Wu; Jiahn-Chang
Patent Applications and Registrations
Patent applications and USPTO patent grants for Wu; Jiahn-Chang.The latest application filed is for "processes for manufacturing an led package with top and bottom electrodes".
Company Profile
0.33.36
- Wu; Jiahn-Chang - Chutung TW
- Wu; Jiahn-Chang - Hsinchu TW
- Wu; Jiahn-Chang - Chu-Tung Hsinchu TW
- WU; Jiahn-Chang - Hsin-Chu TW
- Wu; Jiahn-Chang - Taiwan CN
- Wu; Jiahn-Chang - Chuntung TW
Patent Activity
| Patent | Date |
|---|---|
| Processes for manufacturing an LED package with top and bottom electrodes Grant 8,802,503 - Wu August 12, 2 | 2014-08-12 |
| Processes For Manufacturing An Led Package With Top And Bottom Electrodes App 20140193930 - Wu; Jiahn-Chang | 2014-07-10 |
| LED package with top and bottom electrodes Grant 8,710,540 - Wu April 29, 2 | 2014-04-29 |
| Processes For Manufacturing An Led Package With Top And Bottom Electrodes App 20140042483 - Wu; Jiahn-Chang | 2014-02-13 |
| Processes for manufacturing an LED package with top and bottom electrodes Grant 8,524,541 - Wu September 3, 2 | 2013-09-03 |
| Led Package With Top-bottom Electrode App 20120273835 - WU; Jiahn-Chang | 2012-11-01 |
| LED package with top and bottom electrodes Grant 8,247,835 - Wu August 21, 2 | 2012-08-21 |
| Light emitting diode package with coaxial leads Grant RE42,179 - Wu March 1, 2 | 2011-03-01 |
| Waterproof module for LED lamp Grant 7,887,229 - Wu February 15, 2 | 2011-02-15 |
| Led Package With Top-bottom Electrode App 20110012162 - WU; Jiahn-Chang | 2011-01-20 |
| Reflection lamp Grant 7,806,556 - Wu October 5, 2 | 2010-10-05 |
| Light unit display Grant 7,798,702 - Wu September 21, 2 | 2010-09-21 |
| Flexible lead surface-mount semiconductor package Grant 7,755,199 - Wu July 13, 2 | 2010-07-13 |
| Internal Circulation Mechanism For An Air-tight Led Lamp App 20100091486 - WU; Jiahn-Chang | 2010-04-15 |
| Swinging Lead Switch For An Electronic Device App 20090242365 - WU; Jiahn-Chang | 2009-10-01 |
| Lamp Chess Module App 20090230622 - WU; Jiahn-Chang | 2009-09-17 |
| Ballast for light emitting device Grant 7,586,247 - Wu September 8, 2 | 2009-09-08 |
| Reflection Lamp App 20090185386 - WU; Jiahn-Chang | 2009-07-23 |
| Backside accessible display Grant 7,556,400 - Wu July 7, 2 | 2009-07-07 |
| Lighting board using cassette light unit Grant 7,527,391 - Wu May 5, 2 | 2009-05-05 |
| Light unit with staggered electrodes Grant 7,518,306 - Wu April 14, 2 | 2009-04-14 |
| Waterproof Module For Led Lamp App 20090080201 - WU; Jiahn-Chang | 2009-03-26 |
| Supporting frame for surface-mount diode package Grant 7,466,015 - Wu December 16, 2 | 2008-12-16 |
| Matrix display using cassette light units Grant 7,445,355 - Wu November 4, 2 | 2008-11-04 |
| Submount for diode with single bottom electrode App 20080224169 - Wu; Jiahn-Chang | 2008-09-18 |
| Submount for diode with single bottom electrode Grant 7,397,133 - Wu July 8, 2 | 2008-07-08 |
| Light unit display App 20080037263 - Wu; Jiahn-Chang | 2008-02-14 |
| A Light Unit with Staggered Electrodes App 20070267964 - WU; Jiahn-Chang | 2007-11-22 |
| Light unit display Grant 7,284,896 - Wu October 23, 2 | 2007-10-23 |
| Light emitting diode package with coaxial leads Grant 7,276,741 - Wu October 2, 2 | 2007-10-02 |
| Backside Accessible Display App 20070215884 - WU; Jiahn-Chang | 2007-09-20 |
| Matrix Display Using Cassette Light Units App 20070195528 - WU; Jiahn-Chang | 2007-08-23 |
