiconductor Packages
App 20220208633 - Wu; Jiun-Yi ; et al. | 2022-06-30 |
Semiconductor Package And Method
App 20220199461 - Yu; Chen-Hua ; et al. | 2022-06-23 |
Semiconductor package and method
Grant 11,355,463 - Wu , et al. June 7, 2 | 2022-06-07 |
Semiconductor package
Grant 11,355,428 - Wu , et al. June 7, 2 | 2022-06-07 |
Warpage Control of Packages Using Embedded Core Frame
App 20220173003 - Wu; Jiun Yi ; et al. | 2022-06-02 |
Semiconductor packages and forming methods thereof
Grant 11,348,874 - Wu , et al. May 31, 2 | 2022-05-31 |
Integrated Circuit Package and Method
App 20220157760 - Chen; Chien-Hsun ; et al. | 2022-05-19 |
Semiconductor Device Including Transmission Lines And Method Of Forming The Same
App 20220158319 - WU; Jiun Yi ; et al. | 2022-05-19 |
Semiconductor structure and manufacturing method thereof
Grant 11,315,862 - Ho , et al. April 26, 2 | 2022-04-26 |
Integrated Circuit Package and Method
App 20220122927 - Liu; Chung-Shi ; et al. | 2022-04-21 |
Integrated Circuit Package and Method
App 20220122897 - Chen; Chien-Hsun ; et al. | 2022-04-21 |
Photonic Package And Method Of Manufacture
App 20220099887 - Yu; Chen-Hua ; et al. | 2022-03-31 |
Hybrid Dielectric Scheme in Packages
App 20220093498 - Chen; Chien-Hsun ; et al. | 2022-03-24 |
Semiconductor packages and methods of manufacturing the same
Grant 11,282,761 - Wu , et al. March 22, 2 | 2022-03-22 |
Package structure and fabricating method thereof
Grant 11,282,779 - Wu , et al. March 22, 2 | 2022-03-22 |
Contoured package-on-package joint
Grant 11,270,990 - Wu March 8, 2 | 2022-03-08 |
Semiconductor Device Package And Method Of Manufacture
App 20220068862 - Wu; Jiun Yi ; et al. | 2022-03-03 |
Semiconductor device having a high-k dielectric material disposed beyween first and second transmission lines and a dielectric directly contacting the high-k dielectric material
Grant 11,258,151 - Wu , et al. February 22, 2 | 2022-02-22 |
Warpage control of packages using embedded core frame
Grant 11,251,099 - Wu , et al. February 15, 2 | 2022-02-15 |
Integrated circuit package and method
Grant 11,239,193 - Chen , et al. February 1, 2 | 2022-02-01 |
Package Structure And Fabricating Method Thereof
App 20220028773 - Lu; Chun-Lin ; et al. | 2022-01-27 |
Semiconductor Packages And Methods Of Forming The Same
App 20220020655 - Cheng; Jung-Wei ; et al. | 2022-01-20 |
Semiconductor Packages And Forming Methods Thereof
App 20220013463 - Wu; Kai-Chiang ; et al. | 2022-01-13 |
Integrated circuit package and method
Grant 11,217,538 - Liu , et al. January 4, 2 | 2022-01-04 |
Embedded voltage regulator structure and method forming same
Grant 11,217,546 - Wu , et al. January 4, 2 | 2022-01-04 |
Integrated circuit package and method
Grant 11,217,497 - Chen , et al. January 4, 2 | 2022-01-04 |
Semiconductor Packages And Methods Of Forming Same
App 20210384120 - Liu; Chung-Shi ; et al. | 2021-12-09 |
Hybrid dielectric scheme in packages
Grant 11,195,788 - Chen , et al. December 7, 2 | 2021-12-07 |
Semiconductor Package Structure Comprising Rigid-flexible Substrate And Manufacturing Method Thereof
App 20210375770 - Wang; Chuei-Tang ; et al. | 2021-12-02 |
Semiconductor Device And Method Of Manufacture
App 20210375785 - Wu; Jiun Yi ; et al. | 2021-12-02 |
Package Structure, Rdl Structure Comprising Redistribution Layer Having Ground Plates And Signal Lines
App 20210366815 - Chen; Chien-Hsun ; et al. | 2021-11-25 |
