Wu; Jeng-Da
Patent Applications and Registrations
Patent applications and USPTO patent grants for Wu; Jeng-Da.The latest application filed is for "housing of electronic device and speaker".
Company Profile
0.28.53
- Wu; Jeng-Da - New Taipei TW
- WU; JENG-DA - Tu-Cheng TW
- Wu; Jeng-Da - Taipei Hsien TW
- Wu; Jeng-Da - Kaohsiung TW
- Wu; Jeng-Da - Kaohsiung City TW
- Wu, Jeng-Da - Kaohsiung Hsien TW
Patent Activity
| Patent | Date |
|---|---|
| Housing of electronic device and speaker Grant 9,693,142 - Liu , et al. June 27, 2 | 2017-06-27 |
| Housing Of Electronic Device And Speaker App 20160309261 - LIU; FU-MING ; et al. | 2016-10-20 |
| Method And System For Modeling Current Transmission On Printed Circuit Board App 20140358501 - WU; JENG-DA ; et al. | 2014-12-04 |
| Display Device App 20140321078 - WU; JENG-DA ; et al. | 2014-10-30 |
| Method And System For Testing Direct Current Transmission Layout Of Printed Circuit Board App 20140289688 - LIN; Yu-Hsu ; et al. | 2014-09-25 |
| Circuit Board App 20120267148 - LIN; YU-HSU ; et al. | 2012-10-25 |
| Circuit board layout method Grant 8,256,111 - Lin , et al. September 4, 2 | 2012-09-04 |
| Motherboard Grant 8,154,879 - Chao , et al. April 10, 2 | 2012-04-10 |
| Chip package structure Grant 8,154,125 - Wu April 10, 2 | 2012-04-10 |
| Printed circuit board Grant 8,035,034 - Lin , et al. October 11, 2 | 2011-10-11 |
| Method and apparatus for compensating S-parameters of passive circuits Grant 7,996,169 - Lin , et al. August 9, 2 | 2011-08-09 |
| Heat Dissipating System App 20110188208 - WU; JENG-DA | 2011-08-04 |
| Circuit Board Assembly App 20110188219 - WU; JENG-DA | 2011-08-04 |
| Circuit Board Assembly App 20110164380 - WU; Jeng-Da ; et al. | 2011-07-07 |
| Printed circuit board Grant 7,973,244 - Lin , et al. July 5, 2 | 2011-07-05 |
| Heat dissipation apparatus Grant 7,929,304 - Cao , et al. April 19, 2 | 2011-04-19 |
| Circuit board assembly Grant 7,864,536 - Li , et al. January 4, 2 | 2011-01-04 |
| Computer enclosure with airflow guide Grant 7,835,149 - Li , et al. November 16, 2 | 2010-11-16 |
| Button assembly Grant 7,763,817 - Wu , et al. July 27, 2 | 2010-07-27 |
| Electronic apparatus with air guiding element Grant 7,760,498 - Shan , et al. July 20, 2 | 2010-07-20 |
| Circuit Board Assembly App 20100165579 - LI; QIN ; et al. | 2010-07-01 |
| Heat Dissipation Apparatus App 20100149749 - CAO; Liang-Liang ; et al. | 2010-06-17 |
| Heat Sink Assembly App 20100128442 - WU; ZHI-PING ; et al. | 2010-05-27 |
| Computer Enclosure With Airflow Guide App 20100097754 - LI; YANG ; et al. | 2010-04-22 |
| Circuit Board And Layout Method Thereof App 20100096170 - LIN; YU-HSU ; et al. | 2010-04-22 |
| Mounting apparatus for heat sink Grant 7,675,753 - Li , et al. March 9, 2 | 2010-03-09 |
| Circuit board with improved ground plane Grant 7,663,063 - Lin , et al. February 16, 2 | 2010-02-16 |
| Thermal Device For Heat Generating Source App 20100014244 - CAO; LIANG-LIANG ; et al. | 2010-01-21 |
| Heat Dissipating Device For Electronic Device App 20100002373 - GUO; LEI ; et al. | 2010-01-07 |
| Chip package structure Grant 7,633,169 - Wu December 15, 2 | 2009-12-15 |
| Objective lens actuator Grant 7,606,119 - Chao , et al. October 20, 2 | 2009-10-20 |
| Heat Sink Assembly App 20090213549 - GUO; LEI ; et al. | 2009-08-27 |
| Electronic Apparatus With Air Guiding Element App 20090190309 - SHAN; LIANG-QING ; et al. | 2009-07-30 |
| Printed Circuit Board App 20090188699 - Lin; Yu-Hsu ; et al. | 2009-07-30 |
| Mounting Apparatus For Heat Sink App 20090185351 - LI; YANG ; et al. | 2009-07-23 |
| Printed Circuit Board Assembly App 20090166062 - WU; ZHI-PING ; et al. | 2009-07-02 |
| Button Assembly App 20090166164 - WU; ZHI-PING ; et al. | 2009-07-02 |
| Printed Circuit Board Assembly App 20090168361 - CHAO; CHIH-HANG ; et al. | 2009-07-02 |
| Method And Apparatus For Compensating S-parameters Of Passive Circuits App 20090171604 - LIN; YU-HSU ; et al. | 2009-07-02 |
