Wu; Jie-Shing
Patent Applications and Registrations
Patent applications and USPTO patent grants for Wu; Jie-Shing.The latest application filed is for "ion implant method for topographic feature corner rounding".
- Wu; Jie-Shing - Hsin-Chu TW
| Patent | Date |
|---|---|
| Ion implant method for topographic feature corner rounding Grant 6,806,163 - Wu , et al. October 19, 2 | 2004-10-19 |
| Ion implant method for topographic feature corner rounding App 20040005764 - Wu, Jie-Shing ; et al. | 2004-01-08 |
| Damage free passivation layer etching process Grant 6,001,538 - Chen , et al. December 14, 1 | 1999-12-14 |
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