Semiconductor Device And Method Of Manufacture
App 20210366877 - Wu; Jiun Yi ; et al. | 2021-11-25 |
Semiconductor Package and Method
App 20210366863 - Wu; Jiun Yi ; et al. | 2021-11-25 |
Package including metallic bolstering pattern and manufacturing method of the package
Grant 11,177,218 - Wu , et al. November 16, 2 | 2021-11-16 |
Wafer Level Package Structure and Method of Forming Same
App 20210351076 - Yu; Chen-Hua ; et al. | 2021-11-11 |
Semiconductor device and method of manufacture
Grant 11,171,090 - Wu , et al. November 9, 2 | 2021-11-09 |
Semiconductor Package and Method
App 20210335726 - Wu; Jiun Yi ; et al. | 2021-10-28 |
Semiconductor Device and Method of Manufacture
App 20210327797 - Wu; Jiun Yi ; et al. | 2021-10-21 |
Integrated circuit package and methods of forming same
Grant 11,152,344 - Yu , et al. October 19, 2 | 2021-10-19 |
Semiconductor device and method of manufacture
Grant 11,145,614 - Wu , et al. October 12, 2 | 2021-10-12 |
Integrated fan-out device
Grant 11,133,283 - Wu , et al. September 28, 2 | 2021-09-28 |
Package Including Metallic Bolstering Pattern And Manufacturing Method Of The Package
App 20210296243 - Wu; Jiun-Yi ; et al. | 2021-09-23 |
Symmetrical Substrate For Semiconductor Packaging
App 20210272889 - Wu; Jiun Yi ; et al. | 2021-09-02 |
Electronic Assembly Having Circuit Carrier And Manufacturing Method Thereof
App 20210267068 - Wu; Jiun-Yi ; et al. | 2021-08-26 |
Redistribution structures in semiconductor packages and methods of forming same
Grant 11,101,209 - Liu , et al. August 24, 2 | 2021-08-24 |
Semiconductor package structure comprising rigid-flexible substrate and manufacturing method thereof
Grant 11,094,634 - Wang , et al. August 17, 2 | 2021-08-17 |
Package structure, RDL structure comprising redistribution layer having ground plates and signal lines and method of forming the same
Grant 11,088,059 - Chen , et al. August 10, 2 | 2021-08-10 |
Semiconductor Structure And Manufacturing Method Thereof
App 20210242119 - Ho; Kuan-Lin ; et al. | 2021-08-05 |
Semiconductor Device And Method Of Manufacture
App 20210225780 - Wu; Jiun Yi ; et al. | 2021-07-22 |
Semiconductor Device and Method of Manufacture
App 20210225764 - Wu; Jiun Yi ; et al. | 2021-07-22 |
Integrated Circuit Package and Method
App 20210225792 - Chen; Chien-Hsun ; et al. | 2021-07-22 |
Semiconductor Device And Methods Of Manufacture
App 20210225664 - Wu; Jiun Yi ; et al. | 2021-07-22 |
Wafer level package structure and method of forming same
Grant 11,069,573 - Yu , et al. July 20, 2 | 2021-07-20 |
Semiconductor Devices And Methods Of Manufacturing
App 20210202266 - Chen; Chien-Hsun ; et al. | 2021-07-01 |
Semiconductor Device and Method of Manufacturing
App 20210202396 - Wu; Jiun Yi ; et al. | 2021-07-01 |
Semiconductor device and method of manufacture
Grant 11,049,802 - Wu , et al. June 29, 2 | 2021-06-29 |
Method for Manufacturing Semiconductor Package with Connection Structures Including Via Groups
App 20210167032 - Chen; Chien-Hsun ; et al. | 2021-06-03 |
Electronics Card Including Multi-Chip Module
App 20210167051 - Yu; Chen-Hua ; et al. | 2021-06-03 |
Circuit carrier and manifacturing method thereof
Grant 11,006,532 - Wu , et al. May 11, 2 | 2021-05-11 |
Hybrid Integrated Circuit Package and Method
App 20210134776 - Yu; Chen-Hua ; et al. | 2021-05-06 |
Circuit Board And Semiconductor Device Including The Same