| Electronic Device With Airflow Guiding Duct App 20090168330 - LI; YANG ; et al. | 2009-07-02 |
| Circuit Board App 20090071698 - CHAO; CHIH-HANG ; et al. | 2009-03-19 |
| Chip packaging process Grant 7,482,204 - Kao , et al. January 27, 2 | 2009-01-27 |
| Motherboard App 20090016024 - CHAO; CHIH-HANG ; et al. | 2009-01-15 |
| Feeding mechanism for pickup head Grant 7,451,466 - Chao , et al. November 11, 2 | 2008-11-11 |
| Motherboard configured to minimize or prevent damage to a chip thereon Grant 7,447,039 - Chao , et al. November 4, 2 | 2008-11-04 |
| Bracket assembly for disk drive and a method of assembling a bracket to an enclosure for preventing resonance Grant 7,447,014 - Chao , et al. November 4, 2 | 2008-11-04 |
| Chip Package Structure App 20080247149 - Wu; Jeng-Da | 2008-10-09 |
| Printed Circuit Board App 20080186687 - LIN; YU-HSU ; et al. | 2008-08-07 |
| Process for fabricating chip package structure Grant 7,407,833 - Wu August 5, 2 | 2008-08-05 |
| Circuit Board With Improved Ground Plane App 20080151521 - LIN; YU-HSU ; et al. | 2008-06-26 |
| Chip Packaging Process App 20080096325 - Kao; Chin-Li ; et al. | 2008-04-24 |
| Heat sink assembly App 20080089031 - Wu; Jeng-Da ; et al. | 2008-04-17 |
| Motherboard App 20080089032 - Chao; Chih-Hang ; et al. | 2008-04-17 |
| Circuit board assembly App 20080088035 - Chao; Chih-Hang ; et al. | 2008-04-17 |
| Bracket Assembly For Disk Drive And A Method Of Assembling A Bracket To An Enclosure For Preventing Resonance App 20080074836 - CHAO; CHIH-HANG ; et al. | 2008-03-27 |
| Heat Sink App 20080073069 - WU; JENG-DA ; et al. | 2008-03-27 |
| Chip package structure and chip packaging process Grant 7,335,982 - Kao , et al. February 26, 2 | 2008-02-26 |
| Feeding mechanism for pickup head App 20070202712 - Chao; Chih-Hang ; et al. | 2007-08-30 |
| Blower App 20070140836 - CHAO; CHIH-HANG ; et al. | 2007-06-21 |
| Chip Package Structure And Process For Fabricating The Same App 20070132107 - Wu; Jeng-Da | 2007-06-14 |
| Blower App 20070128019 - CHAO; CHIH-HANG ; et al. | 2007-06-07 |
| Objective Lens Actuator App 20070076540 - CHAO; CHIH-HANG ; et al. | 2007-04-05 |
| Chip package structure and process for fabricating the same Grant 7,199,479 - Wu April 3, 2 | 2007-04-03 |
| Semiconductor package Grant 7,042,078 - Wu May 9, 2 | 2006-05-09 |
| Lead-free conductive jointing bump App 20050275098 - Wu, Jeng-Da | 2005-12-15 |
| Flip chip package with thermometer Grant 6,972,489 - Wu , et al. December 6, 2 | 2005-12-06 |
| Asymmetric bump structure App 20050263883 - Wang, Tong-Hong ; et al. | 2005-12-01 |
| Chip Package Structure And Process For Fabricating The Same App 20050236704 - Wu, Jeng-Da | 2005-10-27 |
| Carrier, Chip Package Structure, And Circuit Board Package Structure App 20050230828 - Wu, Jeng-Da | 2005-10-20 |
| Chip Package Structure And Chip Packaging Process App 20050224956 - Kao, Chin-Li ; et al. | 2005-10-13 |
| Chip Package Structure And Process For Fabricating The Same App 20050224969 - Wu, Jeng-Da | 2005-10-13 |
| Bump and fabricating process thereof App 20050200014 - Chen, William Tze-You ; et al. | 2005-09-15 |
| Under-bump-metallurgy layer for improving adhesion Grant 6,891,274 - Chen , et al. May 10, 2 | 2005-05-10 |
| Bump and fabricating process thereof Grant 6,864,168 - Chen , et al. March 8, 2 | 2005-03-08 |
| Under-ball-metallurgy layer Grant 6,819,002 - Chen , et al. November 16, 2 | 2004-11-16 |
| Semiconductor package App 20040212072 - Wu, Jeng Da | 2004-10-28 |
| Under-bump-metallurgy Layer For Improving Adhesion App 20040113273 - Chen, William Tze-You ; et al. | 2004-06-17 |
| [bump And Fabricating Process Thereof] App 20040113272 - CHEN, WILLIAM TZE-YOU ; et al. | 2004-06-17 |
| [under-ball-metallurgy Layer] App 20040104484 - Chen, William Tze-You ; et al. | 2004-06-03 |
| [solder Bump] App 20040065949 - Chen, William Tze-You ; et al. | 2004-04-08 |
| Flip chip package with thermometer App 20040032025 - Wu, Jeng Da ; et al. | 2004-02-19 |
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