Wu; Jingshen

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wu; Jingshen.The latest application filed is for "composite molecular sieve membrane, preparation process and use thereof".

Company Profile

1.9.9

Wu; Jingshen - Shanghai CN
WU; JINGSHEN - HONG KONG CN
Wu; Jingshen - Guangzhou CN
Wu; Jingshen - Kowloon HK
Wu; Jingshen - Hongkong CN

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method, system and device for inputting text by consecutive slide Grant 10,725,656 - Zhang , et al.	2020-07-28
Composite Molecular Sieve Membrane, Preparation Process And Use Thereof App 20180008937 - HONG; MEI ; et al.	2018-01-11
System and method for processing sliding operations on portable terminal devices Grant 9,696,873 - Zhang , et al. July 4, 2	2017-07-04
Method, System And Device For Inputting Text By Consecutive Slide App 20160328147 - ZHANG; Kan ; et al.	2016-11-10
Nanoporous ceramic membrane and preparation method thereof Grant 9,452,377 - Wu , et al. September 27, 2	2016-09-27
Apparatus having an embedded 3D hybrid integration for optoelectronic interconnects Grant 9,057,853 - Lau , et al. June 16, 2	2015-06-16
Nanoporous Ceramic Membrane And Preparation Method Thereof App 20140131271 - WU; JINGSHEN ; et al.	2014-05-15
System And Method For Processing Sliding Operations On Portable Terminal Devices App 20140019912 - Zhang; Kan ; et al.	2014-01-16
Apparatus having thermal-enhanced and cost-effective 3D IC integration structure with through silicon via interposers Grant 8,604,603 - Lau , et al. December 10, 2	2013-12-10
Single solder ball impact tester Grant 7,810,374 - Zhang , et al. October 12, 2	2010-10-12
Apparatus having thermal-enhanced and cost-effective 3D IC integration structure with through silicon via interposers App 20100213600 - Lau; Hon Shing ; et al.	2010-08-26
Apparatus Having an Embedded 3D Hybrid Integration for Optoelectronic Interconnects App 20100215314 - Lau; Hon Shing ; et al.	2010-08-26
Single solder ball impact tester App 20090139303 - Zhang; Zheming ; et al.	2009-06-04
Nanocomposites and Process for their Production App 20080139729 - Wang; Ke ; et al.	2008-06-12
Polypropylene/calcium carbonate nanocomposites App 20030060547 - Chan, Chi-Ming ; et al.	2003-03-27

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