App 20210127500 - Wu; Jiun-Yi ; et al. | 2021-04-29 |
Semiconductor Packages and Method of Manufacture
App 20210125933 - Chen; Wei-Yu ; et al. | 2021-04-29 |
Semiconductor Device And Method Of Manufacture
App 20210118835 - Wu; Jiun Yi ; et al. | 2021-04-22 |
Semiconductor Device And Method Of Forming The Same
App 20210118844 - Wu; Jiun Yi ; et al. | 2021-04-22 |
Hybrid Dielectric Scheme in Packages
App 20210118787 - Chen; Chien-Hsun ; et al. | 2021-04-22 |
Semiconductor device and method of manufacture
Grant 10,971,446 - Wu , et al. April 6, 2 | 2021-04-06 |
Package Structure And Fabricating Method Thereof
App 20210098354 - Wu; Kai-Chiang ; et al. | 2021-04-01 |
Semiconductor Package and Method of Manufacture
App 20210098353 - Wu; Jiun Yi ; et al. | 2021-04-01 |
Semiconductor Device and Method of Manufacture
App 20210082827 - Wu; Jiun Yi ; et al. | 2021-03-18 |
Semiconductor Devices And Methods Of Manufacturing
App 20210082871 - Wu; Jiun Yi ; et al. | 2021-03-18 |
Interposer Frame And Method Of Manufacturing The Same
App 20210074692 - Wu; Jiun Yi | 2021-03-11 |
Semiconductor structure
Grant 10,937,721 - Wu , et al. March 2, 2 | 2021-03-02 |
Hybrid integrated circuit package and method
Grant 10,937,736 - Yu , et al. March 2, 2 | 2021-03-02 |
Electronics card including multi-chip module
Grant 10,916,529 - Yu , et al. February 9, 2 | 2021-02-09 |
Method for manufacturing semiconductor package with connection structures including via groups
Grant 10,916,519 - Chen , et al. February 9, 2 | 2021-02-09 |
Warpage Control of Packages Using Embedded Core Frame
App 20210035877 - Wu; Jiun Yi ; et al. | 2021-02-04 |
Semiconductor Device and Method of Manufacture
App 20210020556 - Wu; Jiun Yi ; et al. | 2021-01-21 |
Interconnect Structure
App 20210007215 - WU; Jiun-Yi ; et al. | 2021-01-07 |
Manufacturing method of circuit board and of semiconductor device including the same
Grant 10,888,000 - Wu , et al. January 5, 2 | 2021-01-05 |
Hybrid Integrated Circuit Package and Method
App 20200395347 - Yu; Chen-Hua ; et al. | 2020-12-17 |
Semiconductor Package and Methods of Forming the Same
App 20200395308 - Wu; Jiun Yi ; et al. | 2020-12-17 |
Package Structure, Rdl Structure And Method Of Formign The Same
App 20200395280 - Chen; Chien-Hsun ; et al. | 2020-12-17 |
Hybrid Integrated Circuit Package and Method
App 20200395302 - Yu; Chen-Hua ; et al. | 2020-12-17 |
Semiconductor device, circuit board structure and method of fabricating the same
Grant 10,869,385 - Wu , et al. December 15, 2 | 2020-12-15 |
Semiconductor packages and methods of manufacturing the same
Grant 10,867,947 - Wu , et al. December 15, 2 | 2020-12-15 |
Hybrid integrated circuit package and method
Grant 10,867,982 - Yu , et al. December 15, 2 | 2020-12-15 |
Interposer frame and method of manufacturing the same
Grant 10,861,836 - Wu December 8, 2 | 2020-12-08 |
Semiconductor device and method of manufacture
Grant 10,854,552 - Wu , et al. December 1, 2 | 2020-12-01 |
Interposer frame and method of manufacturing the same
Grant 10,840,224 - Wu November 17, 2 | 2020-11-17 |
Protrusion bump pads for bond-on-trace processing
Grant 10,804,192 - Liang , et al. October 13, 2 | 2020-10-13 |
Contoured Package-on-Package Joint
App 20200303365 - Wu; Jiun Yi | 2020-09-24 |
Interconnect structure and method of manufacturing the same
Grant 10,785,865 - Wu , et al. Sept | 2020-09-22 |
Integrated Circuit Package and Method
