loadpatents
Patent applications and USPTO patent grants for WU; JIA-HONG.The latest application filed is for "heat dissipation device and server using same".
Patent | Date |
---|---|
Heat Dissipation Device And Server Using Same App 20210378142 - ZHANG; YA-NI ;   et al. | 2021-12-02 |
Electronic device and heat dissipating casing thereof Grant 9,717,162 - Wu , et al. July 25, 2 | 2017-07-25 |
Method And Apparatus For Data Deduplication In Cloud Based Storage System App 20170206218 - JAI; BEN-CHIAO ;   et al. | 2017-07-20 |
Method And Apparatus For Data Prefetch In Cloud Based Storage System App 20170208125 - JAI; BEN-CHIAO ;   et al. | 2017-07-20 |
Hybrid Cloud File System And Cloud Based Storage System Having Such File System Therein App 20170208052 - JAI; BEN-CHIAO ;   et al. | 2017-07-20 |
Heat pipe Grant 9,689,625 - Dai , et al. June 27, 2 | 2017-06-27 |
Electronic Device And Heat Dissipating Casing Thereof App 20160088762 - WU; JIA-HONG ;   et al. | 2016-03-24 |
Flat Heat Spreader And Method For Manufacturing The Same App 20140166245 - DAI; SHENG-LIANG ;   et al. | 2014-06-19 |
Flat Heat Pipe And Method For Manufacturing The Same App 20140166244 - DAI; SHENG-LIANG ;   et al. | 2014-06-19 |
Heat Pipe And Method For Manufacturing The Same App 20140166246 - DAI; SHENG-LIANG ;   et al. | 2014-06-19 |
Heat Pipe And Method For Manufacturing The Same App 20140150995 - DAI; SHENG-LIANG ;   et al. | 2014-06-05 |
Heat Pipe And Method For Manufactureing The Same App 20140060781 - JIA; ZHAO-HUI ;   et al. | 2014-03-06 |
Heat Pipe And Method For Making The Same App 20140054014 - DAI; SHENG-LIANG ;   et al. | 2014-02-27 |
Heat Pipe With Grid Wick Structure Having Rhombuses App 20130255921 - DAI; SHENG-LIANG ;   et al. | 2013-10-03 |
Heat Pipe With Composite Wick Structure App 20130160976 - WU; JIA-HONG ;   et al. | 2013-06-27 |
Heat Pipe App 20130014919 - DAI; SHENG-LIANG ;   et al. | 2013-01-17 |
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