WU; JIANN LIH
Patent Applications and Registrations
Patent applications and USPTO patent grants for WU; JIANN LIH.The latest application filed is for "wafer polishing head, system thereof, and method using the same".
- WU; JIANN LIH - HSIN-CHU CITY TW
- Wu; Jiann Lih - Hsin-Chu TW
- Wu; Jiann Lih - Hsinchu TW
- Wu; Jiann Lih - Hsinchu City TW
| Patent | Date |
|---|---|
| Wafer Polishing Head, System Thereof, And Method Using The Same App 20210220965 - HWANG; JAMES JENG-JYI ; et al. | 2021-07-22 |
| Device And Methods For Chemical Mechanical Polishing App 20210039223 - HWANG; JAMES JENG-JYI ; et al. | 2021-02-11 |
| Apparatus and methods for chemical mechanical polishing Grant 10,875,143 - Hwang , et al. December 29, 2 | 2020-12-29 |
| Apparatus And Methods For Chemical Mechanical Polishing App 20200039019 - HWANG; JAMES JENG-JYI ; et al. | 2020-02-06 |
| High throughput CMP platform Grant 10,513,006 - Wu , et al. Dec | 2019-12-24 |
| Multi-point chemical mechanical polishing end point detection system and method of using Grant 10,090,207 - Wu , et al. October 2, 2 | 2018-10-02 |
| Chemical mechanical polishing (CMP) platform for local profile control Grant 10,065,288 - Wu , et al. September 4, 2 | 2018-09-04 |
| Chemical Mechanical Polishing (cmp) Platform For Local Profile Control App 20150352686 - Wu; Jiann Lih ; et al. | 2015-12-10 |
| CMP pad cleaning apparatus Grant 9,138,861 - Wu , et al. September 22, 2 | 2015-09-22 |
| Wafer Particle Removal App 20150107619 - Wu; Jiann Lih ; et al. | 2015-04-23 |
| High Throughput Cmp Platform App 20140220863 - Wu; Jiann Lih ; et al. | 2014-08-07 |
| Method And Device For Cleaning A Brush Surface Having A Contamination App 20140196744 - WU; Jiann-Lih ; et al. | 2014-07-17 |
| Multi-point Chemical Mechanical Polishing End Point Detection System And Method Of Using App 20140148008 - WU; Jiann Lih ; et al. | 2014-05-29 |
| CMP Groove Depth and Conditioning Disk Monitoring App 20130217306 - Wu; Jiann Lih ; et al. | 2013-08-22 |
| Multiple Zone Temperature Control for CMP App 20130210173 - Wu; Jiann Lih ; et al. | 2013-08-15 |
| CMP Pad Cleaning Apparatus App 20130210323 - Wu; Jiann Lih ; et al. | 2013-08-15 |
| CMP apparatus polishing head with concentric pressure zones Grant 6,998,013 - Jan , et al. February 14, 2 | 2006-02-14 |
| CMP apparatus polishing head with concentric pressure zones App 20040069406 - Jan, Chin-Tsan ; et al. | 2004-04-15 |
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