App 20200286803 - Chen; Chien-Hsun ; et al. | 2020-09-10 |
Circuit board, semiconductor device including the same, and manufacturing method thereof
Grant 10,772,205 - Wu , et al. Sep | 2020-09-08 |
Circuit Board, Semiconductor Device Including The Same, And Manufacturing Method Thereof
App 20200275552 - Wu; Jiun-Yi ; et al. | 2020-08-27 |
Circuit Board, Semiconductor Device Including The Same, And Manufacturing Method Thereof
App 20200275557 - Wu; Jiun-Yi ; et al. | 2020-08-27 |
Circuit Carrier And Manifacturing Method Thereof
App 20200260595 - A1 | 2020-08-13 |
Protrusion bump pads for bond-on-trace processing
Grant 10,700,034 - Liang , et al. | 2020-06-30 |
Semiconductor Package Structure And Manufacturing Method Thereof
App 20200203280 - Wang; Chuei-Tang ; et al. | 2020-06-25 |
Embedded Voltage Regulator Structure and Method Forming Same
App 20200194393 - Wu; Jiun Yi ; et al. | 2020-06-18 |
Semiconductor Device and Method of Manufacture
App 20200176378 - Wu; Jiun Yi ; et al. | 2020-06-04 |
Semiconductor Packages And Methods Of Manufacturing The Same
App 20200176346 - Wu; Jiun-Yi ; et al. | 2020-06-04 |
Integrated Circuit Package and Method
App 20200176397 - Liu; Chung-Shi ; et al. | 2020-06-04 |
Semiconductor Packages And Methods Of Manufacturing The Same
App 20200176405 - Wu; Jiun-Yi ; et al. | 2020-06-04 |
Contoured package-on-package joint
Grant 10,672,751 - Wu | 2020-06-02 |
Integrated circuit package and method
Grant 10,665,520 - Chen , et al. | 2020-05-26 |
Semiconductor Device Including Transmission Lines And Method Of Forming The Same
App 20200153073 - WU; Jiun Yi ; et al. | 2020-05-14 |
Integrated Circuit Package and Method
App 20200135600 - Chen; Chien-Hsun ; et al. | 2020-04-30 |
Semiconductor Device, Circuit Board Structure And Method Of Fabricating The Same
App 20200137871 - Wu; Jiun-Yi ; et al. | 2020-04-30 |
Protrusion Bump Pads for Bond-on-Trace Processing
App 20200135678 - Liang; Yu-Min ; et al. | 2020-04-30 |
Circuit Carrier And Manifacturing Method Thereof
App 20200137895 - Wu; Jiun-Yi ; et al. | 2020-04-30 |
Circuit carrier and manifacturing method thereof
Grant 10,638,616 - Wu , et al. | 2020-04-28 |
Package-on-package with cavity in interposer
Grant 10,629,579 - Wu | 2020-04-21 |
Semiconductor Device And Method Of Manufacture
App 20200075488 - Wu; Jiun Yi ; et al. | 2020-03-05 |
Circuit board, semiconductor device including the same, and manufacturing method thereof
Grant 10,555,424 - Wu , et al. Fe | 2020-02-04 |
Interposer Frame And Method Of Manufacturing The Same
App 20200020674 - Wu; Jiun Yi | 2020-01-16 |
Semiconductor device having first and second transmission lines with a high-K dielectric material disposed between the first and second transmission lines
Grant 10,530,030 - Wu , et al. J | 2020-01-07 |
Semiconductor Structure
App 20200006208 - WU; JIUN-YI ; et al. | 2020-01-02 |
Semiconductor Device and Method of Manufacture
App 20200006241 - Wu; Jiun Yi ; et al. | 2020-01-02 |
Protrusion bump pads for bond-on-trace processing
Grant 10,522,495 - Liang , et al. Dec | 2019-12-31 |
Semiconductor Packages and Method Forming Same
App 20190378809 - Chen; Chien-Hsun ; et al. | 2019-12-12 |
Integrated Circuit Package and Methods of Forming Same
App 20190341376 - Yu; Chen-Hua ; et al. | 2019-11-07 |
Semiconductor package structure and manufacturing method thereof
Grant 10,461,022 - Wu , et al. Oc | 2019-10-29 |