| Decoration Tree With Inserted Articles App 20070177402 - WU; Jiahn-Chang | 2007-08-02 |
| Light emitting diode package with coaxial leads App 20070170456 - Wu; Jiahn-Chang | 2007-07-26 |
| Decoration tree with inserted articles Grant 7,241,043 - Wu July 10, 2 | 2007-07-10 |
| Lighting Board Using Cassette Light Unit App 20070147047 - WU; Jiahn-Chang | 2007-06-28 |
| Supporting frame for surface-mount diode package App 20070096275 - Wu; Jiahn-Chang | 2007-05-03 |
| Coaxial LED lighting board App 20070096132 - Wu; Jiahn-Chang | 2007-05-03 |
| Light emitting diode package with coaxial leads Grant 7,205,579 - Wu April 17, 2 | 2007-04-17 |
| Supporting frame for surface-mount diode package Grant 7,193,303 - Wu March 20, 2 | 2007-03-20 |
| Solderless connection in LED module Grant 7,166,868 - Wu January 23, 2 | 2007-01-23 |
| Light emitting diode package with coaxial leads App 20070012942 - Wu; Jiahn-Chang | 2007-01-18 |
| Light unit display App 20060232966 - Wu; Jiahn-Chang | 2006-10-19 |
| Ballast for light emitting device App 20060232179 - Wu; Jiahn-Chang | 2006-10-19 |
| Supporting frame for surface-mount diode package Grant 7,095,101 - Wu August 22, 2 | 2006-08-22 |
| Replaceable light emitting diode module Grant 6,998,650 - Wu February 14, 2 | 2006-02-14 |
| Supporting frame for surface-mount diode package App 20050269679 - Wu, Jiahn-Chang | 2005-12-08 |
| Submount for diode with single bottom electrode App 20050258445 - Wu, Jiahn-Chang | 2005-11-24 |
| Lamp with metal grid radiator for heat dissipation App 20050200262 - Wu, Jiahn-Chang | 2005-09-15 |
| Solderless connection in LED module App 20050146028 - Wu, Jiahn-Chang | 2005-07-07 |
| Solderless connection in LED module Grant 6,911,731 - Wu June 28, 2 | 2005-06-28 |
| Projector with array LED matrix light source Grant 6,882,331 - Wu April 19, 2 | 2005-04-19 |
| Solderless connection in LED module App 20040227146 - Wu, Jiahn-Chang | 2004-11-18 |
| Projector with UV light source Grant 6,769,773 - Wu August 3, 2 | 2004-08-03 |
| Projection lamp with led matrix panel Grant 6,767,112 - Wu July 27, 2 | 2004-07-27 |
| LED matrix substrate with convection holes Grant 6,753,553 - Wu June 22, 2 | 2004-06-22 |
| LED matrix substrate with convection holes App 20030230752 - Wu, Jiahn_Chang | 2003-12-18 |
| Projection lamp with led matrix panel App 20030223236 - Wu, Jiahn-Chang | 2003-12-04 |
| Light emitting diode display having heat sinking circuit rails Grant 6,652,123 - Wu November 25, 2 | 2003-11-25 |
| Ventilated light emitting diode matrix panel Grant 6,650,048 - Wu November 18, 2 | 2003-11-18 |
| Projector with array LED matrix light source App 20030210213 - Wu, Jiahn-Chang | 2003-11-13 |
| Flexible lead surface-mount semiconductor package App 20030201542 - Wu, Jiahn-Chang | 2003-10-30 |
| Supporting frame for surface-mount diode package App 20030116838 - Wu, Jiahn-Chang | 2003-06-26 |
| Ventilated light emitting diode matrix panel App 20030076033 - Wu, Jiahn-Chang | 2003-04-24 |
| Package for semiconductor photoelectric device App 20030030065 - Wu, Jiahn-Chang | 2003-02-13 |
| Light Emitting Diode Display Having Heat Sinking Circuit Rails App 20020167807 - Wu, Jiahn-Chang | 2002-11-14 |
| Flexible lead surface-mount semiconductor package App 20020089064 - Wu, Jiahn-Chang | 2002-07-11 |
| Semiconductor matrix formation Grant 6,277,711 - Wu August 21, 2 | 2001-08-21 |
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