Wu; J. Y.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Wu; J. Y..The latest application filed is for "high density plasma chemical vapor deposition process".

Company Profile

0.7.3

Wu; J. Y. - Hsin-Chu TW
Wu; J.Y. - Hsin-Chu City TW
Wu; J. Y. - Dou-Lio TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
High density plasma chemical vapor deposition process Grant 7,514,014 - Liu , et al. April 7, 2	2009-04-07
High density plasma chemical vapor deposition process App 20060099824 - Liu; Chih-Chien ; et al.	2006-05-11
High density plasma chemical vapor deposition process App 20050003671 - Liu, Chih-Chien ; et al.	2005-01-06
High density plasma chemical vapor deposition process App 20020030033 - Liu, Chih-Chien ; et al.	2002-03-14
Intermetal dielectric layer formation with low dielectric constant using high density plasma chemical vapor deposition process Grant 6,100,205 - Liu , et al. August 8, 2	2000-08-08
Multi-step high density plasma chemical vapor deposition process Grant 5,968,610 - Liu , et al. October 19, 1	1999-10-19
Stress released VLSI structure by the formation of porous intermetal layer Grant 5,517,062 - Lur , et al. May 14, 1	1996-05-14
Method of making stress released VLSI structure by the formation of porous intermetal layer Grant 5,393,709 - Lur , et al. February 28, 1	1995-02-28
Stress release metallization for VLSI circuits Grant 5,358,733 - Lur , et al. October 25, 1	1994-10-25
Salicide recessed local oxidation of silicon Grant 5,254,495 - Lur , et al. October 19, 1	1993-10-19

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