Electronics Card Including Multi-Chip Module
App 20190304959 - Yu; Chen-Hua ; et al. | 2019-10-03 |
Semiconductor Device and Method of Manufacture
App 20190295912 - Yu; Chen-Hua ; et al. | 2019-09-26 |
Integrated circuit package and methods of forming same
Grant 10,354,983 - Yu , et al. July 16, 2 | 2019-07-16 |
POP structures with dams encircling air gaps and methods for forming the same
Grant 10,319,655 - Yu , et al. | 2019-06-11 |
Package-on-package structure with organic interposer
Grant 10,319,607 - Wu , et al. | 2019-06-11 |
Protrusion Bump Pads for Bond-on-Trace Processing
App 20190122976 - Liang; Yu-Min ; et al. | 2019-04-25 |
Semiconductor Packages And Methods Of Forming Same
App 20190103353 - Liu; Chung-Shi ; et al. | 2019-04-04 |
Semiconductor Package Structure And Manufacturing Method Thereof
App 20190057932 - WU; JIUN-YI ; et al. | 2019-02-21 |
Protrusion bump pads for bond-on-trace processing
Grant 10,163,774 - Liang , et al. Dec | 2018-12-25 |
Semiconductor structure and method of manufacturing the same
Grant 10,163,768 - Wu , et al. Dec | 2018-12-25 |
Protrusion Bump Pads for Bond-on-Trace Processing
App 20180323163 - Liang; Yu-Min ; et al. | 2018-11-08 |
Contoured Package-on-Package Joint
App 20180261587 - Wu; Jiun Yi | 2018-09-13 |
Package on package devices and methods of packaging semiconductor dies
Grant 10,020,286 - Chen , et al. July 10, 2 | 2018-07-10 |
Protrusion bump pads for bond-on-trace processing
Grant 10,014,270 - Liang , et al. July 3, 2 | 2018-07-03 |
Contoured package-on-package joint
Grant 9,991,246 - Wu June 5, 2 | 2018-06-05 |
Package-On-Package with Cavity in Interposer
App 20180151549 - Wu; Jiun Yi | 2018-05-31 |
Package-on-package structure and methods for forming the same
Grant 9,985,013 - Lee , et al. May 29, 2 | 2018-05-29 |
Wafer Level Package Structure and Method of Forming Same
App 20180138089 - Yu; Chen-Hua ; et al. | 2018-05-17 |
Semiconductor device packages and methods
Grant 9,935,038 - Wang , et al. April 3, 2 | 2018-04-03 |
Interconnect Structure And Method Of Manufacturing The Same
App 20180027648 - WU; Jiun-Yi ; et al. | 2018-01-25 |
Wafer level package structure and method of forming same
Grant 9,870,946 - Yu , et al. January 16, 2 | 2018-01-16 |
Package on-package with cavity in interposer
Grant 9,865,580 - Wu January 9, 2 | 2018-01-09 |
Semiconductor Device Including Transmission Lines And Method Of Forming The Same
App 20170365906 - WU; Jiun Yi ; et al. | 2017-12-21 |
Semiconductor structure and method of fabricating the same
Grant 9,847,320 - Chen , et al. December 19, 2 | 2017-12-19 |
No-flow underfill for package with interposer frame
Grant 9,831,207 - Wu November 28, 2 | 2017-11-28 |
Semiconductor arrangement and formation thereof
Grant 9,812,416 - Wu , et al. November 7, 2 | 2017-11-07 |
Interconnect structure and method of manufacturing the same
Grant 9,807,867 - Wu , et al. October 31, 2 | 2017-10-31 |
Interposer Frame And Method Of Manufacturing The Same
App 20170294423 - Wu; Jiun Yi | 2017-10-12 |
Transmission line design and method, where high-k dielectric surrounds the transmission line for increased isolation
Grant 9,786,976 - Wu , et al. October 10, 2 | 2017-10-10 |
Rigid interconnect structures in package-on-package assemblies
Grant 9,768,105 - Lii , et al. September 19, 2 | 2017-09-19 |
Substrate design for semiconductor packages and method of forming same
Grant 9,768,090 - Liang , et al. September 19, 2 | 2017-09-19 |
Semiconductor Structure And Method Of Fabricating The Same
App 20170263588 - CHEN; CHIEN HSUN ; et al. | 2017-09-14 |
Integrated Circuit Package And Methods Of Forming Same
App 20170250170 - Yu; Chen-Hua ; et al. | 2017-08-31 |
Semiconductor Arrangement And Formation Thereof
App 20170243842 - WU; Jiun Yi ; et al. | 2017-08-24 |
POP Structures with Dams Encircling Air Gaps and Methods for Forming the Same
App 20170236763 - Yu; Chen-Hua ; et al. | 2017-08-17 |
Interconnect Structure And Method Of Manufacturing The Same
App 20170231083 - WU; Jiun-Yi ; et al. | 2017-08-10 |
Interposer frame and method of manufacturing the same
Grant 9,691,636 - Wu June 27, 2 | 2017-06-27 |
POP structures with dams encircling air gaps and methods for forming the same
Grant 9,659,918 - Yu , et al. May 23, 2 | 2017-05-23 |
Semiconductor structure including a substrate and a semiconductor chip with matching coefficients of thermal expansion
Grant 9,659,881 - Wu , et al. May 23, 2 | 2017-05-23 |
Integrated circuit package and methods of forming same
Grant 9,653,442 - Yu , et al. May 16, 2 | 2017-05-16 |
Semiconductor Structure And Method Of Manufacturing The Same
App 20170133306 - WU; JIUN YI ; et al. | 2017-05-11 |
Methods and apparatus for thinner package on package structures
Grant 9,646,922 - Wu May 9, 2 | 2017-05-09 |
Semiconductor arrangement and formation thereof
Grant 9,646,928 - Wu , et al. May 9, 2 | 2017-05-09 |
Copper bump joint structures with improved crack resistance
Grant 9,607,936 - Hsiao , et al. March 28, 2 | 2017-03-28 |
Semiconductor structure and method of manufacturing the same
Grant 9,589,924 - Wu , et al. March 7, 2 | 2017-03-07 |
Package on packaging structure and methods of making same
Grant 9,583,474 - Lin , et al. February 28, 2 | 2017-02-28 |
Protrusion Bump Pads for Bond-on-Trace Processing
App 20170018521 - Liang; Yu-Min ; et al. | 2017-01-19 |
Transmission Line Design And Method Of Forming The Same
App 20160380324 - WU; Jiun Yi ; et al. | 2016-12-29 |
Package-on-Package with via on pad connections
Grant 9,460,977 - Wu October 4, 2 | 2016-10-04 |
Protrusion bump pads for bond-on-trace processing
Grant 9,418,928 - Liang , et al. August 16, 2 | 2016-08-16 |
Contoured Package-on-Package Joint
App 20160197067 - Wu; Jiun Yi | 2016-07-07 |
Bump-on-trace methods and structures in packaging
Grant 9,385,097 - Wu July 5, 2 | 2016-07-05 |
POP Structures with Dams Encircling Air Gaps and Methods for Forming the Same
App 20160163683 - Yu; Chen-Hua ; et al. | 2016-06-09 |
Protrusion Bump Pads for Bond-on-Trace Processing
App 20160155697 - Liang; Yu-Min ; et al. | 2016-06-02 |
Pop joint through interposer
Grant 9,337,135 - Lii , et al. May 10, 2 | 2016-05-10 |
Pop Joint Through Interposer
App 20160104668 - Lii; Mirng-Ji ; et al. | 2016-04-14 |
Package-on-Package with Via on Pad Connections
App 20160099191 - Wu; Jiun Yi | 2016-04-07 |
Semiconductor Structure And Method Of Manufacturing The Same
App 20160086893 - WU; JIUN YI ; et al. | 2016-03-24 |
Contoured package-on-package joint
Grant 9,287,245 - Wu March 15, 2 | 2016-03-15 |
Semiconductor Structure And Method Of Manufacturing The Same
App 20160064315 - WU; JIUN YI ; et al. | 2016-03-03 |
Substrate contact opening
Grant 9,275,964 - Yu , et al. March 1, 2 | 2016-03-01 |
Protrusion bump pads for bond-on-trace processing
Grant 9,275,967 - Liang , et al. March 1, 2 | 2016-03-01 |
Package-on-package Structure With Organic Interposer
App 20160056087 - Wu; Jiun Yi ; et al. | 2016-02-25 |
POP structures with dams encircling air gaps and methods for forming the same
Grant 9,263,377 - Yu , et al. February 16, 2 | 2016-02-16 |
Package on Package Devices and Methods of Packaging Semiconductor Dies
App 20160035709 - Chen; Yung Ching ; et al. | 2016-02-04 |
Package-on-Package Structure and Methods for Forming the Same
App 20160013175 - Lee; Chien-Hsun ; et al. | 2016-01-14 |
Package-on-package with via on pad connections
Grant 9,214,450 - Wu December 15, 2 | 2015-12-15 |
Package-On-Package with Cavity in Interposer
App 20150348955 - Wu; Jiun Yi | 2015-12-03 |
Package on package devices and methods of packaging semiconductor dies
Grant 9,171,790 - Yu , et al. October 27, 2 | 2015-10-27 |
Package-on-package structure and methods for forming the same
Grant 9,165,876 - Lee , et al. October 20, 2 | 2015-10-20 |
Semiconductor Arrangement And Formation Thereof
App 20150262933 - Wu; Jiun Yi ; et al. | 2015-09-17 |
Methods and Apparatus for Thinner Package on Package Structures
App 20150235934 - Wu; Jiun Yi | 2015-08-20 |
Substrate Design for Semiconductor Packages and Method of Forming Same
App 20150235915 - Liang; Yu-Min ; et al. | 2015-08-20 |
Package on-package with cavity in interposer
Grant 9,111,930 - Wu August 18, 2 | 2015-08-18 |
Integrated Circuit Package and Methods of Forming Same
App 20150206865 - Yu; Chen-Hua ; et al. | 2015-07-23 |
Semiconductor Package and Methods of Forming Same
App 20150206866 - Yu; Chen-Hua ; et al. | 2015-07-23 |
Package on Packaging Structure and Methods of Making Same
App 20150200190 - Lin; Wen-Yi ; et al. | 2015-07-16 |
Bump-on-trace (BOT) structures and methods for forming the same
Grant 9,082,765 - Yu , et al. July 14, 2 | 2015-07-14 |
Protrusion Bump Pads for Bond-on-Trace Processing
App 20150194404 - Liang; Yu-Min ; et al. | 2015-07-09 |
Protrusion Bump Pads for Bond-on-Trace Processing
App 20150194405 - Liang; Yu-Min ; et al. | 2015-07-09 |
Wafer Level Package Structure And Method Of Forming Same
App 20150187743 - Yu; Chen-Hua ; et al. | 2015-07-02 |
Bump-on-Trace Methods and Structures in Packaging
App 20150130061 - Wu; Jiun Yi | 2015-05-14 |
No-flow Underfill For Package With Interposer Frame
App 20150123272 - WU; Jiun Yi | 2015-05-07 |
Method of making package with interposer frame
Grant 9,006,033 - Wu April 14, 2 | 2015-04-14 |
Extending metal traces in bump-on-trace structures
Grant 8,970,033 - Chen , et al. March 3, 2 | 2015-03-03 |
No-flow underfill for package with interposer frame
Grant 8,946,072 - Wu February 3, 2 | 2015-02-03 |
Package on packaging structure and methods of making same
Grant 8,946,888 - Lin , et al. February 3, 2 | 2015-02-03 |
Bump-on-trace methods and structures in packaging
Grant 8,945,984 - Wu February 3, 2 | 2015-02-03 |
Packaging structures and methods for semiconductor devices
Grant 8,847,369 - Yew , et al. September 30, 2 | 2014-09-30 |
Package-On-Package with Cavity in Interposer
App 20140264811 - Wu; Jiun Yi | 2014-09-18 |
Method Of Making Package With Interposer Frame
App 20140273355 - WU; Jiun Yi | 2014-09-18 |
Package-on-Package with Via on Pad Connections
App 20140264857 - Wu; Jiun Yi | 2014-09-18 |
Bump-on-Trace (BOT) Structures and Methods for Forming the Same
App 20140252596 - Yu; Chen-Hua ; et al. | 2014-09-11 |
Package-on-Package Structure and Methods for Forming the Same
App 20140252609 - Lee; Chien-Hsun ; et al. | 2014-09-11 |
Package on package devices and methods of packaging semiconductor dies
Grant 8,823,180 - Wang , et al. September 2, 2 | 2014-09-02 |
Bump-on-Trace Methods and Structures in Packaging
App 20140239505 - Wu; Jiun Yi | 2014-08-28 |
Package structures and methods for forming the same
Grant 8,803,323 - Yu , et al. August 12, 2 | 2014-08-12 |
Package with interposer frame and method of making the same
Grant 8,766,460 - Wu July 1, 2 | 2014-07-01 |
Substrate Contact Opening
App 20140170851 - Yu; Chen-Hua ; et al. | 2014-06-19 |
POP Structures with Air Gaps and Methods for Forming the Same
App 20140131894 - Yu; Chen-Hua ; et al. | 2014-05-15 |
Contoured Package-on-Package Joint
App 20140124937 - Wu; Jiun Yi | 2014-05-08 |
Substrate contact opening
Grant 8,698,306 - Yu , et al. April 15, 2 | 2014-04-15 |
Optical clock signal distribution using through-silicon vias
Grant 8,670,637 - Chang , et al. March 11, 2 | 2014-03-11 |
Package on Package Devices and Methods of Forming Same
App 20140042621 - Yu; Chen-Hua ; et al. | 2014-02-13 |
Package on package devices and methods of forming same
Grant 8,642,393 - Yu , et al. February 4, 2 | 2014-02-04 |
Packaging Structures and Methods for Semiconductor Devices
App 20140021594 - Yew; Ming-Chih ; et al. | 2014-01-23 |
Package on Package Devices and Methods of Packaging Semiconductor Dies
App 20140021605 - Yu; Chen-Hua ; et al. | 2014-01-23 |
Package Structures and Methods for Forming the Same
App 20140001644 - Yu; Chen-Hua ; et al. | 2014-01-02 |
Rigid Interconnect Structures in Package-on-Package Assemblies
App 20130277841 - Lii; Mirng-Ji ; et al. | 2013-10-24 |
Semiconductor Device Packages and Methods
App 20130270705 - Wang; Tsung-Ding ; et al. | 2013-10-17 |
Interposer Frame And Method Of Manufacturing The Same
App 20130200517 - WU; Jiun Yi | 2013-08-08 |
No-flow Underfill For Package With Interposer Frame
App 20130200513 - WU; Jiun Yi | 2013-08-08 |
Package With Interposer Frame And Method Of Making The Same
App 20130200512 - WU; Jiun Yi | 2013-08-08 |
Methods and Apparatus for Thinner Package on Package Structures
App 20130181359 - Wu; Jiun Yi | 2013-07-18 |
Package on Package Devices and Methods of Packaging Semiconductor Dies
App 20130168856 - Wang; Tsung-Ding ; et al. | 2013-07-04 |
Package on Packaging Structure and Methods of Making Same
App 20130082372 - Lin; Wen-Yi ; et al. | 2013-04-04 |
Extending Metal Traces in Bump-on-Trace Structures
App 20120217632 - Chen; Yu-Feng ; et al. | 2012-08-30 |
Centripetal Layout For Low Stress Chip Package
App 20120098120 - Yu; Chen-Hua ; et al. | 2012-04-26 |
Optical Clock Signal Distribution Using Through-Silicon Vias
App 20110299809 - Chang; Shih-Cheng ; et al. | 2011-12-08 |
Substrate Contact Opening
App 20110285012 - Yu; Chen-Hua ; et al. | 2011-11-24 |
Optical clock signal distribution using through-silicon vias
Grant 8,005,326 - Chang , et al. August 23, 2 | 2011-08-23 |
Copper Bump Joint Structures with Improved Crack Resistance
App 20110101526 - Hsiao; Ching-Wen ; et al. | 2011-05-05 |
Optical Clock Signal Distribution Using Through-Silicon Vias
App 20100008620 - Chang; Shih-Cheng ; et al. | 2010-01-14 |
Ambient light photodetector
App 20070194212 - Lin; Hao-Hsiung ; et al. | 2007-08-23 |
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